JPH01153669U - - Google Patents
Info
- Publication number
- JPH01153669U JPH01153669U JP4580788U JP4580788U JPH01153669U JP H01153669 U JPH01153669 U JP H01153669U JP 4580788 U JP4580788 U JP 4580788U JP 4580788 U JP4580788 U JP 4580788U JP H01153669 U JPH01153669 U JP H01153669U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- chip parts
- square chip
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の斜視図、第２図は第１図に角
チツプ部品を搭載した図、第３図は第２図のＡ―
Ａ方向断面図、第４図は従来方法の断面図である
。 １，１′，１″……凹み、２……プリント基板
、３，３′，３″……角チツプ部品、４，４′，
４″，４……接続パターン、５，５′……はん
だ。
チツプ部品を搭載した図、第３図は第２図のＡ―
Ａ方向断面図、第４図は従来方法の断面図である
。 １，１′，１″……凹み、２……プリント基板
、３，３′，３″……角チツプ部品、４，４′，
４″，４……接続パターン、５，５′……はん
だ。
Claims (1)
- プリント基板の角チツプ部品搭載位置に凹みを
付け、搭載時の位置決めを容易とした角チツプ部
品の搭載、はんだ付け装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4580788U JPH01153669U (ja) | 1988-04-04 | 1988-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4580788U JPH01153669U (ja) | 1988-04-04 | 1988-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01153669U true JPH01153669U (ja) | 1989-10-23 |
Family
ID=31272104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4580788U Pending JPH01153669U (ja) | 1988-04-04 | 1988-04-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01153669U (ja) |
-
1988
- 1988-04-04 JP JP4580788U patent/JPH01153669U/ja active Pending