JP2007269391A - Packaging unit and packaging method for glass substrate having electric conductive section formed therein - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging unit capable of suppressing the generation of rust at electric conductive portion in glass substrates during the transportation and storage of the glass substrates such as TFT substrates or CF substrates and the like and capable of performing effective suppression of the generation of scratches at the glass substrates caused by relative motion between the glass substrates or foreign matters. <P>SOLUTION: A plurality of glass substrates 20 having electric conductive sections formed therein are stacked within an outer enclosing material 11 and stored with some protective sheet materials 12 applied between the glass substrates 20, and deoxidizers 13 are put into the outer enclosing material 11, vacuum packed to form a glass substrate packaging body 30. The packaging body 30 is stored in a box for glass substrates to form packaged unit A. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a glass substrate packaging unit in which a conductive portion is partially formed, such as a TFT substrate, a CF substrate, or a liquid crystal bonded panel, and a method for packaging the glass substrate.

  As is well known, a plurality of glass substrates used for manufacturing liquid crystal bonded panels and glass panels for various image display devices such as liquid crystal displays, plasma displays, electroluminescence displays, and field emission displays are accommodated in a transport container. Usually, it is transported to a display manufacturer or the like as a packing unit in the held state.

  This glass substrate is a very important material for manufacturing LCDs, CFs (color filters) and TFTs (thin film transistors) and similar products. A transport container having compression deformability and dimensional stability is used.

  As an example of such a transport container, Patent Document 1 discloses that a bottomed body container 41 and a lid member 42 are formed by a polyolefin-based foam member as shown in FIG. A support substrate 45, 46 for supporting the glass substrate is formed inside the side surfaces 43, 44, and a glass substrate transport box for transporting the support substrate 45 in a state where the support substrate 45 is engaged with the glass substrate. Are listed.

In Patent Document 2, one or both sides of a glass substrate for FPD are packaged with a water-soluble film so that pretreatment of each glass substrate in an FPD (flat panel display) production line can be simplified. A transport method is described in which a plurality of glass substrates are stacked, accommodated, and transported in a glass substrate transport container. It also describes that a desiccant is put in the glass substrate transport container so that the water-soluble film does not dissolve during the transport.
JP 2005-343506 A JP 2005-153951 A

  In recent years, the glass substrate has become large and thin, and the glass substrate may be bent due to vibration or the like so that adjacent glass substrates may come into contact with each other. In addition, in the conventional glass substrate transport container as shown in FIG. 4, the interval between the support grooves 45 and 46 has to be widened to lock the glass substrate, resulting in a disadvantage that efficient transport cannot be performed. .

  The method for transporting a glass substrate shown in Patent Document 2 is configured to accommodate a plurality of glass substrates in a stacked state in a glass substrate transport container, and the above-described conventional glass substrate transport container shown in FIG. The problem can be solved.

  By the way, a display such as an LCD has a structure in which a display is formed by bonding a CF substrate having a conductive portion formed on a glass substrate and a TFT substrate having a conductive portion formed on the glass substrate. Recently, when producing a display, in the process of bonding the TFT substrate and the CF substrate, the CF substrate and the TFT substrate are in stock in order to cope with the diversification of the productivity and the size of the display. Therefore, it is necessary to store for a long period (for example, about 1 to 6 months).

  However, the conventional glass substrate transport container as described above is usually designed on the assumption of transport and storage for about 1 to 2 weeks, and the glass substrate is placed in the transport container for about 1 to 6 months. Usage such as transportation and storage for a relatively long time is not considered. Furthermore, further consideration is not given to storing the CF substrate, TFT substrate, etc. for a long time in a state where they are placed in the transport container. Therefore, if a CF substrate, TFT substrate, etc. are accommodated in a conventional glass substrate transport container and stored for a long time in an area where the rainy season exists, such as the southern part of Taiwan, the conductive part formed on the glass substrate There is a risk of rusting and quality degradation.

  The present invention has been made in order to solve the problems associated with the above-described conventional technology, and the conductive portion of the glass substrate is transported and stored while the conductive portion such as the TFT substrate or the CF substrate is formed. An object of the present invention is to provide a packing unit and a packing method capable of suppressing the occurrence of rust and also effectively suppressing the relative movement between the glass substrates and the generation of scratches on the glass substrate due to foreign matters.

  In the packaging unit according to the present invention, a glass substrate group formed by stacking a protective sheet material between glass substrates on which conductive portions are formed and a deoxidizing material are made of an oxygen gas barrier material. A glass substrate package that is vacuum-packed inside an outer envelope is housed in a glass substrate box.

