JPH0115363B2 - - Google Patents
Info
- Publication number
- JPH0115363B2 JPH0115363B2 JP3264080A JP3264080A JPH0115363B2 JP H0115363 B2 JPH0115363 B2 JP H0115363B2 JP 3264080 A JP3264080 A JP 3264080A JP 3264080 A JP3264080 A JP 3264080A JP H0115363 B2 JPH0115363 B2 JP H0115363B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- single crystal
- crystal member
- processing tool
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 claims description 71
- 239000013078 crystal Substances 0.000 claims description 66
- 238000012545 processing Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 15
- 238000012360 testing method Methods 0.000 claims description 11
- 238000003776 cleavage reaction Methods 0.000 claims description 6
- 230000007017 scission Effects 0.000 claims description 6
- 238000003754 machining Methods 0.000 description 6
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3264080A JPS56129114A (en) | 1980-03-17 | 1980-03-17 | Method of cutting monocrystal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3264080A JPS56129114A (en) | 1980-03-17 | 1980-03-17 | Method of cutting monocrystal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56129114A JPS56129114A (en) | 1981-10-09 |
| JPH0115363B2 true JPH0115363B2 (enrdf_load_html_response) | 1989-03-16 |
Family
ID=12364441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3264080A Granted JPS56129114A (en) | 1980-03-17 | 1980-03-17 | Method of cutting monocrystal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56129114A (enrdf_load_html_response) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0761647B2 (ja) * | 1985-06-11 | 1995-07-05 | 日立電線株式会社 | 半導体結晶インゴットのスライス方法 |
| JPH0635107B2 (ja) * | 1987-12-26 | 1994-05-11 | 株式会社タカトリハイテック | ワイヤソー |
| JP3397968B2 (ja) * | 1996-03-29 | 2003-04-21 | 信越半導体株式会社 | 半導体単結晶インゴットのスライス方法 |
| DE10052154A1 (de) * | 2000-10-20 | 2002-05-08 | Freiberger Compound Mat Gmbh | Verfahren und Vorrichtung zum Trennen von Einkristallen, Justiervorrichtung und Testverfahren zum Ermitteln einer Orientierung eines Einkristalls für ein derartiges Verfahren |
-
1980
- 1980-03-17 JP JP3264080A patent/JPS56129114A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56129114A (en) | 1981-10-09 |
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