JPH01151204A - Manufacture of square-shaped chip fixed resistance - Google Patents

Abstract

PURPOSE:To enhance resistance to an impulsive force from a position-regulating claw by a method wherein a first layer is formed to be an independent shape which covers a resistor and which is not formed on a slit and a protective glass sheet covering a first-layer glass sheet so as to be continuous on the slit is formed as a second layer. CONSTITUTION:After a resistance-value correction process D1, a process E1 to print a first-layer black glass sheet 5 of an independent pattern which covers a resistor 4 and which is not formed on a slit 2 is executed; then, a resistor printing and baking process E'1 to print and bake a second-layer colorless transparent glass sheet 5' by using a continuous pattern to be formed on the slit 2 from the upper part is executed. After that, a first-stage substrate-dividing process F1 to divide a substrate 1 at a first stage is executed; an end-face electrode printing and baking process G1 to form an end-face electrode 6 at an end-face part of a divided substrate 1' is executed; a second-stage substrate dividing process H1 to divide the substrate into individual products 7 at a second stage is executed. By this setup, it is possible to make a film thickness of the glass sheet 5' at the upper part of the slit 2 thin; the second-layer glass sheet 5' is rounded by the independent first-layer glass sheet 5. By this setup, it is possible to prevent a deformation, a burr, a brokenoff part or the like from being produced.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a rectangular chip fixed resistor (hereinafter abbreviated as a chip resistor) commonly used in electronic circuits and the like.

Conventional Technology First, the conventional manufacturing process will be explained with reference to FIG. 3. A process step 2 is started in which a heat-resistant insulating substrate (hereinafter referred to as a substrate) 11 such as a high-purity alumina substrate is inserted into a substrate holder. Here, the substrate 11 is provided with a slit 12 to facilitate division. Next, a chemically stable conductive agent is printed and fired to form the electrode 13 on the surface of the substrate 11 in order to connect the resistor 14 to be described later. In order to form the resistor 14 so that the resistor 14 is partially overlapped, a resistor printing and firing step C2 is performed in which a resistor material is printed and fired, and then a resistance value correction step D2 is performed to make the characteristics of the resistor 14 uniform. be done. Subsequently, through a glass printing and baking step E2 for covering and protecting the resistor 14 with a glass film 16,
The substrate 11 is divided along the horizontal slits 12, and a primary substrate dividing step F2, which is a preparatory step for forming end face electrodes to be described later, is carried out. Then, a final end-face electrode printing and firing step G2 is performed to form end-face electrodes 16 on the end faces of the divided substrate 11' obtained by dividing the primary substrate, and then the divided board 11' is inserted into the vertical slits 12. Secondary board dividing step H of dividing into individual products 17 along
2 will be performed. Furthermore, the electrode 13 and the end surface electrode 1
6, electrode plating 12 is performed to form a plating film 18 to prevent soldering and to maintain reliability of soldering, and the finished product is then subjected to various check processes such as external appearance and electrical characteristics J2. Products that pass this process are sent to the market as good products.

Problems to be Solved by the Invention As mentioned above, in the conventional construction method, chip resistors are manufactured as individual products17.
In the secondary substrate dividing process H2, the resistor protective glass is continuous and is also formed over the slit, so the slit for dividing is blocked, which affects how the impact is transmitted during dividing. In some cases, irregular shapes, cracks, and chips may occur on the glass edge, damaging the appearance of the product. When mounting, the positioning claws of the mounter may hit the irregular shapes and chips on the glass edge, chipping the glass, and causing problems after installation. This caused poor appearance and poor resistance values.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for manufacturing a chip resistor that improves impact resistance against impact force from positioning claws and prevents glass chipping.

Means for Solving the Problems In order to achieve the above-mentioned object, the present invention has a first layer in which the resistor is 1i long and has an independent shape that is not formed on the slit, and a second layer in which the glass of the first layer is formed. It is characterized in that the protective glass of the chip resistor is formed as a continuous shape formed over the cover and slit.

By making the first layer of the working resistor protective glass cover the resistor and having an independent shape that is not formed on the slit, and making the second layer cover the first layer of glass and have a continuous shape that is formed on the slit. , the thickness of the glass above the slit was reduced to 2
As a result, the splitting performance in secondary splitting is improved, and the splitting irregularity and
It becomes possible to prevent the occurrence of cracks and chips.

Since the second layer of glass is still rounded by the independent first layer of glass, the impact resistance against the impact from the mounter's suction nozzle and positioning claw is improved, contributing to the prevention of glass breakage during mounting. becomes possible.

EXAMPLE Next, the present invention will be explained with reference to the drawings. Explaining according to FIG. 1, the process begins with a receiving step A1 in which a slit 2 is formed on one surface of a substrate such as a high-purity alumina substrate, and then a resistor 4, which will be described later, is connected to the surface of the substrate 1. After an electrode printing step B1 in which a conductive agent is printed and fired to form an electrode 3, a final resistor printing and firing step C1 is performed to form a resistor 4, and then a resistance value is determined to match the characteristics of the resistor 4. A correction process DI is performed.

Next, a step Z1 of printing a first layer of black glass 6 covering the resistor 4 and having an independent pattern that is not formed on the slit 2 is carried out, and from above, the slit 2 is printed.
A resistor printing and firing step E' in which a second layer of colorless transparent glass 5' is printed and fired in a continuous pattern formed on the top.
1. After that, a primary substrate dividing step F1 is carried out to primarily divide the substrate 1, and the divided substrate 1 is
An end face electrode printing and baking step G1 for forming end face electrodes 6 is performed on the end face portions of . Furthermore, the above electrode 3
Then, an electrode plating process 1 is carried out to form a plating film 8 on the end electrode 6 to prevent it from being bent by soldering and to maintain the reliability of soldering, resulting in a finished product.
Products that are found to be of good quality after passing through various check processes J1 are sent to the market.

FIGS. 2a and bH show the chip resistor obtained in this example, and the end portions of the glass 6' also have a rounded shape due to the glass 6 below.

Effects of the Invention As described above, according to the present invention, the following effects can be obtained.

(1) In the manufacturing process, the dividing process of dividing into individual chips eliminates the occurrence of irregular shapes, cracks, chips, etc., and the product dimensions can be stabilized.

(2) The corners are rounded to prevent the glass from chipping due to the mounter.

(3) Even if the resistor is not covered due to printing misalignment on the first layer glass, it is completely protected by the second layer glass, so the conventional product characteristics can be maintained, and it is completely protected from the plating liquid in the subsequent process. It is.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing the manufacturing process according to an embodiment of the present invention, FIGS. 2a and 2b are perspective views and cross-sectional views of a chip resistor manufactured by the manufacturing method of the present invention, The figure is an explanatory diagram showing a conventional manufacturing process. 1...Insulating substrate, 2...Slit, 3...
...Electrode, 4...Resistor, 6...
glass. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 3

Claims (1)

[Claims] a step of forming an electrode on the surface of a heat-resistant insulating substrate having a dividing slit, a step of forming a resistor so as to partially overlap the electrode, and a step of covering the resistor and not forming it on the slit. A step of forming a first glass portion for protecting the resistor and a second glass portion for covering the first glass portion and forming a slit for protecting the resistor, and a step of dividing the insulating substrate at the slit. A method for manufacturing a square chip fixed resistor, characterized by comprising: