JPH01162234U - - Google Patents

Info

Publication number
JPH01162234U
JPH01162234U JP5521188U JP5521188U JPH01162234U JP H01162234 U JPH01162234 U JP H01162234U JP 5521188 U JP5521188 U JP 5521188U JP 5521188 U JP5521188 U JP 5521188U JP H01162234 U JPH01162234 U JP H01162234U
Authority
JP
Japan
Prior art keywords
heat treatment
semiconductor
heat
treatment apparatus
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5521188U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0614480Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988055211U priority Critical patent/JPH0614480Y2/ja
Publication of JPH01162234U publication Critical patent/JPH01162234U/ja
Application granted granted Critical
Publication of JPH0614480Y2 publication Critical patent/JPH0614480Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1988055211U 1988-04-26 1988-04-26 半導体熱処理装置 Expired - Lifetime JPH0614480Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988055211U JPH0614480Y2 (ja) 1988-04-26 1988-04-26 半導体熱処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988055211U JPH0614480Y2 (ja) 1988-04-26 1988-04-26 半導体熱処理装置

Publications (2)

Publication Number Publication Date
JPH01162234U true JPH01162234U (OSRAM) 1989-11-10
JPH0614480Y2 JPH0614480Y2 (ja) 1994-04-13

Family

ID=31281109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988055211U Expired - Lifetime JPH0614480Y2 (ja) 1988-04-26 1988-04-26 半導体熱処理装置

Country Status (1)

Country Link
JP (1) JPH0614480Y2 (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001031694A1 (fr) * 1999-10-28 2001-05-03 Applied Materials Inc. Appareil destine a la fabrication d'un dispositif a semiconducteur
JP2005150573A (ja) * 2003-11-19 2005-06-09 Kyocera Corp 不純物拡散装置
CN117083252A (zh) * 2021-04-07 2023-11-17 Ａｇｃ株式会社 二氧化硅玻璃部件及其制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022215663A1 (ja) * 2021-04-07 2022-10-13 Ａｇｃ株式会社 シリカガラス部材およびその製造方法

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434753A (en) * 1977-08-24 1979-03-14 Hitachi Ltd Thermal balancing jig
JPS5623741A (en) * 1979-08-06 1981-03-06 Toshiba Ceramics Co Ltd Quartz glass furnace core tube for manufacturing semiconductor
JPS5674923A (en) * 1979-11-22 1981-06-20 Oki Electric Ind Co Ltd Core tube device for furnace
JPS5748270U (OSRAM) * 1980-08-30 1982-03-18
JPS57162329A (en) * 1981-03-30 1982-10-06 Fujitsu Ltd Heat treatment of semiconductor substrate
JPS5810354U (ja) * 1981-07-15 1983-01-22 株式会社日立製作所 電界放射型陰極
JPS58148427A (ja) * 1982-10-20 1983-09-03 Toshiba Ceramics Co Ltd 半導体製造用石英ガラス製炉芯管
JPS6122454A (ja) * 1984-07-11 1986-01-31 Canon Inc 磁気光学記録媒体
JPS62123713A (ja) * 1985-11-25 1987-06-05 Hitachi Hokkai Semiconductor Ltd ウエハチヤ−ジ治具及びウエハ表面処理方法
JPS62259434A (ja) * 1986-04-14 1987-11-11 Shinetsu Sekiei Kk 石英ガラス製治具
JPS6317300A (ja) * 1986-07-08 1988-01-25 Shinetsu Sekiei Kk 石英ガラス製炉芯管
JPS6331530U (OSRAM) * 1986-08-14 1988-03-01
JPS6358822A (ja) * 1986-08-29 1988-03-14 Shinetsu Sekiei Kk 石英ガラス製ウエ−ハ搬送・保持用治具

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434753A (en) * 1977-08-24 1979-03-14 Hitachi Ltd Thermal balancing jig
JPS5623741A (en) * 1979-08-06 1981-03-06 Toshiba Ceramics Co Ltd Quartz glass furnace core tube for manufacturing semiconductor
JPS5674923A (en) * 1979-11-22 1981-06-20 Oki Electric Ind Co Ltd Core tube device for furnace
JPS5748270U (OSRAM) * 1980-08-30 1982-03-18
JPS57162329A (en) * 1981-03-30 1982-10-06 Fujitsu Ltd Heat treatment of semiconductor substrate
JPS5810354U (ja) * 1981-07-15 1983-01-22 株式会社日立製作所 電界放射型陰極
JPS58148427A (ja) * 1982-10-20 1983-09-03 Toshiba Ceramics Co Ltd 半導体製造用石英ガラス製炉芯管
JPS6122454A (ja) * 1984-07-11 1986-01-31 Canon Inc 磁気光学記録媒体
JPS62123713A (ja) * 1985-11-25 1987-06-05 Hitachi Hokkai Semiconductor Ltd ウエハチヤ−ジ治具及びウエハ表面処理方法
JPS62259434A (ja) * 1986-04-14 1987-11-11 Shinetsu Sekiei Kk 石英ガラス製治具
JPS6317300A (ja) * 1986-07-08 1988-01-25 Shinetsu Sekiei Kk 石英ガラス製炉芯管
JPS6331530U (OSRAM) * 1986-08-14 1988-03-01
JPS6358822A (ja) * 1986-08-29 1988-03-14 Shinetsu Sekiei Kk 石英ガラス製ウエ−ハ搬送・保持用治具

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001031694A1 (fr) * 1999-10-28 2001-05-03 Applied Materials Inc. Appareil destine a la fabrication d'un dispositif a semiconducteur
JP2005150573A (ja) * 2003-11-19 2005-06-09 Kyocera Corp 不純物拡散装置
CN117083252A (zh) * 2021-04-07 2023-11-17 Ａｇｃ株式会社 二氧化硅玻璃部件及其制造方法

Also Published As

Publication number Publication date
JPH0614480Y2 (ja) 1994-04-13

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