JPH01160898U - - Google Patents

Info

Publication number
JPH01160898U
JPH01160898U JP4844588U JP4844588U JPH01160898U JP H01160898 U JPH01160898 U JP H01160898U JP 4844588 U JP4844588 U JP 4844588U JP 4844588 U JP4844588 U JP 4844588U JP H01160898 U JPH01160898 U JP H01160898U
Authority
JP
Japan
Prior art keywords
insulating layer
insulating
wiring board
printed wiring
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4844588U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4844588U priority Critical patent/JPH01160898U/ja
Publication of JPH01160898U publication Critical patent/JPH01160898U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】
第１図は本考案の断面図、第２図は従来の断面
図である。 図面において、１１…絶縁基板、１３…スルー
ホール、１４…導電回路、１５…ランド部、１６
…第１絶縁層、１７…第２絶縁層、１８…シール
ド層。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 絶縁基板上の導電回路を覆い絶縁層を形成
    し、この絶縁層を覆うシールド導電層を形成した
    印刷配線板であつて、この絶縁層が硬化系の異な
    る２層の絶縁層からなることを特徴とする印刷配
    線板。 (2) ２層の絶縁層が紫外線硬化型レジンで形成
    された第１の絶縁層と熱硬化型レジンで形成され
    た第２の絶縁層である請求項１記載の印刷配線板
    。
JP4844588U 1988-04-11 1988-04-11 Pending JPH01160898U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4844588U JPH01160898U (ja) 1988-04-11 1988-04-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4844588U JPH01160898U (ja) 1988-04-11 1988-04-11

Publications (1)

Publication Number Publication Date
JPH01160898U true JPH01160898U (ja) 1989-11-08

Family

ID=31274595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4844588U Pending JPH01160898U (ja) 1988-04-11 1988-04-11

Country Status (1)

Country Link
JP (1) JPH01160898U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013038235A (ja) * 2011-08-08 2013-02-21 Kaneka Corp 新規な導電層一体型フレキシブルプリント基板
JP2014102524A (ja) * 2014-02-13 2014-06-05 Taiyo Holdings Co Ltd ソルダーレジスト層及びプリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013038235A (ja) * 2011-08-08 2013-02-21 Kaneka Corp 新規な導電層一体型フレキシブルプリント基板
JP2014102524A (ja) * 2014-02-13 2014-06-05 Taiyo Holdings Co Ltd ソルダーレジスト層及びプリント配線板

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