JPH01139370A - Packing for delivery of semiconductor apparatus - Google Patents
Packing for delivery of semiconductor apparatusInfo
- Publication number
- JPH01139370A JPH01139370A JP62298259A JP29825987A JPH01139370A JP H01139370 A JPH01139370 A JP H01139370A JP 62298259 A JP62298259 A JP 62298259A JP 29825987 A JP29825987 A JP 29825987A JP H01139370 A JPH01139370 A JP H01139370A
- Authority
- JP
- Japan
- Prior art keywords
- shipping
- semiconductor device
- gas
- semiconductor apparatus
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 238000012856 packing Methods 0.000 title abstract 2
- 238000004806 packaging method and process Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 10
- 239000002274 desiccant Substances 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 11
- 239000007789 gas Substances 0.000 abstract description 11
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 abstract description 8
- 229910002092 carbon dioxide Inorganic materials 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000001569 carbon dioxide Substances 0.000 abstract description 2
- 239000000741 silica gel Substances 0.000 abstract description 2
- 229910002027 silica gel Inorganic materials 0.000 abstract description 2
- 239000003153 chemical reaction reagent Substances 0.000 abstract 2
- 238000001035 drying Methods 0.000 abstract 2
- 229910001873 dinitrogen Inorganic materials 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- Y02E60/122—
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の出荷包装方法に関し、特に樹脂封
止型の半導体装置の出荷包装方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of packaging and shipping semiconductor devices, and more particularly to a method of packaging and shipping resin-sealed semiconductor devices.
従来のこの種の半導体装置の出荷包装方法には、主に次
の３つの形態がある。Conventional shipping and packaging methods for this type of semiconductor device mainly include the following three types.
第１に、デュアルインラインパッケージ（ＤＩＰ）、ス
モールアウトラインパッケージ（ＳＯＰ）、プラスチッ
クリーデツドチップキャリア（ＰＬＣＣ）等の半導体装
置の場合、チューブと呼ばれるアルミニウム製またはプ
ラスチック製の筒状のケースに半導体装置を挿入し、両
端をゴノ＼状のストッパーで固定し、出荷包装の形態と
するものである。First, in the case of semiconductor devices such as dual in-line packages (DIPs), small outline packages (SOPs), and plastic leaded chip carriers (PLCCs), semiconductor devices are housed in aluminum or plastic cylindrical cases called tubes. It is inserted and fixed with gono-shaped stoppers at both ends to form a packaging for shipping.
第２に、クワッドフラットパッケージ（ＱＦＰ）のよう
に、四方向にしかも極端に細く、薄い端子を有するパッ
ケッジの場合は、トレーと呼ばらるものに半導体装置の
収納部を５０ケ所程度設け、これら収納部に半導体装置
を挿入しこのトレーを多段に重ねて出荷包装の形態とす
るものである。Second, in the case of a package such as a quad flat package (QFP) that has extremely narrow and thin terminals in all four directions, about 50 storage areas for semiconductor devices are provided in what is called a tray. Semiconductor devices are inserted into the storage section, and the trays are stacked in multiple stages to form packaging for shipping.
第３に、テープ状の紙等に半導体装置を粘着させリール
に巻いたり、また、ビニールテープ等にエンボスという
窪を設は半導体装置を挿入し、上からカバーテープを圧
着しこれをリールに巻き出荷する、テープアンドリール
方式という形態である。Third, the semiconductor device is attached to a tape-shaped paper or the like and wound onto a reel, or the semiconductor device is inserted by making an embossed recess in a vinyl tape, etc., and a cover tape is crimped on top of the semiconductor device, which is then wound onto a reel. It is shipped in a tape and reel format.
これらは何れも半導体装置が外気と遮断されていない構
成となっている。In all of these configurations, the semiconductor device is not isolated from the outside air.
