KR20070043133A - Method of packing trays for semiconductor packages using shrinkable film - Google Patents

Abstract

The present invention relates to a tray packaging method for a semiconductor package using a shrinkable film, wherein the trays containing the semiconductor packages are stacked, and a tray without a semiconductor package is covered on the top of the tray bundle for a lid, and then the tray is used using the shrinkable film. Shrink-wrap a lamination bundle of these. The tray bundle is then wrapped or covered with a buffer pad, and the tray bundle is placed in a moisture barrier bag and placed in a cardboard box to complete the packaging. In the tray packaging method of the present invention, the trays are shrink-wrapped using the shrinkable film, so that the trays can be more firmly and stably packed compared to the conventional tray packaging method using the plastic band, and the semiconductor package by the external impact during the transportation process Can effectively prevent damage.

Tray, semiconductor package, shrinkable film

Description

Method for packing trays for semiconductor packages using shrinkable film

1 is a perspective view of a tray for a general semiconductor package.

Figure 2 is a flow chart showing a tray packaging method for a semiconductor package according to the prior art.

3A and 3B are a flowchart and a photograph showing a tray packaging method for a semiconductor package according to an embodiment of the present invention.

<Description of Reference Number Used in Drawing>

10: tray 11: pocket

12: semiconductor package

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package assembly technology, and more particularly, to a method of packaging a semiconductor package storage tray more stably and stably using a shrinkable film.

The semiconductor integrated circuit device manufactured through the wafer manufacturing process is separated into individual chips and then completed through a series of package assembly processes to complete the final product. The final product in the form of a package is generally packaged in a tray, tape and reel, tube, etc., and then shipped. Among these, the tray is mainly used as a storage container of a semiconductor package.

1 is a perspective view of a typical semiconductor package storage tray. Referring to FIG. 1, the tray 10 is typically made of a plastic material and has a thin plate shape in which a plurality of pockets 11 are formed to accommodate the semiconductor package 12. The shape, size, number, etc. of the pockets 11 may vary according to the type, size, etc. of the semiconductor package 12.

The tray 10 in which the semiconductor packages 12 are accommodated is bundled after being bundled into several bundles and shipped. 2 is a flowchart illustrating a tray packaging method for a semiconductor package according to the prior art.

Referring to FIG. 2, first, a plurality of trays are stacked in a predetermined quantity (21). Usually five to ten trays are in a bundle. After stacking the trays, cover the tray with the unpackaged tray on top.

Subsequently, the tray bundles are bundled in front, rear, left and right using a plastic band (22). The plastic band is typically a band made of polypropylene (PP).

After tying up with a band, a hygroscopic material or humidity monitor is placed on the tray bundle as necessary (23).

Then, if necessary, in order to prevent the impact using a cushioning material such as a buffer pad to wrap the tray bundle or to cover the top and bottom of the tray bundle (24).

Finally, after placing the tray bundle in a moisture barrier bag (MBB) for static electricity and moisture blocking (25), the bag opening is sealed and glued and folded into a cardboard box (26).

Since the conventional tray packaging method described above uses a method of tying the tray bundle with a plastic band, the tension of the band may vary depending on the installation conditions, and the robustness and stability may be degraded. Therefore, the semiconductor package is often damaged by an external shock applied during the transportation process.

Accordingly, an object of the present invention is to provide a method for packaging a semiconductor package tray more robustly and stably to prevent damage to the semiconductor package that may be caused by an external impact during the transportation process.

In order to achieve this object, the present invention provides a tray packaging method for a semiconductor package using a shrinkable film.

A tray packaging method for a semiconductor package according to the present invention includes: (a) stacking a predetermined number of trays containing a plurality of semiconductor packages; And (b) shrink wrapping the stacked bundles of trays using the shrinkable film.

The tray packaging method for a semiconductor package according to the present invention includes, after step (b): (c) wrapping or covering the tray bundle wrapped with the shrinkable film with a buffer pad; And (d) putting the tray bundle into a moisture barrier bag, including a buffer pad, and then putting the tray bundle back into a cardboard box.

In addition, the step (a) may further include the step of covering the tray without a semiconductor package on the top of the tray bundle for the cover.

