JP2011068366A - Cushioning-and-packaging pack - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cushioning-and-packaging pack that functions as a packaging material alone without being boxed and contributes, for example, to save resources, reduce the size and weight of the pack, and improve workability. <P>SOLUTION: The cushioning-and-packaging pack 1 includes an inside film 21 and a projecting outside film 22 joined to the inside film 21 and keeps a pair of cushioning members 2 sealing a cushioning fluid disposed between the inside film 21 and outside film 22, wherein the pair of cushioning members 2 are joined so as to sandwich an electronic component 10 between the inside films 21 of the pair of cushioning members 2. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a buffer packaging pack, and more particularly to a buffer packaging pack that can function as a packaging material independently without being boxed.

  A packaged body (for example, a precision electronic component) having a low mechanical strength is strictly packaged so as not to be damaged when transported. There are various packaging methods and packaging materials depending on the body to be packaged.

For example, in the case of a large number (for example, several tens) of semiconductor devices to be packaged, first, the semiconductor device is placed on a dedicated tray or the like, and the tray or the like is stored in an antistatic bag. Is packed in a box together with a cushioning material, and the lid of the box is closed with tape or the like.
When the packaged body is a small number (for example, 1 to several) of semiconductor devices, the semiconductor device is first housed so as to be sandwiched between antistatic sponges, and the antistatic sponges are housed in an antistatic bag. The antistatic bag is packed in a box together with a cushioning material, and the lid of the box is closed with tape or the like.

As described above, various packaging materials are used for the package body having low mechanical strength depending on the shape, size, quantity, characteristics (for example, characteristics such as destruction by static electricity), and the like.
For example, Patent Document 1 includes an outer box and at least one air buffer bag that cushions and holds an object to be packaged, and the air buffer bag is made of a plastic film and is flat. Further, there is disclosed a technique of a shock-absorbing packaging container including a check valve that is a bag having a substantially rectangular projection surface, which is blown up by air and can be flattened by drawing out air.

  Further, Patent Document 2 discloses a first sheet formed in a bag shape, a second sheet that is similarly formed in a bag shape, accommodates the first sheet, and forms a double structure; Formed by sealing the sheet, and formed by sealing the second sheet between the gas reservoir cell into which a predetermined amount of gas has been injected from the gas inlet and the first sheet and the second sheet, The technology of the packaging material which has the gas escape cell into which the gas in the gas reservoir cell which the 1st sheet | seat is fractured | ruptured and leaks is disclosed.

  Further, in Patent Document 3, at least a part of an exposure apparatus or a part constituting the exposure apparatus is packed with a first sheet having a single layer or a laminated body having a gas barrier property higher than a vinyl sheet for moisture insulation, Packing at least a part of the exposure apparatus packed with the first sheet or a part constituting the exposure apparatus with a second sheet having a single layer or a laminate having a gas barrier property higher than that of the moisture-proof vinyl sheet; A technique of a packaging method for an exposure apparatus is disclosed in which a predetermined gas is filled between one sheet and a second sheet.

JP 2003-252376 A JP-A-8-324643 JP-A-2005-67617

However, as described above, for example, when the packaged body is a small number (for example, one to several) of semiconductor devices, the semiconductor device is first housed so as to be sandwiched between antistatic sponges, and the antistatic sponges. Is housed in an antistatic bag, the antistatic bag is packed in a box together with a cushioning material, and the lid of the box is closed with tape or the like.
That is, since the packaged body is finally boxed, a packaging auxiliary material (for example, an antistatic sponge or an antistatic bag), a cushioning material, and a box are required as packaging materials, and resource saving is achieved. There was a problem that I couldn't.
Further, since a box is required, there is a problem that it is impossible to reduce the size and weight.

Furthermore, it is necessary to place the packaged body in a plurality of packaging materials in order, and it is necessary to effectively arrange one or more cushioning materials. For this reason, there existed a problem that workability | operativity at the time of packaging was bad. Moreover, when taking out a to-be-packaged body from a packaging material, it was necessary to take out in the reverse order to the above, and there existed a problem that workability | operativity was bad.
In addition, although the technique of patent documents 1-3 is a technique relevant to this invention, it cannot solve said subject.

  The present invention has been proposed to solve the above-described problems, and can function as a packaging material independently without being packed in a box, saving resources, downsizing, reducing weight, and working. The purpose is to provide a shock-absorbing packaging pack that can improve the performance.