  Further, the packaging method according to the present invention includes a step of stacking and storing glass substrates in which conductive portions are formed in an outer envelope material made of an oxygen gas barrier material with a protective sheet material interposed therebetween, Including at least a step of vacuum-packing the outer envelope material with the oxygen scavenger in the outer envelope material to form a glass substrate package, and a step of accommodating the glass substrate package in a glass substrate box. Features.

  According to the present invention, the glass substrate package is vacuum-packed, and the packaged glass substrates are pressed against each other by atmospheric pressure, so that relative movement between the glass substrates is suppressed. Thereby, it is possible to prevent the glass substrate from being damaged even during transport and storage over a long period of time. Further, a large number of glass substrates can be stacked in a small space, and a sufficient number of glass substrates can be accommodated even in a shallow box. Thereby, efficient conveyance and storage are possible.

  In addition, since the deoxidized material is sealed at the same time, when air is vacuum-packed by sucking the air in the outer package, even if a little air remains inside the glass substrate package, The oxygen contained in the air is adsorbed by the oxygen scavenger. As a result, the glass substrate package is maintained for a long time in the absence of oxygen, and rust does not occur in the conductive portion formed on the glass substrate.

  In the present invention, the protective sheet material is preferably a foam sheet, but it may be paper such as slip paper, a resin film, a resin sheet, or the like. More preferably, the foamed sheet is subjected to an antistatic treatment. As an example, a foamed sheet obtained by kneading and mixing an antistatic agent with a crosslinked polyolefin resin foamed sheet may be mentioned. Moreover, what formed the polypropylene resin layer containing the polymer type antistatic agent by the coextrusion molding method etc. on the single side | surface or both surfaces of a polypropylene resin foam layer layer is mentioned.

  In the present invention, the outer envelope material composed of an oxygen gas barrier material is polyethylene terephthalate, polyvinylidene chloride, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polyamide, polyester, polyacrylonitrile, vinylidene chloride-acrylonitrile copolymer, acrylonitrile. It can be made of a film or sheet formed of a methyl methacrylate-butadiene copolymer, nylon 6, polypropylene, or the like. Further, a thinly formed inorganic material (aluminum foil or the like), a vapor-deposited film or sheet alone, or a laminated material can be used. It is more preferable to use a film or sheet of aluminum vapor-deposited polyethylene terephthalate, aluminum foil, polyethylene terephthalate, polyvinylidene chloride, etc., alone or laminated, because it has excellent gas barrier properties and moisture resistance. It is more preferable to use a film or sheet such as an aluminum foil alone or a laminated sheet.

  In the present invention, the glass substrate box is preferably made entirely of a synthetic resin foam. More preferably, the thermoplastic resin is molded by in-mold molding of expandable particles of thermoplastic resin. Preferably, expandable styrene-modified polyolefin resin particles can be used. The styrene modified polyolefin resin is obtained by impregnating and polymerizing a polyolefin resin particle with a styrene monomer. Among the styrene modified polyolefin resins, a styrene modified polyethylene resin is preferable, for example, styrene The proportion of the components is 40 to 90% by weight, preferably 50 to 85%, more preferably 55 to 75% by weight, and the magnification of the foam is preferably 3 to 60 times.

  Molded products made of expandable styrene-modified polyolefin resin particles have higher strength, smaller shrinkage, and better dimensional accuracy than foamed polypropylene resin molded products having the same expansion ratio. Therefore, there is little dimensional variation. Furthermore, there is an advantage that a crushed piece due to friction or the like is difficult to be produced as compared with a foamed polystyrene-based resin molded product.

  In a preferred embodiment of the present invention, a desiccant is further accommodated inside the outer package. In this aspect, when the air in the outer package is sucked to vacuum-pack the outer package, even if a slight amount of air remains in the outer package, the moisture contained in the air is contained in the air. Therefore, it is possible to more effectively prevent rust from being generated in the conductive portion formed on the glass substrate.

  In a preferred embodiment of the present invention, an IC chip is attached to the glass substrate box. In this aspect, the management of the packaged glass substrate can be made more sophisticated based on the information written on the IC chip and the information on the glass substrate on which information is newly written on the IC chip.

  In the present invention, the term “glass substrate on which a conductive portion is formed” is used as a general term for the entire glass substrate on which a broadly defined electric circuit is formed. For example, as described above, a liquid crystal display , Glass substrates used for manufacturing liquid crystal bonded panels and glass panels for various image display devices such as plasma displays, electroluminescence displays, field emission displays and the like.

