JPS62134239U - - Google Patents
Info
- Publication number
- JPS62134239U JPS62134239U JP1986021747U JP2174786U JPS62134239U JP S62134239 U JPS62134239 U JP S62134239U JP 1986021747 U JP1986021747 U JP 1986021747U JP 2174786 U JP2174786 U JP 2174786U JP S62134239 U JPS62134239 U JP S62134239U
- Authority
- JP
- Japan
- Prior art keywords
- metal pad
- case
- semiconductor device
- bonding wire
- crimping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/01551—
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- H10W72/07511—
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- H10W72/07551—
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- H10W72/07553—
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- H10W72/50—
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- H10W72/531—
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- H10W72/536—
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- H10W72/59—
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- H10W72/983—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986021747U JPS62134239U (enExample) | 1986-02-17 | 1986-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986021747U JPS62134239U (enExample) | 1986-02-17 | 1986-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62134239U true JPS62134239U (enExample) | 1987-08-24 |
Family
ID=30818472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986021747U Pending JPS62134239U (enExample) | 1986-02-17 | 1986-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62134239U (enExample) |
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1986
- 1986-02-17 JP JP1986021747U patent/JPS62134239U/ja active Pending