  In order to achieve the above object, the buffer packaging pack of the present invention has an inner film and a convex outer film joined to the inner film, and is used for cushioning between the inner film and the outer film. A pair of buffer members for sealing fluid is provided, and the pair of buffer members are joined so as to sandwich a packaged body between the inner films of the pair of buffer members.

  According to the buffer packaging pack of the present invention, even if it is not packed, it can function as a packaging material independently, and resource saving, downsizing, weight reduction, workability improvement, and the like can be achieved.

FIG. 1 is a schematic view of a shock-absorbing pack according to the first embodiment of the present invention, in which (a) shows a perspective view and (b) shows an AA cross-sectional view. FIG. 2 is a schematic view of the buffer packaging pack according to the first embodiment of the present invention, in which (a) shows a perspective view for explaining the sheet state, and (b) for explaining the packaging operation. FIG. FIG. 3: has shown the schematic for demonstrating the press state of the buffer packaging pack concerning 1st embodiment of this invention. FIG. 4 is a schematic view of the shock-absorbing packaging pack according to the second embodiment of the present invention, in which (a) shows a perspective view and (b) shows a BB cross-sectional view. FIG. 5 is a schematic view of the shock-absorbing packaging pack according to the second embodiment of the present invention, in which (a) shows a cross-sectional view for explaining the edge joining operation, and (b) shows the injection operation. Sectional drawing for demonstrating is shown. FIG. 6: is the schematic of the buffer packaging pack concerning 3rd embodiment of this invention, (a) has shown the front view, (b) has shown the side view. FIG. 7: has shown the schematic perspective view of the buffer packaging pack concerning 4th embodiment of this invention.

[First embodiment of buffer packaging pack]
FIG. 1 is a schematic view of a shock-absorbing pack according to the first embodiment of the present invention, in which (a) shows a perspective view and (b) shows an AA cross-sectional view.
In FIG. 1, the buffer packaging pack 1 of the present embodiment has an inner film 21 and a convex outer film 22 joined to the inner film 21, and the buffering pack 1 is provided between the inner film 21 and the outer film 22. A pair of shock-absorbing members 2 in which a working fluid (air in this embodiment) is sealed are provided. In the buffer packaging pack 1, the pair of buffer members 2 are joined so as to sandwich the packaged body (the electronic component 10 in this embodiment) between the inner films 21 of the pair of buffer members 2.

  In the present embodiment, the electronic component 10 is used as the packaged body, but the packaged body is not limited to the electronic component 10. For example, the mechanical component is weak and easily damaged by an impact or the like. It may be an object (may be inorganic or organic). Moreover, although the SOIC (Small Outline Integrated Circuit) is illustrated as the electronic component 10, it is not limited to this.

(Buffer member)
The buffer member 2 includes the inner film 21 and the outer film 22 as described above.
The material of the inner film 21 and the outer film 22 is usually a resin (for example, polyethylene or polypropylene). Moreover, the inner film 21 and the outer film 22 have flexibility, and can buffer an impact by sealing air.
In addition, said resin is not limited to polyethylene or polypropylene. For example, a resin containing an antistatic agent or the like in the resin may be used depending on the specification of the package.
Moreover, although the inner film 21 and the outer film 22 are configured to have flexibility, the present invention is not limited thereto. For example, one of the inner film 21 and the outer film 22 may be configured to have flexibility. Good. Furthermore, it is good also as a structure in which at least one part of the inner side film 21 and the outer side film 22 has flexibility.

Here, preferably, the inner film 21 and the outer film 22 are transparent using a resin having transparency.
In this way, when the electronic component 10 is packaged or taken out, the electronic component 10 can be visually recognized, so that it is possible to effectively prevent problems such as damaging the electronic component 10. Moreover, the state of the packaged electronic component 10 can be confirmed visually. Furthermore, when a barcode or the like is attached to the electronic component 10, the barcode or the like can be read in a packaged state.
Depending on the package (for example, an object preferably avoiding direct sunlight or a prototype part), a resin having translucency or non-transparency may be used.

Preferably, the outer film 22 has a reinforcing layer (not shown). That is, the outer film 22 of the present embodiment has a multilayer structure having a reinforcing layer. The material of the reinforcing layer is nylon or ethylene vinyl alcohol copolymer. This reinforcement layer is laminated | stacked on the film which consists of said resin (for example, polyethylene and polypropylene), for example with a polyamide-type adhesive agent.
If it does in this way, since the mechanical strength of the outer film 22 can be improved, even if it contacts with the object with the sharp corner, the malfunction of being easily torn can be prevented effectively. Thereby, even if it is a case where it is not boxed, the safety | security of a packaging, reliability, etc. can be improved.

