JP3112546U - Semiconductor device package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device package capable of preventing damage to a semiconductor device and degassing packaging bag when a storage container and desiccant for the semiconductor device are packaged in a degassing packaging bag.
In a semiconductor device package in which a desiccant is enclosed together with a storage container such as a reel or tray of a semiconductor device inside a deaeration packing bag, a part of the storage container such as an outer peripheral portion of a reel or a gap between trays. A space for storing the desiccant is provided, and a desiccant having a shape that fits into this space is mounted.
[Selection] Figure 1

Description

  The present invention relates to a semiconductor device package in which a desiccant is sealed together with a storage container such as a reel or a tray inside a deaeration packing bag used for packing, storing and transporting a semiconductor device.

  A composite film that is highly moisture-proof and resistant to mechanical shocks in order to prevent moisture absorption and electrification in the distribution process of semiconductor products from the manufacturing department to the assembly department (user). The deaeration packing bag is made of a desiccant such as silica gel and a semiconductor device storage container (reel, tray, magazine, or the like). 3 and 4 show a conventional semiconductor device package in which a storage container containing a semiconductor device and a desiccant are stored in a degassing packaging bag, degassed, and then sealed by heat sealing. The state (perspective view and side view) after completion of packing is schematically shown.

  FIG. 3 shows a case where a reel 2 is used as a storage container for a semiconductor device. A carrier tape 7 enclosing the semiconductor device is wound around the reel 2 and stored in a deaeration packing bag 3 together with a desiccant 1. The After storing, it is deaerated and sealed by heat sealing the opening. In the figure, the shaded portion is the heat seal portion 4. In such a packing structure, since the desiccant 1 is placed on the reel 2 and degassed, as shown in FIG. 3, the protruding portion 5 from which the desiccant protrudes remains.

Further, FIG. 4 shows a case where the tray 6 is used as a storage container for the semiconductor device. The tray 6 on which the semiconductor device is placed is stored in the deaeration packing bag 3 together with the desiccant 1, and is deaerated and heat-sealed. Also in this case, since the sealed packaging structure places the desiccant 1 on the tray 6 and deaerates, as shown in FIG. 4, the protrusion part 5 from which the desiccant protruded remains. This type of packaging structure is disclosed in Patent Document 1, for example.
JP 2004-161352 A

  In the conventional packing structure, the protrusion 5 remains due to the desiccant, and the semiconductor device may be damaged by locally compressing and deforming the storage container. In addition, since a large pressure is applied to the degassing packaging bag 3 of the protruding portion 5, a serious problem occurs that the package is damaged and the sealed packaging is torn. The present invention provides a semiconductor device package capable of preventing damage to a semiconductor device or degassing packaging bag when the semiconductor device storage container and desiccant are packaged in the degassing packaging bag. With the goal.

  The device according to claim 1 is a semiconductor device package body in which a desiccant is enclosed together with a storage container storing a semiconductor device in a deaeration packing bag, and the storage container includes a space for storing the desiccant. The desiccant having a shape that fits into the space is mounted.

  The invention according to claim 2 is the semiconductor device package according to claim 1, wherein the storage container is a reel that winds up a carrier tape enclosing the semiconductor device, and is wound around the carrier tape winding portion of the reel. Along with the carrier tape taken, an arc-shaped space for storing the desiccant is provided, and the desiccant having a shape that fits into the space is mounted.

  The invention according to claim 3 is the semiconductor device package according to claim 1, wherein the storage container is a tray on which the semiconductor device is placed, and a strip-like shape is formed between the tray and the lid portion or on the lid portion. A space is provided, and the desiccant having a shape that fits into the space is mounted.

  In the present invention, since a desiccant such as silica gel is installed in the semiconductor device storage container with a space, the desiccant is placed on a reel or tray when it is stored in a degassing packaging bag and degassed. It does not protrude and push up the outer surface of the degassing packaging bag. Therefore, the semiconductor device is not locally pressed and damaged, and pressure is not applied during transportation to damage the deaeration packaging bag. Moreover, since there is no protrusion part by a desiccant, there also exists an advantage that a package size can be reduced as a whole.

