JPH0284347U - - Google Patents
Info
- Publication number
- JPH0284347U JPH0284347U JP1988164104U JP16410488U JPH0284347U JP H0284347 U JPH0284347 U JP H0284347U JP 1988164104 U JP1988164104 U JP 1988164104U JP 16410488 U JP16410488 U JP 16410488U JP H0284347 U JPH0284347 U JP H0284347U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- bump
- printed board
- bumps
- superimposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/754—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988164104U JPH0719165Y2 (ja) | 1988-12-19 | 1988-12-19 | マルチチップ構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988164104U JPH0719165Y2 (ja) | 1988-12-19 | 1988-12-19 | マルチチップ構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0284347U true JPH0284347U (enExample) | 1990-06-29 |
| JPH0719165Y2 JPH0719165Y2 (ja) | 1995-05-01 |
Family
ID=31449420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988164104U Expired - Lifetime JPH0719165Y2 (ja) | 1988-12-19 | 1988-12-19 | マルチチップ構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719165Y2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013110442A (ja) * | 2013-03-11 | 2013-06-06 | Fujitsu Semiconductor Ltd | 半導体装置の製造方法 |
| US8748229B2 (en) | 2008-06-11 | 2014-06-10 | Fujitsu Semiconductor Limited | Manufacturing method including deformation of supporting board to accommodate semiconductor device |
-
1988
- 1988-12-19 JP JP1988164104U patent/JPH0719165Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8748229B2 (en) | 2008-06-11 | 2014-06-10 | Fujitsu Semiconductor Limited | Manufacturing method including deformation of supporting board to accommodate semiconductor device |
| JP2013110442A (ja) * | 2013-03-11 | 2013-06-06 | Fujitsu Semiconductor Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719165Y2 (ja) | 1995-05-01 |