KR20200000145U - Moisture absorber having an opening for locating humidity indicator - Google Patents

Moisture absorber having an opening for locating humidity indicator Download PDF

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KR20200000145U
KR20200000145U KR2020180003170U KR20180003170U KR20200000145U KR 20200000145 U KR20200000145 U KR 20200000145U KR 2020180003170 U KR2020180003170 U KR 2020180003170U KR 20180003170 U KR20180003170 U KR 20180003170U KR 20200000145 U KR20200000145 U KR 20200000145U
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opening
moisture
humidity
absorbent
humidity indicator
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조일훈
이동규
박동아
김준태
김오중
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(주)지피엔이
(주) 다진
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/26Drying gases or vapours
    • B01D53/263Drying gases or vapours by absorption
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N31/00Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroup; Apparatus specially adapted for such methods
    • G01N31/22Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroup; Apparatus specially adapted for such methods using chemical indicators
    • G01N31/222Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroup; Apparatus specially adapted for such methods using chemical indicators for investigating moisture content
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B21/00Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
    • G08B21/18Status alarms
    • G08B21/20Status alarms responsive to moisture
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • G09F3/02Forms or constructions
    • G09F3/0291Labels or tickets undergoing a change under particular conditions, e.g. heat, radiation, passage of time

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Abstract

본 고안은 포장재 내부의 습기를 흡수하는 흡습부(11)와 습도지시카드(20)가 위치되는 개구부(12)를 포함하는 습도지시카드(20)를 위치시키기 위한 개구부가 구비된 흡습제에 관한 것이다.The present invention relates to a moisture absorbent having an opening for positioning the humidity indicator card 20 including the moisture absorbing portion 11 absorbing moisture in the packaging material and the opening portion 12 in which the humidity indication card 20 is located. .

Description

습도지시카드를 위치시키기 위한 개구부가 구비된 흡습제 {MOISTURE ABSORBER HAVING AN OPENING FOR LOCATING HUMIDITY INDICATOR}Hygroscopic agent with opening for positioning humidity indicator card {MOISTURE ABSORBER HAVING AN OPENING FOR LOCATING HUMIDITY INDICATOR}

본 고안은 습도지시카드를 위치시키기 위한 개구부가 구비된 흡습제에 관한 것이다.The present invention relates to a moisture absorbent having an opening for positioning the humidity indicator card.

일반적으로 밀봉 패키지 내에 흡습제를 넣고 습기에 노출이 되면 색깔이 변하는 습도지시카드를 사용해야 하는 경우에 통상적으로는 흡습제와 습도지시카드를 그냥 같이 넣어서 사용을 하게 되는데, 반도체 소자의 경우에는 트레이에 넣어서 보관 혹은 이동을 해야 하므로 이 경우에는 흡습제 위에 지시습도카드를 위치 시킬 경우 흡습제에 의해 반도체 트레이의 습도를 정확하게 인식하지 못하는 문제가 있으며, 흡습제의 아래에 위치 시킬 경우에는 정확하게 인식은 되지만 흡습제의 포장이 불투명하므로 눈으로 확인을 할 수 없는 문제점이 있다.In general, when a moisture absorbent is placed in a sealed package and a humidity indicator card that changes color when exposed to moisture is used, a moisture absorbent and a humidity indicator card are usually put together, but in the case of a semiconductor device, it is stored in a tray. Or, in this case, when placing the indicated humidity card on the absorbent, there is a problem that the humidity of the semiconductor tray is not accurately recognized by the absorbent, and when placed under the absorbent, it is correctly recognized but the packaging of the absorbent is opaque. Therefore, there is a problem that can not be confirmed by the eye.

예를 들면, 반도체 패키지의 완성품의 경우에는 흡습제와 습도지시카드를 동시에 포장꾸러미 내에 봉입한다.For example, in the case of the finished product of a semiconductor package, a moisture absorbent and a humidity indication card are simultaneously enclosed in a package.

