JPH01156551U - - Google Patents
Info
- Publication number
- JPH01156551U JPH01156551U JP1988052365U JP5236588U JPH01156551U JP H01156551 U JPH01156551 U JP H01156551U JP 1988052365 U JP1988052365 U JP 1988052365U JP 5236588 U JP5236588 U JP 5236588U JP H01156551 U JPH01156551 U JP H01156551U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor device
- semiconductor
- electrodes
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988052365U JPH01156551U (enExample) | 1988-04-19 | 1988-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988052365U JPH01156551U (enExample) | 1988-04-19 | 1988-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01156551U true JPH01156551U (enExample) | 1989-10-27 |
Family
ID=31278366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988052365U Pending JPH01156551U (enExample) | 1988-04-19 | 1988-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01156551U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5441666A (en) * | 1977-09-09 | 1979-04-03 | Hitachi Ltd | Semiconductor integrated circuit element |
-
1988
- 1988-04-19 JP JP1988052365U patent/JPH01156551U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5441666A (en) * | 1977-09-09 | 1979-04-03 | Hitachi Ltd | Semiconductor integrated circuit element |