JPH01134946A - 半導体ウェハのマウント装置 - Google Patents

半導体ウェハのマウント装置

Info

Publication number
JPH01134946A
JPH01134946A JP62292526A JP29252687A JPH01134946A JP H01134946 A JPH01134946 A JP H01134946A JP 62292526 A JP62292526 A JP 62292526A JP 29252687 A JP29252687 A JP 29252687A JP H01134946 A JPH01134946 A JP H01134946A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
adhesive tape
frame
roller
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62292526A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0332221B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Matsuro Kanehara
松郎 金原
Akira Ishihara
明 石原
Toshiyuki Sekido
関戸　俊之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP62292526A priority Critical patent/JPH01134946A/ja
Publication of JPH01134946A publication Critical patent/JPH01134946A/ja
Publication of JPH0332221B2 publication Critical patent/JPH0332221B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP62292526A 1987-11-19 1987-11-19 半導体ウェハのマウント装置 Granted JPH01134946A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62292526A JPH01134946A (ja) 1987-11-19 1987-11-19 半導体ウェハのマウント装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62292526A JPH01134946A (ja) 1987-11-19 1987-11-19 半導体ウェハのマウント装置

Publications (2)

Publication Number Publication Date
JPH01134946A true JPH01134946A (ja) 1989-05-26
JPH0332221B2 JPH0332221B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-05-10

Family

ID=17782947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62292526A Granted JPH01134946A (ja) 1987-11-19 1987-11-19 半導体ウェハのマウント装置

Country Status (1)

Country Link
JP (1) JPH01134946A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109940314A (zh) * 2019-02-19 2019-06-28 北汽福田汽车股份有限公司 白车身输送定位系统及输送定位方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101726544B1 (ko) * 2016-03-04 2017-04-12 주식회사 호남샤니 만쥬빵 깨 자동도포기

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109940314A (zh) * 2019-02-19 2019-06-28 北汽福田汽车股份有限公司 白车身输送定位系统及输送定位方法

Also Published As

Publication number Publication date
JPH0332221B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-05-10

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