The inner film 21 has a substantially rectangular shape, and the peripheral edge is joined to the outer film 22. Further, the outer film 22 has a convex shape (in this embodiment, a convex shape corresponding to a substantially rectangular parallelepiped having round corners) joined to the peripheral edge of the inner film 21. In the buffer member 2, the peripheral portions of the inner film 21 and the outer film 22 are joined between the inner film 21 and the outer film 22 in a state where air is sealed. Thereby, the buffer member 2 has a substantially rectangular parallelepiped shape.
In the present embodiment, the buffer member 2 has a substantially rectangular parallelepiped shape corresponding to the substantially rectangular parallelepiped electronic component 10, but the shape and size of the buffer member 2 are not particularly limited. For example, It may be hemispherical.
Moreover, in this embodiment, it is set as the structure which uses a pair of buffer member 2 of the same shape, However, It is not limited to this structure, For example, you may use a pair of buffer member 2 of a different shape.

  Here, the amount of air to be sealed is about 85 to 98% of the volume V of the space between the inner film 21 and the outer film 22. That is, the buffer member 2 is somewhat loosened (by the amount of air not exceeding about 98% of the volume V), thereby forming a recess for housing the electronic component 10 in the central portion of the inner film 21. Can do. Further, the buffer member 2 can exhibit buffering properties against pressing in all directions, as will be described later, by not slackening too much (because the amount of air does not become less than about 85% of the volume V). it can.

In the present embodiment, the pair of buffer members 2 are configured to seal substantially the same amount of air. However, the present invention is not limited to this. For example, one buffer member 2 has the same amount as the volume V. It is good also as a structure which seals air and functions as a base.
In the present embodiment, the inner film 21 having a substantially rectangular shape is used, and the inner film 21 is bent so as to form a recess, so that the electronic component 10 is accommodated. However, the present invention is limited to this configuration. is not. For example, a recess for storing the electronic component 10 may be formed in the substantially central portion of the inner film 21, or the inner film 21 may be stretched using a stretchable material so that the electronic component 10 is stretched. It may be stored.

Moreover, the double-sided tape 3 is affixed on the periphery of the inner film 21 so that at least one of the buffer members 2 forms an annular shape. Thereby, a pair of buffer members 2 are joined so that the electronic packaging 10 may be clamped between the inner films 21 of a pair of buffer members 2 in the buffer packaging pack 1.
In the present embodiment, the buffer members 2 are joined to each other using the double-sided tape 3, but the present invention is not limited to this. For example, the cushioning members 2 may be joined using an adhesive or welding.
Moreover, although the double-sided tape 3 is affixed so that an annular shape may be formed, the shape of the joining portion is not limited to the annular shape, and may be configured to partially communicate with the outside, for example. In other words, a U-shaped, double-shaped, or spot-shaped (for example, a total of eight corners of the four corners of the rectangle and the center of the four sides) may be provided.

Here, it is preferable that the pair of buffer members 2 be connected via a perforation 23 (see FIG. 2).
If it does in this way, since one buffer member 2 can be easily rotated via the perforation 23 when joining a pair of buffer members 2, workability etc. can be improved.
Further, a large number of buffer members 2 may be connected in a sheet shape via the perforation 23. If it does in this way, storage and transportation of buffer member 2 can be performed efficiently. Moreover, many buffer members 2 can be efficiently manufactured by applying the manufacturing technology of the existing bubble sheet.

  Further, although not shown, a large number of buffer members 2 may be connected in n (n is a natural number) rows × 2 columns via perforations 23. In this case, for example, n (n is a natural number) rows × 2 columns of buffer members 2 are conveyed in the row direction, the electronic component 10 is placed on the inner film 21, and the other buffer member 2 is rotated. The electronic component 10 can be held between the inner films 21 and the pair of buffer members 2 can be welded. That is, according to the buffer member 2 having the above-described configuration, the buffer package pack 1 can easily perform packaging automation.