  According to the present invention, since the glass substrate in which the conductive portion is formed in the outer envelope material made of the oxygen gas barrier material is accommodated together with the deoxidizing material, the conductive portion formed in the glass substrate is quality due to rust or the like. Deterioration can be effectively prevented, and a plurality of glass substrates can be efficiently accommodated in a small space.

  Hereinafter, embodiments of a glass substrate packing unit and a packing method according to the present invention will be described with reference to the drawings. FIG. 1 is an overall perspective view showing the structure of a glass substrate box 10 used in the packaging unit A in the present embodiment.

  The glass substrate box 10 is composed of a bottomed main body container 1 and a lid body 1a that can accommodate a plurality of glass substrates 20 (FIG. 2). In the example, it is made of a foamable styrene-modified polyolefin resin.

  The main body container 1 is composed of a side wall 2 and a bottom 3, and has an opening 4 for containing a glass substrate 20, and a plurality of glass substrates 20 are accommodated therein. An inner side wall 5 for engaging with the inner wall of the lid 1 a is formed at the upper end of the side wall of the main body container 1. In addition, an IC chip holding portion 6 which will be described later is formed on one of the side walls 2 of the main body container 1.

  FIG. 2 is a sectional view schematically showing the packaging unit A of the present invention. In FIG. 2, the lid 1a is omitted. In the figure, reference numeral 11 denotes a bag-shaped outer envelope material made of an oxygen gas barrier material, and here it is composed of an aluminum-deposited polyethylene terephthalate film. Reference numeral 12 denotes a protective sheet material. In this example, the protective sheet material is formed of a foamed sheet obtained by kneading and mixing an antistatic agent with a crosslinked polyolefin resin foamed sheet. The protective sheet material 12 is disposed between the stacked glass substrates 20, below the lowermost glass substrate 20, and above the uppermost glass substrate 20, and protects the glass substrate 20 from being damaged. is doing.

  As shown in the figure, a plurality of glass substrates 20 in which conductive portions are formed are disposed in the outer enclosure 11 in a horizontal direction with the protective sheet material 12 interposed between the glass substrates 20 (for example, , 15) are stacked. This laminate constitutes a “glass substrate group” as referred to in the present invention. An oxygen scavenger 13 and a desiccant 14 are placed on both sides of the stacked glass substrate 20, and the openings of the outer envelope 11 are welded in a state where air is sucked from the outer envelope 11 (so-called vacuum). The glass substrate package 30 is obtained by packing. Any oxygen scavenger 13 can be used, but here, Ageless (registered trademark) made of active iron oxide is used. Silica gel is used as the desiccant 14.

  Glass substrate packaging 30 in which a conductive portion according to the present invention is formed by accommodating a glass substrate packaging body 30 containing a glass substrate 20 or the like and vacuum-packed in the glass substrate box 10 and closing the lid. Unit A. The number of glass substrates 20 accommodated in the outer envelope 11 may be any number in consideration of storage, and two or more glass substrate packages 30 may be combined into one glass substrate box 10. It can also be accommodated.

  In our experiments, oxygen in the air remaining in the vacuum-packed outer envelope 11 is adsorbed by the oxygen scavenger 13 and moisture in the air is adsorbed by the desiccant 14. Even when the glass substrate 20 was stored in the glass substrate box 10 for about six months, rust did not occur in the conductive portion formed on the glass substrate 20. Even if the desiccant 14 was not enclosed, the same effect was obtained.

  The outer envelope material 11 is not limited to an aluminum vapor-deposited polyethylene terephthalate film, and may be a bag-like material made of another oxygen gas barrier material, or may be an appropriate container shape without being limited to a bag-like material. . The method of vacuum packing is also arbitrary. Although not shown, for example, the outer envelope 11 containing the stacked glass substrate 20, oxygen scavenger 13 and desiccant 14 is placed in a decompression chamber, and the exhaust device The inside of the decompression chamber is evacuated by the above, and the inside of the decompression chamber and the outer envelope 11 is evacuated to a predetermined decompression state where the interior is almost vacuum, and then, if necessary, is replaced with N2 gas, and in that state, It may be a means for heat-sealing by sandwiching the opening of the outer envelope material 11 with a crimping head or the like heated to a high temperature.

  In the glass substrate packaging unit A according to the present invention, the plurality of glass substrate groups in the vacuum-packed glass substrate package 30 are pressed by atmospheric pressure, and the plurality of glass substrate groups 20 are integrated into a thickness. Since it behaves as a single thick glass substrate, it is not easily bent and is not easily damaged.

