JPH01147087A - Pretreatment of copper-tungsten alloy before plating - Google Patents
Pretreatment of copper-tungsten alloy before platingInfo
- Publication number
- JPH01147087A JPH01147087A JP30513887A JP30513887A JPH01147087A JP H01147087 A JPH01147087 A JP H01147087A JP 30513887 A JP30513887 A JP 30513887A JP 30513887 A JP30513887 A JP 30513887A JP H01147087 A JPH01147087 A JP H01147087A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- alloy
- copper
- tungsten alloy
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 40
- 229910001080 W alloy Inorganic materials 0.000 title claims abstract description 33
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 title claims description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 239000000956 alloy Substances 0.000 abstract description 18
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 229910045601 alloy Inorganic materials 0.000 abstract 4
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 description 7
- 238000005219 brazing Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は銅タングステン合金のめっき前処理方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for pre-plating a copper-tungsten alloy.
銅タングステン合金は、高い熱伝導性、鉄ニツケル合金
相当の低熱膨張特性、良導電性等の優れた材料特性によ
り、半導体搭載ステムのヒートシンク材として、又、放
電加工用電極材や抵抗溶接電極材として広く使用されて
いる。しかし、このような優れた材料特性を有する半面
、高価な材料であるため他金属等とろう付したり機械的
に結合したりして部分的に使用されている。特に、半導
体搭載ステムなどのヒートシンク材としてろう付接合に
て使用する場合、銅タングステン合金は不動態相当の強
固な酸化膜（スケール）があるため、ろうのぬれ性が著
しく悪く、通常の還元雰囲気（露点が一３０℃前後程度
）ではろう付が不可能である。又、ろう付性の悪い材料
は一般にめっきを施しその後ろう付を行うが、銅タング
ステン合金はめっきの密着性そのものが著しく悪く、め
っき工事を行うこと自体が難しかった。Copper-tungsten alloy has excellent material properties such as high thermal conductivity, low thermal expansion characteristics equivalent to iron-nickel alloy, and good electrical conductivity, so it is used as a heat sink material for semiconductor mounting stems, as well as electrode material for electrical discharge machining and resistance welding electrode material. It is widely used as However, although it has such excellent material properties, it is an expensive material, so it is partially used by brazing or mechanically bonding with other metals. In particular, when used in brazing as a heat sink material for semiconductor mounting stems, etc., copper-tungsten alloy has a strong oxide film (scale) equivalent to passivity, so the wettability of the solder is extremely poor, and it is difficult to use in a normal reducing atmosphere. (The dew point is around 130 degrees Celsius), making brazing impossible. Furthermore, materials with poor brazing properties are generally plated and then brazed, but copper-tungsten alloys have extremely poor plating adhesion, making it difficult to perform plating work.
第３図に、銅タングステン合金材に直接通常のめっきを
施したときのめっきが密着していない代表的な形態を示
す。FIG. 3 shows a typical form in which the plating does not adhere when ordinary plating is directly applied to a copper-tungsten alloy material.
上述したように、銅タングステン合金はめつき工事を行
うことが難しい。As mentioned above, it is difficult to perform copper-tungsten alloy plating work.
本発明の目的は、良好なめっきの密着性が得られる銅タ
ングステン合金のめつき前処理方法を提供することにあ
る。An object of the present invention is to provide a method for pre-plating a copper-tungsten alloy, which provides good plating adhesion.
本発明の銅タングステン合金のめつき前処理方法は、銅
タングステン合金を還元雰囲気炉中又は真空炉中で９０
０℃以上１０００℃以下に１０分以上保持する第１の熱
処理工程と、この第１の熱処理工程の後前記銅タングス
テン合金に１ミクロン以下のニッケルめっき又は銅めっ
きを施すめっき工程と、このめっき工程の後前記銅タン
グステン合金を無酸化雰囲気炉中で８００℃以上１００
０℃以下に１０分以上保持する第２の熱処理工程とを含
んでいる。The method for pre-plating a copper-tungsten alloy of the present invention is to prepare a copper-tungsten alloy in a reducing atmosphere furnace or a vacuum furnace at 90%
a first heat treatment step of holding the temperature at 0° C. or higher and 1000° C. or lower for 10 minutes or more, a plating step of applying nickel plating or copper plating of 1 micron or less to the copper-tungsten alloy after this first heat treatment step, and this plating step. After that, the copper-tungsten alloy was heated at 800°C or higher for 100°C in a non-oxidizing atmosphere furnace.
and a second heat treatment step of maintaining the temperature at 0° C. or lower for 10 minutes or more.