(Packaging aids)
The buffer packaging pack 1 is configured to sandwich the electronic component 10 via the packaging auxiliary material 4. In other words, the electronic component 10 has a large number of leads, and the leads pierce the inner film 21 when directly packaged.
In such a situation, the packaging auxiliary material 4 of the present embodiment is a foam material having antistatic properties, and holds the electronic component 10 in a state where the lead of the electronic component 10 is stuck. Since the lead does not protrude from the packaging auxiliary material 4, the inner film 21 is not damaged.

Here, the packaging auxiliary material 4 is preferably a foam material or a bubble sheet.
If it does in this way, since the member marketed can be used, usability etc. can be improved and cost can be reduced. Furthermore, the buffering property can be improved.
Note that the packaging auxiliary material 4 is not limited to a foam material or a bubble sheet, and various members can be used depending on the package. If it does in this way, since it becomes possible to package various to-be-packaged bodies, the added value of the buffer packaging pack 1 can be improved. Examples of the various members include a resin container, a glass container, a sealed container, and a sealed bag.

Next, the usage method and effect of the buffer packaging pack 1 having the above configuration will be described with reference to the drawings.
FIG. 2 is a schematic view of the buffer packaging pack according to the first embodiment of the present invention, in which (a) shows a perspective view for explaining the sheet state, and (b) for explaining the packaging operation. FIG.
As shown in FIG. 2A, the buffer packaging pack 1 is shipped from a manufacturer with a large number of buffer members 2 connected via perforations 23. Thereby, the buffer member 2 can be efficiently stored and transported.

First, as shown in FIG. 2 (b), the user who uses the cushion packaging pack 1 removes the pair of cushioning members 2 along the perforation 23, and places the inner film 21 facing upward. The seal of the double-sided tape 3 is peeled off.
Next, the electronic component 10 held by the packaging auxiliary material 4 is placed on the substantially central portion of the inner film 21 of one buffer member 2.
Subsequently, the user rotates the other buffer member 2 along the perforation 23. Thereby, the buffer packaging pack 1 is joined to the pair of buffer members 2 so as to sandwich the electronic component 10 held by the packaging auxiliary material 4 between the inner films 21 of the pair of buffer members 2. . By this joining, as shown in FIG. 1, the buffer packaging pack 1 wraps the electronic component 10.

Here, as described above, since the buffer packaging pack 1 can wrap the electronic component 10 by an extremely simple and easy operation, workability can be greatly improved.
Further, the buffer packaging pack 1 can function as a packaging material independently without being boxed. Thereby, since a box is not required, size reduction, weight reduction, resource saving, etc. can be achieved.

Next, the packaging state of the electronic component 10 in the buffer packaging pack 1 will be described with reference to the drawings.
FIG. 3: has shown the schematic for demonstrating the press state of the buffer packaging pack concerning 1st embodiment of this invention.
In FIG. 3, the buffer packaging pack 1 has a predetermined distance between the outer film 22 and the electronic component 10 when the pair of buffer members 2 joined to each other is pressed in all directions.

For example, when the virtual pressing surface 11 presses the buffer packaging pack 1 in the Z direction (see FIG. 1) as shown in FIG. 3A, the virtual pressing surface 11 contacts the outer film 22 of the buffer member 2. A predetermined distance (a distance that can safely avoid damaging the electronic component 10) is secured between the virtual pressing surface 11 and the electronic component 10 by the sealed air. .
At this time, the electronic component 10 is pressed by the inner film 21 of the buffer member 2, but the impact is buffered by the inner film 21 (and the packaging auxiliary material 4), so that the electronic component 10 is damaged by the impact. It is possible to avoid problems such as receiving.
Further, although not shown, in order to avoid the influence of pressing by the inner film 21, the electronic component 10 and the packaging auxiliary material 4 are accommodated in the above-described resin container (a container having excellent mechanical strength). Also good.

  Moreover, even if the virtual pressing surface 11 is a case where the buffer packaging pack 1 is pressed in the Y direction as shown in FIG. 3B, the virtual pressing surface 11 contacts the outer film 22 of the buffer member 2. However, a predetermined distance (a distance that can safely prevent damage to the electronic component 10) is ensured between the virtual pressing surface 11 and the electronic component 10 by the sealed air. Therefore, as described above, since the electronic component 10 is shock-damped, it is possible to avoid the problem that the electronic component 10 is damaged by the shock.

