JPH01153479A - Packaging method for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the invasion of moisture from outside, by sealing a semiconductor device with a thin film while maintaining the condition which is higher than a specific atmospheric pressure. CONSTITUTION:A multiple number of resin sealed type semiconductor device 1 are placed in a tube 2; both ends of the tube 2 are sealed by a stopper 3. A multiple number of the tubes 2, in which semiconductor devices 1 have been placed in such a manner, are placed in a thin film bag 4; the inside of the bag 4 is made higher than 0.8 atmospheric pressure, and a closed sealing part 5 of the bag 4 is sealed by thermocompression bonding. The thin film which forms the bag 4 has a two layer structure with polyethylene 6 and vinylidene chloride 7; the thermocompression bonding at the sealing part 5 becomes possible by arranging the polyethylene 6 on the inner surface of the bag 4; if the sealing work is conducted indoor, the sealing of the bag into a condition to be higher than 0.8 atmospheric pressure is extremely easy.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of packaging a semiconductor device, and particularly to a method of packaging a one-tray resin-sealed semiconductor device.

[Conventional technology]

Conventionally, there are mainly three types of packaging methods for this type of semiconductor device. One is for resin-sealed semiconductor devices such as daily in-line packages, small outline packages, and plastic leap-fit chip carriers, in which the semiconductor device is inserted into a cylindrical container made of aluminum or plastic called a tube. Both ends were fixed with stoppers and packaged for shipping.

Second, in the case of a package that has particularly narrow and thin lead terminals in all four directions, such as a quad flat package, the storage container for semiconductor devices, called a tray, is
There is a method that divides the package into several parts, inserts a semiconductor device into each part, stacks them in multiple stages, and packages them for shipping.

The third method is to attach it to a tape-like paper and spread it on a reel.
Alternatively, there is a tape-and-reel shipping packaging method in which a semiconductor device is inserted into an embossed recess, a tape on the top and bottom of the cover is crimped, and the package is wound onto a reel and shipped.

[Problem that the invention seeks to solve]

In the conventional semiconductor device packaging method described above, the semiconductor device is not completely isolated from the outside world, so when the humidity of the outside air is high, the resin of the semiconductor device absorbs moisture from the outside air.

Therefore, when mounting a semiconductor device on a printed circuit board by heating the entire semiconductor device, such as by infrared reflow or paper-phase soldering, the moisture in the resin is evaporated by the heating, and the resin of the semiconductor device is heated. It has the disadvantage of causing cracks. Cracks are noticeable in semiconductor devices with large Pelle/Soto or semiconductor devices with a small resin content. Cracks occur internally from the edges of the pellet or the edges of the semiconductor element mounting area, and in severe cases they can extend from the inside to the outside.
There is a drawback that when the moisture resistance of the semiconductor device deteriorates significantly or a crack crosses the bonding wire, a disconnection failure occurs.

[Means for solving problems]

A semiconductor device packaging method of the present invention includes storing a plurality of resin-sealed semiconductor devices in a container, storing the plurality of containers in a thin film bag, and keeping the bag at a pressure of 0.8 atmosphere or more. Constructed to maintain a tight seal.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a partially cutaway perspective view of a packaging device according to a first embodiment of the present invention.

As shown in FIG. 1, a plurality of resin-sealed semiconductor devices 1 are housed in a tube 2, and both ends of the tube 2 are connected to stoppers 3.
Seal with. A plurality of tubes 2 containing semiconductor devices 1 as described above are housed in a thin film bag 4, and the inside of the bag 4 is heated to 0.8 atmosphere or higher, and a sealing part 5 at the closure of the bag 4 is sealed by thermocompression bonding. Seal.

FIG. 2 is a cross-sectional view of the dyeing of the thin film of FIG.

As shown in FIG. 2, the thin film forming the bag 4 (see FIG. 1) consists of two parts: polyethylene 6, salt 1, hibinylidene 7.
It has a layered structure, and by using polyethylene 6 on the inner side of the bag 4, the sealing part 5 can be bonded by thermocompression, and if the sealing work is done indoors, it can be sealed to a state of 0.8 atmosphere or more. is extremely easy.

Next, FIG. 3 is a characteristic diagram showing the correlation between the packaging state and the moisture absorption rate.

In FIG. 3, A is the case of the first embodiment, B is the case where the inside of the bag is kept in vacuum, and C is the case where only the conventional container is used. The results of each of the above packaging methods after being left in an atmosphere of 40°C and 90% RH for 2 weeks (equivalent to about 1 year at 25°C and 60% RH) are shown, and the moisture absorption rate of the first example was 0. 1
% or less than the vacuum type (1/1/2 compared to the conventional type)
It is below 3.

If the moisture absorption rate is 0.1%, the amount of moisture contained in the resin of the semiconductor device is low, so that vaporization of moisture due to heating during mounting of the semiconductor device is reduced, and cracks do not occur.

FIG. 4 is a partially cutaway perspective view of a packaging device according to a second embodiment of the present invention.

As shown in FIG. 4, the packaging device according to the second embodiment is stored in a rubber-like thin film bag 4a instead of a thin film, and after applying high pressure inside the bag 4a with a pressurizing device (not shown), the packaging device is opened. The opening of 4a is sealed with a string 8.

〔Effect of the invention〕

As explained above, the present invention can prevent moisture from entering from the outside world by keeping the semiconductor device in a state of 0.8 atmosphere or higher with three films and sealing it, and the semiconductor device can absorb moisture for a long period of time. Since the moisture absorption rate can be maintained at 0.1% or less without causing any damage, the moisture in the resin of the semiconductor device is less likely to vaporize due to heating when mounted on a printed circuit board by infrared reflow or paper-phase soldering. This has the effect of preventing cracks from occurring in the resin of the semiconductor device during mounting, and preventing poor moisture resistance and disconnection failures that would occur if the cracks cross the bonding wire.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway perspective view of a packaging device according to a first embodiment of the present invention, Fig. 2 is a cross-sectional view of the thin film bag of Fig. 1, and Fig. 3 is a packaging! FIG. 4 is a partially cutaway perspective view of a packaging device according to a second embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Semiconductor device, 2... Tube, 3... Stopper, 4.4a... Bag, 5... Sealing part, 6... Polyethylene, 7... Vinylidene chloride, 8... ...string.

Claims (1)

[Claims] A plurality of resin-sealed semiconductor devices are housed in a container, the plurality of containers are housed in a thin film bag, and the bag is heated to a temperature of 0.
A method for packaging a semiconductor device, characterized by keeping the semiconductor device hermetically sealed at a pressure of 8 atmospheres or more.