JPH1081390A - Material and method for packaging electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To store electronic parts for maintenance exchange without deterioration by the humidity by forming at least one of a top sheet and a bottom sheet of a drying material in a packaging material to package the electronic parts in a sealing manner. SOLUTION: An electronic parts 2 is packaged in a sealing manner by a top sheet on the upper side and a bottom sheet 6 on the lower side to constitute the packaging material. The bottom sheet 6 has a recessed part 6A integrated with a center part, and the electronic parts is stored in the recessed part 6A. Alternatively, the electronic parts 2 may be stored in a slightly swollen part in the center part between the top sheet 4 and the bottom sheet 6 in place of providing the recessed part 6A. The top sheet 4 and the bottom sheet 6 to constitute the packaging material are made of thin composite sheet material or composite film having the gas barrier property, and at least a part thereof is constituted of the drying material with hygroscopicity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology for packaging small electronic components such as semiconductor products, and more particularly, to packaging of electronic components for service exchange.

[0002]

2. Description of the Related Art When an electric product breaks down, it is sent to a service station to replace the failed electronic component. When a chip-type electronic component mounted on a circuit board, for example, a semiconductor chip fails, the entire circuit board is replaced. Normally, chip-type electronic components are connected to a circuit board by soldering and at the same time are bonded by an adhesive. Therefore, it is difficult to replace only the failed chip-type electronic component.

[0003] However, if the entire circuit board is replaced, electronic components that have not failed must be discarded, and the electronic components are wasted. Therefore, a semiconductor product called a chip size package (CSP) is manufactured and used so that only a failed semiconductor chip can be replaced.

An example of a conventional chip size package (hereinafter, referred to as a CSP) will be described with reference to FIG. This example is disclosed in Japanese Patent Application No. Hei 7-210, filed on December 30, 1995 by the same applicant as the present applicant.
No. 352492 (S95043864), for details, see the same application.

As shown in FIG. 7, the CSP comprises an upper semiconductor chip 10 and a lower interposer substrate 20. The interposer substrate 20 has a slightly larger dimension than the semiconductor chip 10. The upper semiconductor chip 10 is a normal semiconductor chip or a flip chip, and is configured to be mounted on a circuit board by flip chip bonding. In the CSP, the semiconductor chip 10 is mounted on the interposer substrate 20 instead of the circuit substrate. Have been. The semiconductor chip 10 may be configured to be mounted by wire bonding, TAB thermocompression bonding, or the like, instead of flip chip bonding.

A large number of lands 21 and through-hole lands 25 A are arranged on the upper surface 20 A of the interposer substrate 20, and both are electrically connected by a wiring pattern 22. The through-hole land 25A is connected to an electrode (not shown) on the lower surface 20B of the interposer substrate 20 through-hole connection.

On the lower surface 20B of the semiconductor chip 10, a number of aligned aluminum electrodes (not shown) are arranged corresponding to the lands 21 on the upper surface 20A of the interposer substrate 20, and solder bumps are formed on the aluminum electrodes. 11 is mounted. The solder bumps 11 of the semiconductor chip 10 are soldered to the corresponding lands 21 of the interposer substrate 20.

Semiconductor chip 10 and interposer substrate 20
The sealing material 15 is inserted between them, whereby the two are bonded. The sealing material 15 is filled from a hole 20C provided in the center of the interposer substrate 20 or a surrounding gap.

The CSP composed of the semiconductor chip 10 and the interposer substrate 20 thus packaged is mounted on a circuit board (motherboard) not shown. The lower surface 20B of the interposer substrate 20 becomes a bonding surface to the motherboard. If the CSP mounted on the motherboard fails, only the failed CSP is removed.

[0010]

As described above, in a service station, it is necessary to store electronic components for a replacement service in order to replace a failed electronic component.
When a normal chip-type electronic component breaks down, the entire circuit board is replaced, so it is necessary to store the circuit board for replacement service. However, in the case of a CSP, it is not necessary to replace the entire circuit board. , CSP alone are stored.

Heretofore, there has been no suitable device or method for storing electronic components for service exchange, for example, CSP.
Since electronic parts for service exchange are generally of various types and in small quantities, there is no dedicated storage container or storage method. If the storage state is poor, the electronic components will deteriorate.