Furthermore, even when the virtual pressing surface 11 presses the shock-absorbing packaging pack 1 in a direction approximately in the middle of the Z direction and the Y direction (a direction inclined by approximately 45 °) as shown in FIG. The virtual pressing surface 11 comes into contact with the outer film 22 of the buffer member 2, but the sealed air causes a predetermined distance (damage to the electronic component 10) between the virtual pressing surface 11 and the electronic component 10. A distance that can safely be avoided). Therefore, as described above, since the electronic component 10 is shock-damped, it is possible to avoid the problem that the electronic component 10 is damaged by the shock.
As described above, the buffer packaging pack 1 has a predetermined distance between the outer film 22 and the electronic component 10 when the pair of bonded buffer members 2 are pressed in all directions. By simply joining the member 2, it is possible to reliably realize buffering properties in all directions.

As described above, according to the buffer packaging pack 1 of the present embodiment, it can function as a packaging material independently without being boxed, and resource saving, downsizing, weight reduction, and improvement in workability can be achieved. Etc.
Moreover, since the buffer packaging pack 1 has a predetermined distance between the outer film 22 and the electronic component 10 against the omnidirectional pressing of the pair of buffer members 2 joined, the buffer member 2 By simply joining, it is possible to reliably realize buffering in all directions. Thereby, the safety | security and reliability of packaging can be improved.

Furthermore, the buffer packaging pack 1 of this embodiment can also be used as follows.
For example, when transporting a plurality of buffer packaging packs 1 in which electronic parts 10 are packaged, the plurality of buffer packaging packs 1 are usually accommodated in a packaging case or the like. At this time, since each buffer packaging pack 1 has sufficient cushioning properties as described above, it is not necessary to put a cushioning material separately in the packaging case.
Moreover, the shape, material, etc. of said packaging case are not specifically limited. That is, the shape may be a box as well as a box, and the material may be made of metal, wood, paper or vinyl. Also in this point, the buffer packaging pack 1 can improve usability.

[Second Embodiment of Buffer Pack]
FIG. 4 is a schematic view of the shock-absorbing packaging pack according to the second embodiment of the present invention, in which (a) shows a perspective view and (b) shows a BB cross-sectional view.
In FIG. 4, the buffer packaging pack 1a of the present embodiment includes a check valve 24 for injecting, sealing, and discharging air to the buffer member 2a as compared with the buffer packaging pack 1 of the first embodiment described above. There are differences. In addition, the other structure of this embodiment is as substantially the same as the buffer packaging pack 1. FIG.
Therefore, in FIG. 4, the same components as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

(Check valve)
The check valve 24 has a flange portion and a cylindrical portion, a through hole is formed in the flange portion and the cylindrical portion, and a valve is provided at the tip of the cylindrical portion. The check valve 24 can inject air from the through-hole, and the injected air is sealed by the valve, and further, a rod-shaped member is inserted into the through-hole to discharge the injected air. be able to.

In this way, for example, when not in use, the air can be removed, so that space can be saved in storage. Further, after use, the air can be discharged and stored, and the recyclability can be improved.
Further, for example, the amount of air to be sealed can be freely set according to the size of the packaged body and the like. Thereby, even if it is a case where the magnitude | size etc. of a to-be-packaged body differ, predetermined | prescribed buffer property can be acquired.

The configuration of the check valve 24 is not limited to the above, and may be a configuration that functions as a check valve, for example.
In addition, the check valve 24 of the present embodiment can discharge the sealed air, but instead of the check valve 24, an inlet (not shown) for injecting and sealing air may be provided. Good. After injecting air, this inlet seals air by welding, for example. If it does in this way, although the sealed air cannot be discharged | emitted, the quantity of the air sealed can be freely set according to the magnitude | size etc. of a to-be-wrapped body. Thereby, even if it is a case where the magnitude | size etc. of a to-be-packaged body differ, predetermined | prescribed buffer property can be acquired.

Next, the usage method and effects of the buffer packaging pack 1a having the above-described configuration will be described with reference to the drawings.
FIG. 5 is a schematic view of the shock-absorbing packaging pack according to the second embodiment of the present invention, in which (a) shows a cross-sectional view for explaining the edge joining operation, and (b) shows the injection operation. Sectional drawing for demonstrating is shown.
As shown in FIG. 5A, the buffer packaging pack 1a is shipped from the manufacturer in a state where air is removed. Thereby, space saving is achieved, so that the buffer member 2a can be efficiently stored and transported.