〔実施例〕 次に、本発明について図面を参照して説明する。〔Example〕 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を説明するための工程順に示
した銅タングステン合金材の部分断面図である。FIG. 1 is a partial sectional view of a copper-tungsten alloy material shown in the order of steps for explaining one embodiment of the present invention.
まず、強固なスケール２に被われた銅タングステン合金
材１（第１図（ａ））を還元雰囲気炉中（又は真空炉中
）で１０分以上９００°Ｃ〜１０００℃で還元用熱処理
してスケールを除去し、クリーンな素材面にする（第１
図（ｂ））。First, the copper-tungsten alloy material 1 (Fig. 1 (a)) covered with the strong scale 2 is heat treated for reduction at 900°C to 1000°C for 10 minutes or more in a reducing atmosphere furnace (or vacuum furnace). Remove scale and make the material surface clean (first step)
Figure (b)).
次に、銅タングステン合金材１の表面の酸化を防ぐため
、上記の熱処理后速やかに１ミクロン以下の膜厚ｔのニ
ッケルめつき３く又は銅めっき）を行う（第１図（Ｃ）
）。Next, in order to prevent oxidation of the surface of the copper-tungsten alloy material 1, immediately after the above heat treatment, nickel plating or copper plating with a film thickness of 1 micron or less is performed (Fig. 1 (C)).
).
更に、ニッケル（又は銅）めつき３と銅タングステン合
金材１そのものとを強固に密着させるため、無酸化雰囲
気炉中で１０分以上８００〜１０００℃の拡散熱処理を
施し、拡散層４をつくる（第１図（ｄ））。Furthermore, in order to firmly adhere the nickel (or copper) plating 3 and the copper-tungsten alloy material 1 itself, a diffusion heat treatment is performed at 800 to 1000°C for 10 minutes or more in a non-oxidizing atmosphere furnace to form a diffusion layer 4 ( Figure 1(d)).
以上の各工程でめっき前処理を行えば、その後の普通の
めっき５（第２図）は、めっき性の優れた金属に対して
と同等の容易さで行うことができ、かつ、その密着強度
も大きく安定している。また、上記の２度の熱処理は、
温度設定範囲の厳密な管理は必要なく、通常のコンベア
炉、バッチ炉等で容易に行える。If the pre-plating treatment is performed in each of the above steps, the subsequent ordinary plating 5 (Fig. 2) can be performed with the same ease as on metals with excellent plating properties, and the adhesion strength is is also very stable. In addition, the above two-degree heat treatment is
There is no need to strictly control the temperature setting range, and it can be easily performed using a normal conveyor furnace, batch furnace, etc.
以上説明したように本発明は、第１の熱処理工程で銅タ
ングステン合金材の表面からスケールを除去し、その後
にニッケルめっき又は銅メツキを行い、更に第２の熱処
理工程でニッケルめっき又は銅メツキを銅タングステン
合金材に強固に密着させることにより、被めっき性の著
しく悪い銅タングステン合金材に密着強度の高い安定し
ためつきが容易に行えるめっき前処理方法を提供できる
効果があり、その結果、ろう付、はんだ付等が簡単に行
なえる銅タングステン合金材が供給できる効果があり、
他金属にろう付、はんだ付等によって高価な銅タングス
テン合金材を部分的に結合できるため、銅タングステン
合金材の節約ができる効果がある。As explained above, the present invention removes scale from the surface of a copper-tungsten alloy material in the first heat treatment step, then performs nickel plating or copper plating, and then performs nickel plating or copper plating in the second heat treatment step. By firmly adhering to the copper-tungsten alloy material, it is possible to provide a plating pre-treatment method that allows easy and stable plating with high adhesion strength to the copper-tungsten alloy material, which has extremely poor plating properties. It has the advantage of being able to supply copper-tungsten alloy materials that can be easily attached and soldered.