When storing chip-type electronic components, especially semiconductor chips, the most important thing is to eliminate moisture or moisture. Precision electronic components, such as semiconductor products, need to be stored in a dry atmosphere. If stored in a humid atmosphere, the electronic products will deteriorate, and when used,
It is necessary to dry once with a dryer.

In view of the above, an object of the present invention is to provide a method for storing electronic components for service exchange.

[0014] In view of the above, an object of the present invention is to provide a packaging material and a packaging method for storing electronic parts for service exchange.

SUMMARY OF THE INVENTION In view of the foregoing, it is an object of the present invention to provide a means and a method for easily storing a large variety of small electronic components.

[0016]

According to the present invention, in a packaging material for hermetically packaging electronic components sandwiched between a top sheet and a bottom sheet, at least one of the top sheet and the bottom sheet is made of a dry material. It is configured.
Further, the bottom sheet has a concave portion for disposing the electronic component. The top and bottom sheets include composite sheets or laminated films.

According to the present invention, in a packaging material for hermetically packaging an electronic component sandwiched between a top sheet and a bottom sheet, a spacer is disposed between the top sheet and the bottom sheet, and the electronic component is attached to the spacer. Are provided, and at least one of the top sheet, the bottom sheet, and the spacer is made of a desiccant. The top and bottom sheets include composite sheets or laminated films.

According to the present invention, in an electronic component hermetically sealed and packaged by a packaging material including a top sheet and a bottom sheet, at least a part of the packaging material is made of a drying material. The packaging material further has a spacer arranged between the top sheet and the bottom sheet, the spacer having a hole for disposing the electronic component.

According to the present invention, a packaging method for an electronic component includes disposing the electronic component between the top sheet and the bottom sheet, and bonding the periphery of the top sheet and the bottom sheet to seal the inside. And at least one of the top sheet and the bottom sheet is composed of a desiccant sheet. A spacer having a hole for accommodating an electronic component is disposed between the top sheet and the bottom sheet, and at least one of the top sheet, the bottom sheet, and the spacer is made of a desiccant.

[0020]

1 and 2, an example of a packaging material and a packaging method for an electronic component according to the present invention will be described. According to this example, the electronic components 2 are hermetically packaged one by one by the packaging materials 4 and 6. The packaging materials 4 and 6 include an upper top sheet 4 and a lower bottom sheet 6. In the example shown in FIG. 1A, the bottom sheet 6 has a concave portion 6A in the center,
The electronic component 2 is configured to be accommodated in the recess 6A. The recess 6A is formed integrally with the bottom sheet 6, and may be formed, for example, by molding the bottom sheet 6. In the example shown in FIG. 1B, instead of providing the concave portion, the central portions of the top sheet 4 and the bottom sheet 6 slightly swell, and the electronic component 2 is accommodated between them.

The periphery of the top sheet 4 and the bottom sheet 6 are bonded in a gas-tight manner, and the electronic components 2 housed therein are shut off from the outside air for a long time. The electronic component 2 may be vacuum-packaged or dry inert gas (nitrogen, carbon dioxide)
In place of air. Electronic component 2
Is a normal small electronic component, and may be a chip-type electronic component for service exchange, a semiconductor device, a CSP, or the like.

According to the present invention, the top sheet 4 and the bottom sheet 6 constituting the packaging materials 4 and 6 are formed of a thin sheet material, a composite material or a composite film having a gas barrier property, and at least a part of the composite material or the composite film has a moisture absorbing property. And a drying material having Therefore, it is not necessary to enclose a desiccant inside the packaging materials 4 and 6.

FIG. 3 shows a sectional structure of a sheet material used for the wrapping materials 4 and 6. The sheet material includes a composite material (composite material) or composite films (laminated films) 51 and 52 and a desiccant sheet or desiccant film 53. The composite material or the composite films 51 and 52 are made by laminating or laminating materials having different physical properties, for example, paper, plastic film, metal foil, resin film and the like. If the desiccant sheet or desiccant film 53 itself has gas barrier properties, the composite material or the composite films 51 and 52 may be omitted.

