JPH01161341U - - Google Patents
Info
- Publication number
- JPH01161341U JPH01161341U JP5710488U JP5710488U JPH01161341U JP H01161341 U JPH01161341 U JP H01161341U JP 5710488 U JP5710488 U JP 5710488U JP 5710488 U JP5710488 U JP 5710488U JP H01161341 U JPH01161341 U JP H01161341U
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- emitter
- chip
- directly fixed
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
Landscapes
- Bipolar Transistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5710488U JPH01161341U (US07122547-20061017-C00273.png) | 1988-04-27 | 1988-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5710488U JPH01161341U (US07122547-20061017-C00273.png) | 1988-04-27 | 1988-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01161341U true JPH01161341U (US07122547-20061017-C00273.png) | 1989-11-09 |
Family
ID=31282959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5710488U Pending JPH01161341U (US07122547-20061017-C00273.png) | 1988-04-27 | 1988-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01161341U (US07122547-20061017-C00273.png) |
-
1988
- 1988-04-27 JP JP5710488U patent/JPH01161341U/ja active Pending