  The semiconductor device package of the present invention has a structure in which a space for storing a desiccant is provided inside the storage container regardless of the shape of the storage container, and the desiccant that fits into this space is mounted. It is what. Hereinafter, a specific embodiment in which a reel and a tray are used for the storage container will be described with reference to FIGS.

  FIG. 1 is a schematic view showing an embodiment in which the storage container of a semiconductor device is a reel. Each process of housing and sealing the desiccant 1, the reel 2 and the carrier tape 7 in the deaeration packing bag 3, and the packaging The state (perspective view and side view) after completion is shown.

  In this embodiment, when the carrier tape 7 enclosing the semiconductor device is taken up on the reel take-up portion, the carrier tape 7 is not taken up to the outer periphery of the reel 2 and a space for the desiccant 1 is left. Then, the desiccant 1 packaged in a strip shape prepared in advance (with a width corresponding to the dimension between the reel flanges) is deformed and mounted on the arc so as to fit into the remaining space.

  After the reel 2 equipped with the desiccant is accommodated in the degassing packaging bag 3, the airtight semiconductor device package is obtained by degassing and heat-sealing the opening as in the conventional example. The hatched portion in the lower left diagram in FIG. The finished semiconductor device package has flat top and bottom surfaces as shown in the package side view (lower right diagram in FIG. 1), has no protrusions, and has a shape suitable for storage and transportation.

  FIG. 2 is a schematic view showing an embodiment in which the storage container of the semiconductor device is a tray. Each process of storing and encapsulating the desiccant 1 and the plurality of trays 6 in the deaeration packing bag 3 and the packing is completed. The back state (perspective view and side view) is shown.

  The present invention provides a recessed space in which the desiccant 1 is placed on the tray 6 on which the semiconductor device is placed, and an end on another tray 6 (corresponding to the lid) stacked on the tray 6. The desiccant 1 packaged in a strip shape as shown in the space is mounted. The shape of the desiccant 1 may be prepared in advance with a width that fits in the gap between the trays and a necessary length.

  Further, a structure in which a tray 6 on which another semiconductor device is mounted can be stacked on the desiccant 1 mounted thereon. That is, a space for placing the desiccant 1 in the gap between the tray 6 and another tray 6 can be provided, and the strip-shaped packaged desiccant 1 can be mounted in this space.

  After the tray 6 equipped with the desiccant 1 is accommodated in the deaeration packing bag 3, the air-tight semiconductor device package can be formed by deaeration as in the conventional example and heat-sealing the opening. it can. In addition, the shaded portion in the figure is the heat seal portion 4. As in the case of FIG. 1, the completed semiconductor device package has flat shapes on the upper and lower surfaces of the package, and has a shape suitable for storage and transportation.

  As described above, a space for mounting the desiccant is provided in the storage container for storing the semiconductor device, and the desiccant is mounted so as to fit in the space, so that the semiconductor device and the deaeration packing bag It was possible to obtain a semiconductor device package having no damage and a small packing size.

It is explanatory drawing of the 1st Example of this invention. It is explanatory drawing of the 2nd Example of this invention. It is explanatory drawing of this kind of semiconductor device package. It is explanatory drawing of another semiconductor device package of this kind.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Desiccant, 2; Reel, 3; Deaeration packing bag, 4; Heat seal part, 5; Protrusion part,
6; tray, 7; carrier tape

Claims (3)

In the semiconductor device package body in which the desiccant is enclosed together with the storage container storing the semiconductor device inside the degassing packaging bag,
A package for a semiconductor device, comprising: a space for storing the desiccant in the storage container; and a desiccant having a shape that fits into the space. The semiconductor device package according to claim 1,
The storage container is a reel that winds up a carrier tape enclosing a semiconductor device, and the carrier tape winding portion of the reel has an arc shape that stores the desiccant along the wound carrier tape. A semiconductor device package comprising a space, and the desiccant having a shape fitting into the space. The semiconductor device package according to claim 1,
The storage container is a tray on which a semiconductor device is placed, and a gap between the tray and the lid or a strip-shaped space is provided on the lid, and the desiccant having a shape that fits into the space is mounted. A package for a semiconductor device.

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