According to the present invention, a well-known vacuum packaging technique or gas-filled packaging technique may be used, except that part or all of the sheet material used for the packaging materials 4 and 6 contains a drying material. For example, a vacuum packaging technique or a gas-filled packaging technique for vacuum-packing a powdery or powdery drug or food, tablet, confectionery, or the like may be used.

Referring to FIG. 4, another example of a packaging method for an electronic component according to the present invention will be described. According to this example, the packaging material has the top sheet 4 and the bottom sheet 6 and the spacer 5 inserted therebetween. The top sheet 4 and the bottom sheet 6 are made of a flat thin sheet material. Spacer 5
Has a thickness corresponding to the thickness of the electronic component 2;
Has a hole 5A for accommodating the same.

As shown, the spacer 5 is attached to the bottom sheet 6, and the electronic component 2 is arranged in the hole 5A of the spacer 5. By mounting the top sheet 4 so as to cover the spacer 5, the electronic component 2 is packaged.
Also in this example, the electronic component 2 is formed by the packaging materials 4, 5, and 6.
Vacuum packaging or gas filling packaging.

According to the present embodiment, at least one of the top sheet 4, the bottom sheet 6, and the spacer 5 is made of a desiccant. For the top sheet 4 and the bottom sheet 6, a sheet material having a configuration as described with reference to FIG. 3 may be used. The spacer 5 is preferably made of a desiccant. Therefore, in this example, the top sheet 4 and the bottom sheet 6 are made of a composite material or composite films 51 and 52 having ordinary gas barrier properties, and only the spacers 5 may be made of a drying material.

FIG. 5 shows an example of the configuration of the recesses 5A and 6A for accommodating the electronic component 2. The recesses 5A and 6A for accommodating the electronic component 2 are formed on the bottom sheet 6 in the examples of FIGS. 1A and 2, and are formed on the spacer 5 in the example of FIG. The recesses 5A and 6A are formed in a shape corresponding to the outer shape of the electronic component 2 so that the electronic component 2 does not move inside. However, instead of forming the recesses 5A and 6A having different shapes and dimensions for each of the electronic components having different shapes and dimensions, recesses that can accommodate the electronic components 2 having different shapes and dimensions may be formed.

In the example shown in FIG. 5A, the electronic component 2 having the dimension L ₁
It and is configured to be able to accommodate the two types of electronic components 2 dimensions L _2, in the example shown in FIG. 5B for accommodating the two types of electronic components 2 of the electronic component 2 and the dimension L ₄ of the dimensions L ₃ It is configured to be able to. In this example, the electronic component 2 is assumed to be square, but may be rectangular. In this case, the concave portions 5A and 6A are formed in a shape that can accommodate a rectangular electronic component. It is formed.

According to the present invention, all the materials used for the packaging material, that is, the top sheet 4, the bottom sheet 6, and the spacer 5 are previously stored in a dryer or a dehumidifying stocker and held for a predetermined time. As described above, at least one of the top sheet 4, the bottom sheet 6, and the spacer 5 includes a desiccant. The desiccant needs to be dehumidified before use, but materials other than the desiccant are also dried or dehumidified in advance by a dryer or a dehumidification stocker.

Referring to FIG. 6, a case where a large number of electronic components are simultaneously packaged according to the present invention will be described. As shown in the figure, the top sheet 4 and the bottom sheet 6 (only the top sheet 4 is shown) are formed by a large number of sheet materials having relatively large dimensions. They are configured so that they can be separated along a number of cutting lines 4-1 and 4-2.
That is, the top sheet 4 and the bottom sheet 6 are shipped in a state where they are connected to each other by the cutting lines 4-1 and 4-2, and the cutting lines 4-1 and 4-2 are required to be cut when used. Take out and sell or use as many pieces as possible.

The electronic component 2 packaged by the packaging material is
While being connected to each other, they are shipped, transported, and stored at a service station in a state where a large number of them are arranged side by side in the horizontal and vertical directions. In addition, it may be shipped in a state of being arranged in one or two rows.

When the electronic components 2 are actually used, they are cut along the cutting lines 4-1 and 4-2 and separated one by one. When the electronic component 2 is taken out by opening the inside, the top sheet 4 may be peeled off as shown in FIG. 1 or may be cut along an appropriate cutting line (not shown).

