JP2003118704A - Manufacturing method for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To keep a damp-proof property until a semiconductor device is packaged at taping and packaging the resin-sealed type semiconductor device by use of a carrier tape and a cover tape and shipping it. SOLUTION: There is prepared a carrier tape 1 having no opening portion for insertion of a pin from the outside on a bottom of a hole portion 2. After the semiconductor device 3A is arranged in the hole 2, a cover tape 4 is bonded to a carrier tape 1 in the region 5 enclosing the opening portion of the hole portion 2 to seal the semiconductor device 3A in the hole portion 2 while an inert gas is being supplied in the hole 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a technique which is effective when used in a step of taping and packaging a resin-sealed semiconductor device with a carrier tape and a cover tape. .

[0002]

2. Description of the Related Art When a resin-sealed semiconductor device is shipped, for example, a carrier tape having an embossing hole for accommodating the semiconductor device is prepared, and each semiconductor device is accommodated in the embossing hole. Next, after sealing (taping) the embossed holes with a cover tape, the carrier tape is wound on a taping reel to obtain a shipping form. When sealing with the cover tape, both ends of the carrier tape and the cover tape along the extending direction are bonded. An apparatus for performing such a sealing (taping) step is described in, for example, “The latest semiconductor assembly / packaging technology for 2001”, p251 to p256, issued on February 26, 2001 by Press Journal, Inc.

A hole is formed at the bottom of the embossed hole. By inserting a pin into the hole from the outside of the carrier tape and pushing up the semiconductor device, the semiconductor device can be taken out from the carrier tape. Also, when removing the semiconductor device from the carrier tape,
After peeling off the cover tape, it is also possible to take out individual semiconductor devices by vacuum suction.

[0004]

However, the present inventors have found that the shipping form in which the above-mentioned carrier tape is wound on a taping reel has the following problems.

That is, when a resin-sealed semiconductor device is mounted by solder reflow after absorbing moisture, cracks may occur in the semiconductor device due to heat at that time. Therefore, in order to avoid moisture absorption before mounting, it is necessary to package the semiconductor device in a moisture-proof package during transportation and storage. However, since the cover tape is adhered to the carrier tape only at both ends thereof along the extending direction, the end portions at the winding start portion and the winding end portion on the taping reel are not adhered. Therefore, there is a risk that moisture will penetrate into all the embossed holes from this part. Further, if a part of the adhered part is peeled off, there is a risk that moisture will penetrate into all the embossed holes from the peeled part. Furthermore, since a hole is formed at the bottom of the embossed hole, there is a risk that moisture will enter the embossed hole through this hole.

In order to prevent such a problem, when shipping the taping reel wound with the carrier tape, the taping reel is put in a vinyl bag and sealed to prevent moisture. However, there is a problem that the taping reel is exposed to the outside air at the same time when the vinyl bag is opened, and the semiconductor device absorbs moisture before the semiconductor device is mounted.

It is an object of the present invention to provide a technique for maintaining moisture resistance until a semiconductor device is mounted when the resin-sealed semiconductor device is tape-packaged and shipped using a carrier tape and a cover tape. is there.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0009]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, according to the present invention, a carrier tape having a plurality of holes for accommodating a semiconductor device is prepared, the semiconductor device is placed in the hole, and then an inert gas or dry air is supplied to the hole. And a step of adhering the carrier tape and the cover tape so as to cover the holes with a cover tape, wherein the cover tape surrounds the openings of the individual holes or the openings of the plurality of holes. To prevent contact between the atmosphere inside the hole and the atmosphere outside the hole.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In all the drawings for explaining the embodiments, members having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

FIG. 1 shows a carrier tape 1 according to this embodiment.
FIG. 1A, FIG. 1B, and FIG.
FIG. 3C is a perspective view, a plan view and a sectional view of a main part of the carrier tape 1. Note that FIG. 1 (c)
Is a cross section taken along the line AA in FIG.

The carrier tape 1 of the present embodiment can be formed of, for example, polystyrene, polycarbonate, polyethylene terephthalate or polyvinyl chloride. Further, as shown in FIG. 1, the carrier tape 1 has an embossed (concave) hole portion 2, and a semiconductor device formed through a molding process using, for example, a molding resin is formed in the hole portion 2. Can be stored.
Further, in the carrier tape of the present embodiment, the bottom of the hole 2 is not provided with an opening for inserting a pin from the outside, and the semiconductor device housed in the hole 2 is taken out by, for example, vacuum suction. It is possible.