First, as shown in FIG. 5A, the user who uses the buffer packaging pack 1 a is placed so that the inner film 21 faces upward, and the seal of the double-sided tape 3 is peeled off.
Next, the electronic component 10 held by the packaging auxiliary material 4 is placed almost at the center of the inner film 21 of the one buffer member 2a.
Subsequently, the user rotates the other buffer member 2 a along the perforation 23. Thereby, a pair of buffer members 2a are joined so that the electronic packaging 10 hold | maintained at the auxiliary packaging material 4 may be clamped between the inner side films 21 of a pair of buffer members 2a. . At this time, since air is not injected, the double-sided tape 3 can be pinched so as to sandwich the double-sided tape 3, and the joining with the double-sided tape 3 can be performed more reliably.

Next, the user injects air from the check valve 24. At this time, as described above, the user can freely set the amount of air to be sealed according to the size of the packaged body and the like. Thereby, even if it is a case where the magnitude | size etc. of a to-be-packaged body differ, predetermined | prescribed buffer property can be acquired.
The buffer packaging pack 1a wraps the electronic component 10 as shown in FIG.

Further, the user who removes the package can discharge the air from the check valve 24 after taking out the electronic component 10. Thereby, space saving can be achieved in storage of the buffer packaging pack 1a. That is, after use, air can be discharged and stored, and recyclability can be improved.
Other effects are almost the same as those of the first embodiment.

  As described above, according to the buffer packaging pack 1a of the present embodiment, it is possible to achieve substantially the same effects as the buffer packaging pack 1 of the first embodiment and to save space in storage and transportation. Furthermore, since the amount of air to be sealed can be freely set according to the size of the packaged body, etc., even if the size of the packaged body is different, a predetermined buffering property is obtained. be able to. That is, the buffer packaging pack 1a can improve usability and added value.

[Third embodiment of buffer packaging pack]
FIG. 6: is the schematic of the buffer packaging pack concerning 3rd embodiment of this invention, (a) has shown the front view, (b) has shown the side view.
In FIG. 6, the buffer packaging pack 1b of this embodiment is different from the buffer packaging pack 1 of the first embodiment described above in that an address label 5 as an external packaging material is provided. In addition, the other structure of this embodiment is as substantially the same as the buffer packaging pack 1. FIG.
Therefore, in FIG. 6, the same components as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

(Address label)
The address label 5 is in the form of a tape pre-applied with an adhesive, and has a writing area (usually a white area) for writing (or printing) a destination on the surface. Although not shown, characters such as “precision parts” and “handling attention” may be printed on portions other than the entry area. Further, portions other than the entry area are transparent, translucent, or colored.

This address label 5 functions as an external packaging material that covers at least a part of the pair of cushioning members 2. In this embodiment, the entire center of the pair of cushioning members 2 in the X direction (see FIG. 1) It is configured to cover over.
In this way, the address and the like can be easily entered. The address label 5 can also function as a reinforcing member that reinforces the outer film 22. Further, even when the address label 5 is colored and does not have transparency, the electronic component 10 can be visually recognized from the side surface direction, so that workability and the like can be improved.
In addition, the shape of the address label 5, a magnitude | size, a sticking direction, etc. are not limited to the above. For example, although not illustrated, a configuration may be adopted in which the substantially central portions of the pair of buffer members 2 in the X direction and the Y direction are respectively covered over the entire circumference.

  Here, the address label 5 of the present embodiment is affixed so as to be shorter than the peripheral length of the outer film 22 at the substantially central portion in the X direction of the pair of buffer members 2. In this way, since the amount of slackness of the outer film 22 can be adjusted, even if the size of the package is different, a predetermined buffering property can be obtained. That is, the buffer packaging pack 1b can improve usability and added value.

In addition, although it is set as the structure provided with the address label 5 as an external packaging material in this embodiment, it is not limited to this. For example, although not shown in the figure, instead of the address label 5, a shrink sleeve or an elastic sleeve having substantially the same shape as the address label 5 may be provided. Moreover, it is good also as a structure which accommodates a several pair of buffer member 2 in a stick shape in a shrink sleeve or an elastic sleeve.
In addition, other configurations of the present embodiment are substantially the same as those of the buffer packaging pack 1 of the first embodiment described above.

  As described above, according to the buffer packaging pack 1b of the present embodiment, the same effects as those of the buffer packaging pack 1 of the first embodiment can be obtained. 22 can be efficiently realized, and the usability and added value can be further improved.