즉, 반도체 패키지 완성품에 대한 포장 시에는 포장꾸러미 내부에 흡습제와 습도지시카드를 혼입하여 봉입한다.That is, when packing the finished semiconductor package, the moisture absorbent and the humidity indicator card are mixed and enclosed in the package.

이렇게 함으로써, 반도체 패키지의 경우 습기에 의해 발생하는 패키지 손상을 막기 위해 선적에 앞서 제품 포장 시 흡습제와 습도지시카드를 함께 포장꾸러미 내부에 넣어 밀봉함으로써, 흡습제는 습기를 제거하고 습도지시카드는 제품 인수 시 고객이 습도지시카드를 확인하여 제품의 상태를 확인할 수 있도록 하여 고객이 제품에 대해 보다 높은 신뢰성을 가질 수 있도록 하기 위함이다.In this case, in the case of semiconductor packages, the moisture absorbent and the humidity indicator card are sealed together in the package before the product packaging to prevent damage caused by moisture, so that the moisture absorbent removes the moisture and the humidity indicator card takes over the product. This is to allow the customer to check the humidity indication card to check the condition of the product so that the customer can have higher reliability of the product.

통상적으로 반도체 패키지의 포장 시에는 반도체 패키지가 내부에 일정 배열로 수납된 트레이를 정해진 포장단위로 적층하여 밴딩(banding)한 후, 이를 포장꾸러미 내에 수납한 후 포장꾸러미 내부 공간 일측에 흡습제를 넣은 후 흡습제 위에 습도지시카드를 올려 놓은 후 진공포장 또는 일반 포장을 하게 된다.In general, when packaging a semiconductor package, the semiconductor package is stacked and banded in a predetermined packaging unit in which the trays are housed in a predetermined arrangement, banded, stored in a packaging package, and then put an absorbent on one side of the interior space of the packaging package. After placing the humidity indicator card on the absorbent, vacuum packing or general packing is done.

그러나, 이와 같이 흡습제 위에 습도지시카드를 올려 놓는 경우 반도체 패키지 습기에 과다 하게 노출이 되었다 하더라도 발생한 습기가 흡습제에 먼저 흡수가 되어 버리므로 인해 습도지시카드가 반도체 패키지의 습도를 정확하게 인식하지 못하는 문제가 있다.However, when the humidity indicator card is placed on the moisture absorbent as described above, even if the semiconductor package is excessively exposed to moisture, the generated moisture is absorbed by the moisture absorbent first. Therefore, the humidity indicator card does not accurately recognize the humidity of the semiconductor package. have.

이러한 문제점을 개선하고자 대한민국 공개실용 실1999-004300에는 염화코발트를 포장지의 표면에 문자나 부호로 인쇄를 한 습도지시계가 인쇄된 흡습제용 포장지에 관한 것으로 트레이에 적층된 반도체 패키지가 습기에 노출되었을 경우 노출된 습기가 습도지시계에 인식되기 전에 흡습제가 먼저 습기를 흡수해 버려서 정확하게 인식하지 못하는 문제가 있다.In order to improve such a problem, the Korean Laid-Open Utility Room 1999-004300 relates to an absorbent packaging paper in which a humidity indicator printed with cobalt chloride on the surface of a packaging paper is printed with letters or symbols. The semiconductor package stacked on the tray is exposed to moisture. There is a problem in that the absorbent absorbs the moisture before the exposed moisture is recognized by the humidity monitor and thus it is not recognized correctly.

또한, 대한민국 공개특허 특2001-0029441에는 건조제의 표면에 습도센서가 인쇄된 건조제 팩으로 트레이에 적층된 반도체 패키지가 습기에 노출되었을 경우 노출된 습기가 습도지시계보다 흡습제가 먼저 습기를 흡수해버려서 정확하게 인식하지 못하는 문제가 있다.In addition, the Republic of Korea Patent Publication No. 2001-0029441 discloses that when the semiconductor package stacked on the tray is a desiccant pack in which a humidity sensor is printed on the surface of the desiccant, the exposed moisture absorbs moisture earlier than the humidity indicator. There is a problem not recognized.