上述した従来の半導体装置の出荷包装方法は、半導体装
置か何れも外気と遮断されていない構成となっているの
で、外気の湿度か高いときは、半導体装置の樹脂か外気
の水分を吸収し、特に樹脂封止型の半導体装置の場合、
赤外線リフローやペイパーフェイスソルタリング（以下
ＶＰＳと呼ぶ）等のように、半導体装置を全体的に加熱
することにより印刷配線板に実装する方法においては、
半導体装置のペレットやり一トフレームと樹脂の熱膨張
係数の違いのため、また樹脂中の水分が気化するために
半導体装置の樹脂に亀裂か生しるという欠点かあった。In the conventional shipping and packaging method for semiconductor devices described above, none of the semiconductor devices is isolated from the outside air, so when the humidity of the outside air is high, the resin of the semiconductor device absorbs moisture from the outside air. Especially in the case of resin-sealed semiconductor devices,
In methods such as infrared reflow and paper-per-face sorting (hereinafter referred to as VPS), which heat the entire semiconductor device to mount it on a printed wiring board,
Due to the difference in thermal expansion coefficient between the pellet or frame of the semiconductor device and the resin, and also because the moisture in the resin evaporates, cracks may form in the resin of the semiconductor device.
この亀裂は、半導体素子か大きい半導体装置やまた樹脂
部分か少ない薄い半導体装置の場合には著しく、半導体
素子の端や半導体素子搭載部の端から内部にかけて発生
したり、激しい時には、内部から外部まで達し、耐湿性
が著しく劣化したり亀裂がポンチインクワイヤを横きる
場合には断線を引き起こすという欠点かあった。This crack is noticeable in semiconductor devices with large semiconductor elements or thin semiconductor devices with few resin parts, and may occur from the edge of the semiconductor element or the edge of the semiconductor element mounting area to the inside, or in severe cases, from the inside to the outside. However, if a crack crosses the punch ink wire, it may cause wire breakage.
本発明の目的は、半導体装置の樹脂部分か外気の水分を
吸収することを抑制してＶＰＳ等の実装による亀裂の発
生を防止し、耐湿性の劣化や断線を防止することができ
る半導体装置の出荷包装方法を提供することにある。An object of the present invention is to suppress the absorption of moisture from the outside air by the resin part of the semiconductor device, to prevent the occurrence of cracks due to mounting of VPS, etc., and to prevent deterioration of moisture resistance and disconnection of the semiconductor device. The purpose is to provide a shipping and packaging method.
本発明の半導体装置の出荷包装方法は、半導体装置を気
密型の出荷包装容器内に収納し、この出荷包装容器内に
分子量または平均の分子量か少なくとも２８を持つ少な
くとも１種の気体を満たし、また乾燥剤を入れて密封包
装した構成を有している。The shipping packaging method for a semiconductor device of the present invention includes storing the semiconductor device in an airtight shipping packaging container, filling the shipping packaging container with at least one gas having a molecular weight or an average molecular weight of at least 28, and It has a structure in which a desiccant is contained and the product is sealed.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ）、（ｔ））はそれぞれ本発明の一実施例を
説明するための半導体装置及び出荷包装容器等の一部切
欠き斜視図及び断面図である。FIGS. 1(a) and 1(t) are a partially cutaway perspective view and a sectional view of a semiconductor device, a shipping packaging container, etc., respectively, for explaining an embodiment of the present invention.
出荷包装容器１は、薄いフィルムで作られた気密型の袋
状をしており、この出荷包装容器１の中に内部容器４に
収納された半導体装置５を収納する。The shipping packaging container 1 is in the shape of an airtight bag made of thin film, and the semiconductor device 5 housed in the inner container 4 is housed in the shipping packaging container 1.
内部容器４は、この実施例では、ＤＩＰ型の半導体装置
を収納するチューブか使用されている。In this embodiment, the inner container 4 is a tube for housing a DIP type semiconductor device.
次に、この出荷包装容器１の中にシリカゲル等の乾燥剤
を入れ、そしてこの出荷包装容器１の中を窒素Ｎ２や二
酸化炭素ＣＯ２等の分子量または平均の分子量か２８以
上の少なくとも１種の気体を満たし、ヒートシール部６
で出荷包装容器１の口をヒートシールし、気密包装する
構成となっている。Next, a desiccant such as silica gel is placed in this shipping packaging container 1, and at least one gas having a molecular weight or an average molecular weight of 28 or more, such as nitrogen N2 or carbon dioxide CO2, is poured into the shipping packaging container 1. and heat seal part 6
The opening of the shipping packaging container 1 is heat-sealed to airtightly package it.
第２図（ａ）、（ｂ）はそれぞれこの実施例で使用され
る出荷包装容器の一例を示す断面図である。FIGS. 2(a) and 2(b) are sectional views each showing an example of a shipping packaging container used in this embodiment.