  In the present invention, the protective sheet material 12 may be arranged in any manner as long as it is arranged so as to protect the glass substrate 20 from being damaged. Although not shown, the large protective sheet material 12 is bent in the middle. The glass substrate 20 may be sandwiched from above and below so that the glass substrate 20 is not damaged, or the protective sheet material 12 may be formed in a bag shape and the glass substrate 20 may be placed therein. The protective sheet material 12 may be bonded in advance to one or both surfaces of the glass substrate 20 with an adhesive having a weak adhesive force. When the protective sheet material 12 is bonded only to one surface, there is a conductive portion that is easily damaged. It is preferable that it is formed.

  When the glass substrate box 10 is used a plurality of times, the surface thereof may be chipped and dust may be generated. However, in the packaging unit A according to the present invention, the glass substrate 20 is accommodated in the outer envelope 11. The dust does not adhere to the glass substrate 20. Therefore, as described above, the material of the glass substrate box 10 may be a material having a minimum impact resistance, low compression deformation, and dimensional stability. It can be formed from a highly foamed polystyrene resin material.

  As shown in FIG. 3, the IC chip holding part 6 has a notch 7 having a predetermined width and a predetermined length from the upper end of the side wall 2, and a narrow groove 8 on the side and bottom of the notch 7. The IC chip 9 can be attached to the main body container 1 by inserting the conventionally known IC chip 9 into the narrow groove 8. Since the IC chip 9 inserted is restricted from moving upward by the lid 1a, the IC chip 9 is prevented from coming out of the IC chip holding portion 6.

  Information on the glass substrate 20 can be written on the IC chip 9 by wireless radio waves, and information on the glass substrate 20 written on the IC chip can be read on the IC chip 9, thereby conveying and storing the glass substrate 20. Management can be facilitated. The IC chip holding part 6 may have any configuration as long as the IC chip can be attached. For example, the IC chip may be attached to the main body container 1 with a double-sided adhesive, and the position where the IC chip holding part 6 is provided. Is not limited to the side wall 2 of the container body 1, and may be provided on the lid 1 a or attached to an outer envelope described later.

  There are various types of IC chips 9 such as a label type, a card type, a coin type, and a stick type, and these can be used as appropriate. The mounting structure of the IC chip is not limited to that shown in FIG. 3, and an appropriate method can be adopted depending on the form. Although not shown, for example, a concave region is formed in the container main body or the lid and an IC chip is inserted therein, and the upper end of the concave region is fused after insertion to embed the IC chip in the side wall. For example, an aspect in which an IC chip in which a stab pin is integrated is used and the stab pin is inserted into a container body or a lid and fixed can be employed.

The perspective view which shows the one aspect | mode of the box for glass substrates used with the packing unit of this invention. Sectional drawing which shows one form of the packing unit by this invention. The fragmentary perspective view which shows the attachment part of the IC chip in the box for glass substrates. The perspective view which shows the conventional glass substrate conveyance container.

Explanation of symbols

A ... packing unit, 1 ... main body container, 2 ... side wall, 3 ... bottom, 4 ... opening, 5 ... inner side wall, 6 ... IC chip holding part, 7 ... notch, 9 ... IC chip, 10 ... for glass substrate Box body, 11 ... outer envelope material, 12 ... protective sheet material, 13 ... oxygen scavenger, 14 ... desiccant, 20 ... glass substrate, 30 ... glass substrate package

Claims (5)

  A glass substrate group formed by stacking a protective sheet material between glass substrates on which conductive portions are formed and a deoxidizing material are vacuum packed inside an outer envelope material made of an oxygen gas barrier material. A glass substrate packaging unit in which a conductive portion is formed, wherein the glass substrate packaging body is housed in a glass substrate box.   The packaging unit for a glass substrate on which the conductive portion according to claim 1 is formed, wherein a desiccant is further accommodated inside the outer envelope.   The glass substrate packaging unit according to claim 1 or 2, wherein the glass substrate box is made of a foamable styrene-modified polyolefin resin.   The glass substrate packaging unit according to any one of claims 1 to 3, wherein an IC chip is attached to the glass substrate box. A step of stacking and accommodating glass substrates in which conductive portions are formed in an outer envelope made of an oxygen gas barrier material, with a protective sheet material interposed therebetween,
A step of vacuum-packing the outer envelope material in a state where an oxygen scavenger is placed in the outer envelope material to form a glass substrate package,
Storing the glass substrate package in a glass substrate box;
A method for packing a glass substrate on which a conductive portion is formed.

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