Since the expensive copper-tungsten alloy material can be partially bonded to other metals by brazing, soldering, etc., there is an effect that the copper-tungsten alloy material can be saved.
第１図は本発明の一実施例を説明するための工程順に示
した銅タングステン合金材の部分断面図、第２図は第１
図を用いて説明した実施例により前処理した銅タングス
テン合金材に普通のメツキを施した形態を示す部分断面
図、第３図は銅タングステン合金材に直接普通のメツキ
を施したときのめっきが密着していない代表的な形態を
示す断面図である。
１・・・銅タングステン合金材、２・・・スケール、３
・・・ニッケルめっき、４・・・拡散層、５・・・普通
のめっき。
代理人 弁理士 内 原 音
（，１７）
（ｄ＞
躬１図
ｙＦＪ２’！
第 Ｊ 図FIG. 1 is a partial cross-sectional view of a copper-tungsten alloy material shown in the order of steps for explaining one embodiment of the present invention, and FIG.
A partial cross-sectional view showing a form in which ordinary plating is applied to a copper-tungsten alloy material pretreated according to the example explained using the figures. FIG. 3 is a cross-sectional view showing a typical form in which they are not in close contact. 1... Copper tungsten alloy material, 2... Scale, 3
...Nickel plating, 4...Diffusion layer, 5...Ordinary plating. Agent Patent Attorney Oto Uchihara (,17) (d> Figure 1 yFJ2'! Figure J
Claims (1)
００℃以上１０００℃以下に１０分以上保持する第１の
熱処理工程と、この第１の熱処理工程の後前記銅タング
ステン合金に１ミクロン以下のニッケルめっき又は銅め
っきを施すめっき工程と、このめっき工程の後前記銅タ
ングステン合金を無酸化雰囲気炉中で８００℃以上１０
００℃以下に１０分以上保持する第２の熱処理工程とを
含むことを特徴とする銅タングステン合金のめっき前処
理方法。Copper tungsten alloy in a reducing atmosphere furnace or vacuum furnace 9
a first heat treatment step of holding the temperature at 00°C or more and 1000°C or less for 10 minutes or more, a plating step of applying nickel plating or copper plating of 1 micron or less to the copper-tungsten alloy after this first heat treatment step, and this plating step. After that, the copper-tungsten alloy was heated at 800°C or higher for 10 minutes in a non-oxidizing atmosphere furnace.
A method for pre-plating a copper-tungsten alloy, comprising a second heat treatment step of holding the temperature at 00° C. or lower for 10 minutes or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30513887A JPH01147087A (en) | 1987-12-01 | 1987-12-01 | Pretreatment of copper-tungsten alloy before plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30513887A JPH01147087A (en) | 1987-12-01 | 1987-12-01 | Pretreatment of copper-tungsten alloy before plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01147087A true JPH01147087A (en) | 1989-06-08 |
Family
ID=17941542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30513887A Pending JPH01147087A (en) | 1987-12-01 | 1987-12-01 | Pretreatment of copper-tungsten alloy before plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01147087A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008502806A (en) * | 2004-06-10 | 2008-01-31 | アプライド マテリアルズ インコーポレイテッド | Barrier layer surface treatment method enabling direct copper plating on barrier metal |
| CN103757674A (en) * | 2013-12-20 | 2014-04-30 | 中国电子科技集团公司第五十五研究所 | Nickel plating method for tungsten-copper composite material |
-
1987
- 1987-12-01 JP JP30513887A patent/JPH01147087A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008502806A (en) * | 2004-06-10 | 2008-01-31 | アプライド マテリアルズ インコーポレイテッド | Barrier layer surface treatment method enabling direct copper plating on barrier metal |
| CN103757674A (en) * | 2013-12-20 | 2014-04-30 | 中国电子科技集团公司第五十五研究所 | Nickel plating method for tungsten-copper composite material |
| CN103757674B (en) * | 2013-12-20 | 2017-01-04 | 中国电子科技集团公司第五十五研究所 | A kind of nickel plating process of tungsten-copper composite material |
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