＝５−
第２図（ａ＞は、外側に３０μＩｎの塩化ヒニリテン層
１２を、内側に融点の低い３０μｍのポリエチレン層１
１を設けた２層構造とし、内面でヒートシールが容易に
てきる一構造となっている。=5- Figure 2 (a> shows a 30μIn hnyritene chloride layer 12 on the outside and a 30μm polyethylene layer 1 with a low melting point on the inside)
It has a two-layer structure with 1 and 2 layers, and has a structure that allows for easy heat sealing on the inner surface.
第２図（ｂ）は、アルミニウム薄膜１３を外側にし内面
に４０μｍのポリエチレン層１１ａをラミネートし、同
様に内面でヒートシールが容易にてきる構造としたもの
である。FIG. 2(b) shows a structure in which the aluminum thin film 13 is placed on the outside and a 40 μm polyethylene layer 11a is laminated on the inside surface, so that heat sealing can be easily performed on the inside surface.
第３図は本発明の効果を示す封入気体に対する半導体装
置の吸湿率を示す特性図である。FIG. 3 is a characteristic diagram showing the moisture absorption rate of the semiconductor device with respect to the enclosed gas, showing the effect of the present invention.
この第３図の吸湿率は、第２図（ａ）に示された構造の
出荷包装容器１を使用し、３０ｇのシリカゲルと共に各
種気体の雰囲気中で密封した半導体装置を温度４０°Ｃ
１湿度９０％の雰囲気中に２週間保管した後測定したも
のである。また、吸湿率とは、保管後の重量の増加分を
保管前の重量で割った値である。参考のため、従来の出
荷包装方法を適用したときの吸湿率も示しである。The moisture absorption rate shown in FIG. 3 is calculated using the shipping packaging container 1 having the structure shown in FIG.
1. Measurements were taken after two weeks of storage in an atmosphere with a humidity of 90%. Moreover, the moisture absorption rate is a value obtained by dividing the increase in weight after storage by the weight before storage. For reference, the moisture absorption rate when the conventional shipping and packaging method is applied is also shown.
第３図から分るように、従来包装ては、吸湿率０．３％
に達するものに対し、本発明の場合、吸混率は０．１％
以下に低下し効果的である。この効果は分子量の大きい
気体はど大きい。また、分子量か２８より小さい気体て
は、従来包装より多少改善されるか十分とはいえない。As shown in Figure 3, conventional packaging has a moisture absorption rate of 0.3%.
In the case of the present invention, the absorption rate is 0.1%.
It is less effective. This effect is greater for gases with larger molecular weights. Furthermore, for gases with molecular weights smaller than 28, the packaging may be somewhat improved over conventional packaging, but it cannot be said to be sufficient.
尚、温度４０°Ｃ１湿度９０％の雰囲気に２週間保管す
ることは、通常、半導体装置か保管される気温２５°Ｃ
２湿度６０％の雰囲気に換算すると、１年以上に相当す
ることがわかっている。従って本発明を適用することに
より、半導体装置は１部具」−もの間０ コー％以下の
吸湿率で保管することかてき、実装時の加熱により気化
する水分の量が極端に少なくなり、亀裂の発生を防止す
ることかでき、信頼性の向上をはかることかできる。Note that storing for two weeks in an atmosphere with a temperature of 40°C and 90% humidity means that the temperature at which semiconductor devices are normally stored is 25°C.
2It is known that this is equivalent to more than one year when converted into an atmosphere with 60% humidity. Therefore, by applying the present invention, a semiconductor device can be stored as a single component at a moisture absorption rate of 0 co% or less, and the amount of moisture that evaporates due to heating during mounting is extremely reduced, causing cracks. It is possible to prevent the occurrence of this problem and improve reliability.
以」二説明したように本発明は、半導体装置を収納した
出荷包装容器内に分子量２８以」二の気体を満たし、ま
た乾燥剤を入れて密封包装する構成とすることにより、
半導体装置の水分の吸収を抑えることかできるので、Ｖ
ＰＳ等の実装による亀裂の発生を防止することかでき、
耐湿性の劣化や断線等を防止することができる効果かあ
る。As explained below, the present invention has a configuration in which a shipping packaging container containing a semiconductor device is filled with a gas having a molecular weight of 28 or more, and a desiccant is also added and hermetically sealed.