[0034] Since the electronic components packaged by the packaging material are stored in a dry state in a sealed state, even after long-term storage, they need to be in good condition and special inspection for service exchange as they are. And can be used without.

Although the embodiments of the present invention have been described in detail, the present invention is not limited to these examples, and various modifications can be made within the scope of the invention described in the claims. It will be understood by those skilled in the art.

Although the CSP has been described as an application example of the present invention, the CSP is merely an example of the application example of the present invention, and it goes without saying that other small electronic components can also be applied to the present invention. No. Further, the packaging technique according to the present invention is preferably used for replacement electronic components stored at a service station, but may be used for manufacturing electronic components stored at a circuit board manufacturing factory.

[0037]

According to the present invention, there is an advantage that the electronic parts for service replacement can be stored without being deteriorated by moisture.

According to the present invention, since the electronic components are packaged one by one by the packaging material 4, there is an advantage that a required number can be taken out when needed.

According to the present invention, since the packaging material is made of a desiccant, there is an advantage that the electronic component can be moisture-proof packed and moisture-proof preserved without enclosing a desiccant therein.

According to the present invention, since the electronic components are packaged after the packaging material has been dried in advance by a dryer or a moisture-proof stocker, there is an advantage that the internal electronic components can be kept in a dry state for a long time.

[Brief description of the drawings]

FIG. 1 is a view showing an electronic component packaged according to the present invention.

FIG. 2 is an explanatory diagram for explaining a method for packaging an electronic component according to the present invention.

FIG. 3 is a diagram showing an example of a structure of a sheet material constituting a packaging material used in the present invention.

FIG. 4 is an explanatory diagram for explaining another example of the electronic component packaging method according to the present invention.

FIG. 5 is a view showing an example of a concave portion of the packaging material according to the present invention.

FIG. 6 is a diagram showing a shipping state of an electronic component packaged according to the present invention.

FIG. 7 is a diagram showing a configuration of a conventional CSP.

[Explanation of symbols]

2 electronic parts, 4 topsheet, 5 spacer,
5A recess, 6 bottom sheet, 6A recess,
Reference Signs List 10 semiconductor chip, 11 solder bump, 15 sealing material, 20 interposer substrate, 20A top surface,
20B lower surface, 20C hole, 21 land, 22
Wiring pattern, 25A through hole land

Claims (9)

[Claims] 1. A packaging material for hermetically packaging an electronic component sandwiched between a top sheet and a bottom sheet,
A packaging material for electronic components, wherein at least one of the top sheet and the bottom sheet is made of a drying material. 2. The packaging material for an electronic component according to claim 1, wherein the bottom sheet has a concave portion for disposing the electronic component. 3. The packaging material for an electronic component according to claim 1, wherein the top sheet and the bottom sheet include a composite material sheet or a laminated film. 4. A packaging material for hermetically packaging electronic components sandwiched between a top sheet and a bottom sheet,
A spacer is disposed between the top sheet and the bottom sheet, and a hole for accommodating the electronic component is provided in the spacer, and at least one of the top sheet and the bottom sheet and the spacer is formed of a drying material. Packaging material for electronic components. 5. The packaging material for an electronic component according to claim 4, wherein the top sheet and the bottom sheet include a composite material sheet or a laminated film. 6. An electronic component sealed and packaged with a packaging material including a top sheet and a bottom sheet, wherein at least a part of the packaging material is made of a drying material. 7. The sealed electronic component according to claim 6, wherein the packaging material further has a spacer disposed between the top sheet and the bottom sheet, wherein the spacer is for disposing the electronic component. A hermetically sealed electronic component having holes. 8. A method comprising: disposing an electronic component between a top sheet and a bottom sheet; and bonding the periphery of the top sheet and the bottom sheet to seal the inside,
A packaging method for electronic parts, wherein at least one of the top sheet and the bottom sheet is formed of a desiccant sheet. 9. The packaging method for an electronic component according to claim 8, wherein a spacer provided with a hole for accommodating the electronic component is disposed between the top sheet and the bottom sheet, and A packaging method for electronic parts, wherein at least one of the bottom sheet and the spacer is made of a desiccant.