As shown in FIG. 2, the hole 2 is formed in accordance with the shape of the package of the semiconductor device to be housed.
It is possible to form so that an unnecessary gap is not created when the package is stored. Here, FIG.
(A) shows the SOJ (Small Outline J-leaded P
2B is a plan view of a main part of the case where the ackage type semiconductor device 3A is housed, and FIG.
FIG. 2C is a plan view of a main part when a Package) type semiconductor device 3B is stored, and FIG. 2C is a main part when a resin-sealed diode 3C is stored in the hole 2. In addition,
The SOJ type semiconductor device 3A shown in FIG. 2A can be applied to, for example, a DRAM (Dynamic Random Access Memory) package, and the QFP type semiconductor device 3B shown in FIG. 2B is For example, it can be applied to a package of a microcomputer. Although FIG. 2 illustrates the case where three types of packages are stored in the hole 2, the hole 2 can be formed according to the shape of the package even when storing other types of packages. is there. Further, in the following drawings, when the state where the package is stored in the hole 2 is shown, only the case where the SOJ type semiconductor device 3A is stored is shown, and the other semiconductor devices are stored. The illustration in the case of being done is omitted.

After the semiconductor device 3A is housed in the hole 2 as shown in FIG. 2, a cover tape 4 made of, for example, PET (polyethylene terephthalate) is formed on the carrier tape 1 as shown in FIG. It is arranged so as to cover the second opening. Then, as shown in FIG. 4, in the hole 2,
For example, while supplying an inert gas such as N ₂ (nitrogen),
In the region 5 surrounding the opening of each hole 2, the cover tape 4 is thermocompression-bonded to the carrier tape 1 to seal the semiconductor device 3A in the hole 2. Instead of thermocompression bonding, the carrier tape 1 and the cover tape 4 may be bonded to each other by using the cover tape 4 to which the adhesive is applied in advance at the position corresponding to the area 5.

As described above, since the bottom of the hole 2 is not provided with an opening for inserting a pin from the outside, the cover tape 4 covers the carrier tape 1 so as to surround the opening of the hole 2. The airtightness inside the hole 2 can be maintained by adhering to. Further, since the cover tape 4 is adhered to the carrier tape 1 while supplying the inert gas into the hole portion 2, the semiconductor device 3A can be sealed in the hole portion 2 while preventing moisture in the hole portion 2. Accordingly, it is possible to prevent the semiconductor device 3A from absorbing moisture until the semiconductor device 3A is sealed in the hole 2 and then mounted.
That is, when the semiconductor device 3A is mounted by solder reflow, it is possible to prevent cracks from occurring in the semiconductor device 3A due to moisture absorption. In the present embodiment, the case where the cover tape 4 is adhered to the carrier tape 1 so as to surround the openings of the individual holes 2 has been exemplified, but as shown in FIG. The cover tape 4 may be bonded to the carrier tape 1 in a region 5A surrounding the opening of the second tape 2.

Next, as shown in FIG. 6, the carrier tape 1 in which the semiconductor device 3A is hermetically sealed in the hole 2 is wound around the carrier reel 6 and the semiconductor device 3A is shipped. In addition,
As shown in FIG. 7, the reel 6 on which the carrier tape 1 is wound is placed in a vinyl bag 7, and the vinyl bag 7 is filled with dry air that does not contain an inert gas such as N ₂ or moisture. 7 may be sealed so that it can be shipped. Thereby, the moisture resistance inside the hole 2 (see FIG. 1) can be further improved. Further, since the vinyl bag 7 is filled with the inert gas or the dry air, the inert gas or the dry air absorbs the impact when the vinyl bag 7 containing the reel 6 is conveyed, and the reel 6 It is possible to prevent the carrier tape 1 and the semiconductor device 3A from being damaged.

Although the invention made by the present inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the above-mentioned embodiments and various modifications are possible without departing from the scope of the invention. It goes without saying that it can be changed.

For example, in the above-mentioned embodiment, the case where the inert gas is supplied to the hole when the semiconductor device is sealed in the hole provided in the carrier tape has been described. You may supply dry air that does not contain moisture.

[0020]

The effects obtained by the typical ones of the inventions disclosed by the present application will be briefly described as follows.