[Fourth Embodiment of Buffer Pack]
FIG. 7: has shown the schematic perspective view of the buffer packaging pack concerning 4th embodiment of this invention.
In FIG. 7, the buffer packaging pack 1c of this embodiment is different from the buffer packaging pack 1 of the first embodiment described above in that a clear case 6 is provided as an external packaging material. In addition, the other structure of this embodiment is as substantially the same as the buffer packaging pack 1. FIG.
Therefore, in FIG. 7, the same components as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

(clear case)
The clear case 6 is a rectangular parallelepiped case made of resin and has a structure in which the upper lid rotates or is fitted. Moreover, since the clear case 6 has a shape and a size that can suitably accommodate the pair of buffer members 2, the pair of buffer members 2 can be accommodated with almost no gap. Further, although not shown in the figure, a label (not shown) in which a destination is written can be attached to the lower part of the front.
If it does in this way, since the electronic component 10 can be visually recognized from an upper direction and a side surface direction, workability | operativity, the reliability of packaging, etc. can be improved. In particular, in the present embodiment, when the electronic component 10 is hand-carried, an excellent effect that the electronic component 10 can be easily visually observed can be exhibited.
In addition, in this embodiment, it is set as the structure provided with the clear case 6 as an external packaging material, However, Instead of the clear case 6, a resin-made bag and paper containers (paper box, a paper bag, etc.) can be used. .
In addition, other configurations of the present embodiment are substantially the same as those of the buffer packaging pack 1 of the first embodiment described above.

  As described above, according to the buffer packaging pack 1b of the present embodiment, since the electronic component 10 can be visually recognized from the upper side and the side surface direction, workability, packaging reliability, and the like can be improved. In particular, when the electronic component 10 is hand-carried, an excellent effect that the electronic component 10 can be easily visually observed can be exhibited.

As mentioned above, although the preferable embodiment etc. were shown and explained about the buffer packing pack of the present invention, the buffer packing pack concerning the present invention is not limited only to the above-mentioned embodiment etc., and various in the range of the present invention. Needless to say, it is possible to implement this change.
For example, the packaging body packaged in the buffer packaging packs 1 and 1a is not limited to one, and for example, a plurality of packaging bodies can be packaged.

Moreover, it is good also as a space filled with inert gas and the space where the space which accommodates the to-be-packaged body formed of a pair of inner film 21 was made into sealed space.
Furthermore, air is normally used as the buffer fluid, but is not limited to air, and for example, liquid such as water or refrigerant may be used. If it does in this way, the buffer packaging pack which has heat retention etc. can be provided.

1, 1a, 1b, 1c Buffer packaging pack 2, 2a Buffer member
3 Double-sided tape
4 Auxiliary materials for packaging
5 Address label 6 Clear case 10 Electronic component 11 Virtual pressing surface
21 Inner film
22 Outer film
23 Perforation
24 Check valve

Claims (10)

An inner film and a convex outer film bonded to the inner film, and a pair of buffer members in which a buffering fluid is sealed between the inner film and the outer film;
The buffer packaging pack, wherein the pair of buffer members are joined so as to sandwich a packaged body between the inner films of the pair of buffer members. 2. The buffer according to claim 1, wherein a predetermined distance is secured between the pair of buffer members joined to the outer film and the package body against pressing in all directions. Packing pack.   The buffer packaging pack according to claim 1 or 2, wherein the package body is sandwiched via a packaging auxiliary material.   The cushioning packaging pack according to claim 3, wherein the packaging auxiliary material is a foam material or a bubble sheet.   5. A check valve for injecting, sealing and discharging the buffer fluid or an inlet for injecting and sealing the buffer fluid is provided in the buffer member. The buffer packaging pack according to any one of the above.   The buffer packaging pack according to any one of claims 1 to 5, wherein the pair of buffer members are connected via a perforation.   The said outer side film has a reinforcement layer, The buffer packaging pack as described in any one of Claims 1-6 characterized by the above-mentioned.   The buffer packaging pack according to any one of claims 1 to 7, wherein the inner film and the outer film are transparent.   The buffer packaging pack according to any one of claims 1 to 8, further comprising an external packaging material that covers at least a part of the pair of buffer members.   The buffer packaging pack according to claim 9, wherein the external packaging material is at least one of a shrink sleeve, an elastic sleeve, an address label, a clear case, and a paper container.

Images