JPH01156554U - - Google Patents

Info

Publication number
JPH01156554U
JPH01156554U JP1988052361U JP5236188U JPH01156554U JP H01156554 U JPH01156554 U JP H01156554U JP 1988052361 U JP1988052361 U JP 1988052361U JP 5236188 U JP5236188 U JP 5236188U JP H01156554 U JPH01156554 U JP H01156554U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
depression
semiconductor
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988052361U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988052361U priority Critical patent/JPH01156554U/ja
Publication of JPH01156554U publication Critical patent/JPH01156554U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1988052361U 1988-04-19 1988-04-19 Pending JPH01156554U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988052361U JPH01156554U (enExample) 1988-04-19 1988-04-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988052361U JPH01156554U (enExample) 1988-04-19 1988-04-19

Publications (1)

Publication Number Publication Date
JPH01156554U true JPH01156554U (enExample) 1989-10-27

Family

ID=31278362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988052361U Pending JPH01156554U (enExample) 1988-04-19 1988-04-19

Country Status (1)

Country Link
JP (1) JPH01156554U (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137376A (en) * 1975-05-22 1976-11-27 Mitsubishi Electric Corp Manufacturing method for plastic seal type semi conductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137376A (en) * 1975-05-22 1976-11-27 Mitsubishi Electric Corp Manufacturing method for plastic seal type semi conductor

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