JPH01157425U - - Google Patents
Info
- Publication number
- JPH01157425U JPH01157425U JP1988046902U JP4690288U JPH01157425U JP H01157425 U JPH01157425 U JP H01157425U JP 1988046902 U JP1988046902 U JP 1988046902U JP 4690288 U JP4690288 U JP 4690288U JP H01157425 U JPH01157425 U JP H01157425U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- lead
- semiconductor unit
- metal foil
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988046902U JPH064581Y2 (ja) | 1988-04-08 | 1988-04-08 | 半導体ユニットの連結構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988046902U JPH064581Y2 (ja) | 1988-04-08 | 1988-04-08 | 半導体ユニットの連結構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01157425U true JPH01157425U (enExample) | 1989-10-30 |
| JPH064581Y2 JPH064581Y2 (ja) | 1994-02-02 |
Family
ID=33446699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988046902U Expired - Lifetime JPH064581Y2 (ja) | 1988-04-08 | 1988-04-08 | 半導体ユニットの連結構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064581Y2 (enExample) |
-
1988
- 1988-04-08 JP JP1988046902U patent/JPH064581Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH064581Y2 (ja) | 1994-02-02 |