이 외에도 기판 자체에 습도지시카드를 부착하는 방법도 소개되고 있으나 마찬가지로 포장 후에 포장지를 개봉하지 않고 확인이 불가능한 문제점이 있다.In addition, a method of attaching a humidity indicator card to the substrate itself has been introduced, but likewise there is a problem that can not be confirmed without opening the wrapping paper after packaging.

대한민국 공개특허공보10-2009-0107685 (공개일자: 2009년10월14일, 고안의 명칭: 흡습정도 표시부를 구비한 반도체 장치용 기판 및 그 제조방법, 출원인: 삼성테크윈 주식회사)Republic of Korea Patent Application Publication No. 10-2009-0107685 (published date: October 14, 2009, the name of the invention: a substrate for a semiconductor device having a moisture absorption degree display and its manufacturing method, Applicant: Samsung Techwin Co., Ltd.)

따라서 본 고안이 이루고자 하는 기술적 과제는 흡습제와 습도지시카드를 같이 넣어서 포장하더라도 정확하게 습도를 인식할 수 있는 구조를 가진 흡습제를 제공하는 것이다.Therefore, the technical problem to be achieved by the present invention is to provide a moisture absorbent having a structure that can accurately recognize the humidity even if the packaging with the absorbent and the humidity indicator card.

본 고안의 한 특징에 따른 습도지시카드를 위치시키기 위한 개구부가 구비된 흡습제는 제품의 습기를 흡수하는 흡습부와 습도지시카드를 위치시킬 수 있는 개구부를 포함할 수 있다.Hygroscopic agent provided with an opening for positioning the humidity indicator card according to a feature of the present invention may include an absorbent portion for absorbing moisture of the product and an opening for positioning the humidity indicator card.

이러한 특징에 따르면, 본 고안의 습도지시카드를 위치시키기 위한 개구부가 구비된 흡습제는 흡습제의 영향을 받지 않고 반도체 패키지의 습도를 정확하게 인식할 수 있는 효과가 있다.According to this feature, the moisture absorbent having an opening for positioning the humidity indicator card of the present invention has an effect that can accurately recognize the humidity of the semiconductor package without being affected by the absorbent.

도 1은 본 고안의 한 실시예에 습도지시카드를 위치시키기 위한 개구부가 구비된 흡습제의 구조도이다.
도 2는 본 고안의 한 실시예에 따른 습도지시카드를 위치시키기 위한 개구부가 구비된 흡습제에 습도지시카드가 위치된 구조도이다.
도 3은 본 고안의 습도지시카드(20)를 위치시키기 위한 개구부가 구비된 흡습제가 반도체 패키지 위에 설치되어 있는 도면이다.
1 is a structural diagram of an absorbent having an opening for positioning the humidity indicator card in one embodiment of the present invention.
Figure 2 is a structural diagram in which the humidity indicator card is located in the absorbent having an opening for positioning the humidity indicator card according to an embodiment of the present invention.
3 is a view in which a moisture absorbent having an opening for positioning the humidity indicator card 20 of the present invention is installed on a semiconductor package.

아래에서는 첨부한 도면을 참고로 하여 본 고안의 실시예에 대하여 본 고안이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. Hereinafter, with reference to the accompanying drawings will be described in detail to be easily carried out by those of ordinary skill in the art with respect to the embodiment of the present invention.

그러나 본 고안은 여러 가지 다른 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 그리고 도면에서 본 고안을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

그러면 첨부한 도면 1내지 3을 참고로 하여 본 고안의 습도지시카드(20)를 위치시키기 위한 개구부(12)가 구비된 흡습제(10)에 대하여 상세하게 설명한다. Then, with reference to the accompanying drawings 1 to 3 will be described in detail with respect to the absorbent (10) having an opening 12 for positioning the humidity indication card 20 of the present invention.