Since it is possible to suppress moisture absorption in semiconductor devices, V
It is possible to prevent cracks from occurring due to mounting of PS etc.
This has the effect of preventing deterioration of moisture resistance and wire breakage.
第１図（ａｍ （ｂ）はそれぞれ本発明の一実施例を
説明するための半導体装置及び出荷包装容器等の一部切
欠斜視図及び断面図、第２図（ａ）、（１））はそれぞ
れ本発明の一実施例で使用される出荷包装容器の一例を
示す断面図、第３図は本発明の詳細な説明するための封
入気体に対する半導体装置の吸湿率を示す特性図である
。
］、１ａ・・・出荷包装容器、２・・・気体、３・・・
乾燥剤、４・・・内部容器、５・・・半導体装置、６・
・・ヒートシール部、］、 １． 、 １１ ａ・・・
ポリエチレン層、１２・・・塩化ビニリデン層、１３・
・・アルミニウム薄膜。Figure 1 (am (b)) is a partially cutaway perspective view and cross-sectional view of a semiconductor device and a shipping packaging container, etc. for explaining one embodiment of the present invention, and Figures 2 (a) and (1) are respectively FIG. 3 is a cross-sectional view showing an example of a shipping packaging container used in an embodiment of the present invention, and FIG. 3 is a characteristic diagram showing the moisture absorption rate of a semiconductor device with respect to an enclosed gas for explaining the present invention in detail. ], 1a...Shipping packaging container, 2...Gas, 3...
Desiccant, 4... Inner container, 5... Semiconductor device, 6.
・・Heat seal part, ], 1. , 11a...
Polyethylene layer, 12... Vinylidene chloride layer, 13.
...Aluminum thin film.
Claims (2)
この出荷包装容器内に分子量または平均の分子量が少な
くとも２８を持つ少なくとも１種の気体を満たして密封
包装したことを特徴とする半導体装置の出荷包装方法。(1) Store the semiconductor device in an airtight shipping packaging container,
A method for shipping and packaging semiconductor devices, characterized in that the shipping packaging container is filled with at least one type of gas having a molecular weight or an average molecular weight of at least 28, and then hermetically packaged.
装した特許請求の範囲第（１）項記載の半導体装置の出
荷包装方法。(2) A method for shipping and packaging a semiconductor device according to claim (1), in which a desiccant is contained together with a gas in a shipping packaging container and the packaging is sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62298259A JPH01139370A (en) | 1987-11-25 | 1987-11-25 | Packing for delivery of semiconductor apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62298259A JPH01139370A (en) | 1987-11-25 | 1987-11-25 | Packing for delivery of semiconductor apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139370A true JPH01139370A (en) | 1989-05-31 |
Family
ID=17857307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62298259A Pending JPH01139370A (en) | 1987-11-25 | 1987-11-25 | Packing for delivery of semiconductor apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139370A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5286407A (en) * | 1990-04-25 | 1994-02-15 | Mitsubishi Gas Chemical Company, Inc. | Oxygen absorbent composition and method of preserving article with same |
| US5415907A (en) * | 1989-10-23 | 1995-05-16 | Mitsubishi Gas Chemical Company, Inc. | Inhibitor parcel and method for preserving electronic devices or electronic parts |
| JPWO2019043840A1 (en) * | 2017-08-30 | 2020-04-16 | 創光科学株式会社 | Light emitting device |
-
1987
- 1987-11-25 JP JP62298259A patent/JPH01139370A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5415907A (en) * | 1989-10-23 | 1995-05-16 | Mitsubishi Gas Chemical Company, Inc. | Inhibitor parcel and method for preserving electronic devices or electronic parts |
| US5286407A (en) * | 1990-04-25 | 1994-02-15 | Mitsubishi Gas Chemical Company, Inc. | Oxygen absorbent composition and method of preserving article with same |
| JPWO2019043840A1 (en) * | 2017-08-30 | 2020-04-16 | 創光科学株式会社 | Light emitting device |
| CN111052419A (en) * | 2017-08-30 | 2020-04-21 | 创光科学株式会社 | Light emitting device |
| CN111052419B (en) * | 2017-08-30 | 2023-06-30 | 日机装株式会社 | Light emitting device |
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