That is, the opening is not provided at the bottom of the hole for storing the semiconductor device included in the carrier tape, the semiconductor device is placed in the hole, and then the inert gas is supplied into the hole while the hole is formed. Since the cover tape is adhered to the carrier tape in the area surrounding the opening, it is possible to prevent the semiconductor device housed in the hole from absorbing moisture.

[Brief description of drawings]

1A, 1B and 1C are perspective views, a plan view and a sectional view of a main part of a carrier tape used for manufacturing a semiconductor device according to an embodiment of the present invention. Is.

2 (a), (b) and (c) show a semiconductor device stored in a hole provided in a carrier tape used for manufacturing a semiconductor device according to an embodiment of the present invention. It is a principal part top view.

FIG. 3 is a perspective view of essential parts when a cover tape is arranged on a carrier tape used for manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 4 is a plan view of essential parts when a carrier tape and a cover tape used for manufacturing a semiconductor device according to an embodiment of the present invention are bonded together.

FIG. 5 is a plan view of relevant parts when a carrier tape and a cover tape used for manufacturing a semiconductor device according to an embodiment of the present invention are bonded together.

FIG. 6 is a perspective view when the cover tape shown in FIG. 4 or 5 is wound on a reel.

FIG. 7 is a perspective view when the reel shown in FIG. 6 is sealed in a vinyl bag.

[Explanation of symbols]

1 carrier tape 2 holes 3A semiconductor device 3B semiconductor device 3C diode 4 cover tape 5 areas 5A area 6 reel 7 vinyl bag

Continued front page    F term (reference) 3E067 AA11 AB41 AC04 EA04 EA29                       EA32 EB27 EC08 FA01 FC01                       GA19 GD06 GD10                 3E096 AA06 BA08 CA15 CC01 DA26                       DB06 DC03 EA02X EA02Y                       FA02 GA05

Claims (4)

[Claims] 1. A step of: (a) preparing a carrier tape having a plurality of holes for accommodating a semiconductor device; and (b) arranging the semiconductor device in the hole, and then inert gas or dry gas in the hole. A step of adhering the carrier tape and the cover tape so as to cover the holes with a cover tape while supplying air, and by the step (b), the cover tape has openings for the individual holes. A method of manufacturing a semiconductor device, characterized in that the semiconductor device is adhered to a surrounding region to block contact between an atmosphere inside the hole and an atmosphere outside the hole. 2. A step of: (a) preparing a carrier tape having a plurality of holes for accommodating a semiconductor device; and (b) arranging the semiconductor device in the hole, and then inert gas or dry gas in the hole. A step of adhering the carrier tape and the cover tape so as to cover the hole portion with a cover tape while supplying air, (c) a step of winding the carrier tape around a carrier reel after the step (b), (D) After the step (c), a bag for storing the transport reel is prepared, the inert gas or dry air is supplied into the bag, and the transport paper reel is inserted into the bag. A step of sealing the bag, and by the step (b), the cover tape is adhered to a region surrounding the opening of each of the holes, and the atmosphere inside the holes contacts the atmosphere outside the holes. Shut off, before A method of manufacturing a semiconductor device, wherein contact between the atmosphere inside the bag and the atmosphere outside the bag is blocked by the step (d). 3. A step of: (a) preparing a carrier tape having a plurality of holes for accommodating a semiconductor device; and (b) arranging the semiconductor device in the hole, and then inert gas or dry gas in the hole. A step of adhering the carrier tape and the cover tape so as to cover the holes with a cover tape while supplying air, and in the step (b), the cover tape has openings of the plurality of holes. A method of manufacturing a semiconductor device, characterized in that the semiconductor device is adhered to a surrounding region to block contact between an atmosphere inside the hole and an atmosphere outside the hole. 4. A step of: (a) preparing a carrier tape having a plurality of holes for accommodating a semiconductor device; and (b) arranging the semiconductor device in the hole, and then inert gas or dry gas in the hole. A step of adhering the carrier tape and the cover tape so as to cover the hole portion with a cover tape while supplying air, (c) a step of winding the carrier tape around a carrier reel after the step (b), (D) After the step (c), a bag for storing the transport reel is prepared, the inert gas or dry air is supplied into the bag, and the transport paper reel is inserted into the bag. A step of sealing the bag, and by the step (b), the cover tape is adhered to a region surrounding the openings of the plurality of holes, and the atmosphere inside the holes contacts with the atmosphere outside the holes. Shut off, before A method of manufacturing a semiconductor device, wherein contact between the atmosphere inside the bag and the atmosphere outside the bag is blocked by the step (d).