도 1은 본 고안의 습도지시카드(20)를 위치시키기 위한 개구부(12)가 구비된 흡습제로 포장재 내부의 습기를 흡수하는 흡습부(11)와 습도지시카드(20)를 위치시킬 수 있는 개구부(12)를 포함하여 구성되어 있다.1 is an opening for positioning the moisture absorbing part 11 and the humidity indicating card 20 to absorb moisture in the packaging material with an absorbent having an opening 12 for positioning the humidity indicating card 20 of the present invention. It is comprised including 12.

상기 개구부(12)는 흡습제의 성능을 저하 시키지 않는 위치에 적어도 하나 이상 구비될 수 있으며, 도 2와 같이 습도지시카드(20)를 위치시키기 위한 개구부(12)가 구비된 흡습제에 습도지시카드(20)가 위치되는 상기 개구부(12)에 습도지시카드(20)가 위치되어 있는 도면이며, 도 3은 본 고안의 습도지시카드(20)를 위치시키기 위한 개구부가 구비된 흡습제가 반도체 패키지 위에 설치되어 있는 도면이다.At least one opening 12 may be provided at a position that does not deteriorate the performance of the absorbent, and as shown in FIG. 2, the humidity indicator card is provided in the absorbent having an opening 12 for positioning the humidity indicator card 20. FIG. 3 is a view in which the humidity indicator card 20 is located in the opening 12 in which 20 is located. It is a drawing.

그러면 본 고안을 이용한 반도체 패키지의 포장에 대해 상세히 설명을 한다.Then, the packaging of the semiconductor package using the present invention will be described in detail.

우선, 포장하고자 하는 반도체 패키지를 내부에 일정한 배열로 수납된 트레이(30)를 정해진 포장단위(소정의 트레이 개수)로 적층하여 밴딩(banding)한 후, 이를 포장꾸러미 내에 수납한 후 트레이(30) 위에 흡습제를 위치시키고 개구부가 있는 위에 습도지시카드(20)를 올려 놓은 후 진공포장 또는 일반 포장을 한다. First, the semiconductor package to be packaged is stacked and banded in a predetermined packaging unit (a predetermined number of trays) by stacking and banding the trays 30, and then storing them in a package and then tray 30 Place the absorbent on the humidity indicator card 20 is placed on the opening and the vacuum packaging or general packaging.

이렇게 포장을 할 경우 반도체 패키지에서 발생한 습도를 흡습제의 영향을 받지 않고 정확하게 인식 할 수 가 있다.In this case, the humidity generated in the semiconductor package can be accurately recognized without being affected by the absorbent.

본 고안에서는 반도체 패키지를 실시예로 하여 설명을 하였으나, 습도제어 및 습도에 과다하게 노출이 되면 안되는 제품들을 포장할 경우에도 본 고안을 적용 하는 것은 당업자라면 용이하게 적용할 수 있다.Although the present invention has been described using the semiconductor package as an embodiment, the present invention can be easily applied to those skilled in the art even when packaging products which should not be exposed to humidity control and humidity.

이상에서 본 고안의 실시예에 대하여 상세하게 설명하였지만 본 고안의 권리범위는 이에 한정되는 것은 아니고 다음의 청구범위에서 정의하고 있는 본 고안의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 고안의 권리범위에 속하는 것이다.Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

10: 흡습제 11: 흡습부
12: 개구부 20: 습도지시카드
30: 트레이
10: moisture absorbent 11: moisture absorbent
12: opening 20: humidity indication card
30: tray

Claims (1)

흡습부(11)와 개구부(12)
를 포함하는 습도지시카드를 위치시키기 위한 개구부가 구비된 흡습제.
Moisture absorption part 11 and opening part 12
Hygroscopic agent provided with an opening for positioning the humidity indicator card comprising a.
KR2020180003170U 2018-07-10 2018-07-10 Moisture absorber having an opening for locating humidity indicator KR20200000145U (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090107685A (en) 2008-04-10 2009-10-14 삼성테크윈 주식회사 Semiconductor device substrate with humidity indicator and method therof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090107685A (en) 2008-04-10 2009-10-14 삼성테크윈 주식회사 Semiconductor device substrate with humidity indicator and method therof

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