In addition, the shrinkable film is preferably made of a material selected from polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polyethylene terephthalate (PET), and polyolefin (PO).

In addition, in step (b), it is preferable to shrink-pack the tray bundle by applying heat to the shrinkable film within 10 seconds at about 200 ° C.

Term description

(1) tray

A container used for transporting or storing a semiconductor product, which is generally a rectangular thin plate made of a plastic material, and has a plurality of pockets for storing a semiconductor package. The basic outline dimensions of the tray follow the international standards JEDEC, EIAJ. For example, the number of pockets in the tray is typically 96, and in some cases, there are 100 or more.

(2) shrinkable film

The stretched plastic film has a property that the molecules are oriented in the tensile direction, and when heated again, they shrink to the dimensions before stretching. Such a film is called a shrinkable film. Used for shrink packaging and the like, films such as PE, PP, PVC, PET, and PO are practically used.

Example

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

3A and 3B are a flowchart and a photograph showing a tray packing method according to an embodiment of the present invention.

3A and 3B, first, a predetermined number of trays containing a plurality of semiconductor packages are stacked 31. Typically five to ten trays are stacked to form a bundle. After stacking the trays, the tray without the semiconductor package is placed on the top for the cover.

The shrinkable film is then used to shrink wrap 33 the stack of trays. As described above, the shrinkable film has a property of shrinking to a dimension before stretching when heat is applied. By using this property, the tray can be simply shrunk by applying heat to the shrinkable film, and this method can pack the tray more firmly and stably than the conventional method of tying using a plastic band.

The heating temperature and time in shrinkage packaging are appropriate within 10 seconds at around 200 ° C. The shrink wrapping process can be automated by placing the shrinkable film containing the tray on a conveyor belt and passing it through a tunnel-type heating furnace. The material of the shrinkable film is typically PE (polyethylene), PP (polypropylene), PVC (polyvinyl chloride), PET (polyethylene terephthalate), PO (polyolefin) and the like.

Before packing with a shrinkable film, a hygroscopic material, humidity indicator, etc. can be placed on a tray bundle and packaged together as in the prior art (32).

After wrapping with shrinkable film, the wrapped tray bundle is wrapped or covered with a buffer pad (34). The buffer pad is to prevent damage to the semiconductor package that may be caused by an external impact during the transportation process. Therefore, if the same effect can be achieved, other cushioning means can be used even if it is not a buffer pad.

Finally, after putting the buffer pad and the tray bundle in the moisture blocking bag as in the prior art and blocking the moisture (35), the bag opening is sealed, glued and folded into a cardboard box (36).

As described through the examples up to now, the present invention can shrink the packaging using the shrinkable film to pack the tray more firmly and stably than the conventional tray packaging method using a plastic band. Therefore, it is possible to effectively prevent damage to the semiconductor package that may be caused by an external impact during the transport process. In addition, the present invention has the advantage that the process is simple because it can automatically shrink the trays by heating the shrinkable film.

In the present specification and drawings, preferred embodiments of the present invention have been disclosed, and although specific terms are used, these are merely used in a general sense to easily explain the technical contents of the present invention and to help understanding of the present invention. It is not intended to limit the scope of. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention can be carried out in addition to the embodiments disclosed herein.

Claims (5)

(a) stacking a predetermined number of trays containing a plurality of semiconductor packages; And (b) shrink wrapping the laminated bundle of trays using a shrinkable film; Tray packaging method for a semiconductor package comprising a. The method of claim 1, wherein after step (b), (c) wrapping or covering the tray bundle wrapped with the shrinkable film with a buffer pad; And (d) putting the tray bundle, including the buffer pad, into a moisture barrier bag and then putting it back into a cardboard box; Tray packaging method for a semiconductor package further comprising a. The method of claim 1, wherein the step (a) further comprises the step of covering the tray without a semiconductor package on top of the tray bundle for the cover. The method of claim 1, wherein the shrinkable film is made of a material selected from polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polyethylene terephthalate (PET), and polyolefin (PO). The tray packaging method for a semiconductor package characterized by the above-mentioned. The semiconductor package tray according to any one of claims 1 to 3, wherein the step (b) comprises shrink wrapping the bundle of trays by applying heat to the shrinkable film within 10 seconds at about 200 ° C. Packing way.

Images