JPH01130599U - - Google Patents
Info
- Publication number
- JPH01130599U JPH01130599U JP2595488U JP2595488U JPH01130599U JP H01130599 U JPH01130599 U JP H01130599U JP 2595488 U JP2595488 U JP 2595488U JP 2595488 U JP2595488 U JP 2595488U JP H01130599 U JPH01130599 U JP H01130599U
- Authority
- JP
- Japan
- Prior art keywords
- metal case
- integrated circuit
- hybrid integrated
- lead terminal
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例を示す図、第２図は本
考案の他の実施例を示す図、第３図は従来の混成
集積回路の１例を示す断面図、第４図は従来の混
成集積回路の実装構造を示す図である。
図において、１０は混成集積回路、１１は金属
ケース、１２は信号接続用リード端子、１３は金
属製円筒、１４はアース接続用リード端子、１５
はプリント配線板、１６はスルーホール、１７は
グランド層、１８は絶縁物、１９はシールド用プ
リント板、２０，２１は孔、を示す。
Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a diagram showing another embodiment of the invention, Fig. 3 is a sectional view showing an example of a conventional hybrid integrated circuit, and Fig. 4 is a diagram showing a conventional hybrid integrated circuit. FIG. 2 is a diagram showing a mounting structure of a hybrid integrated circuit. In the figure, 10 is a hybrid integrated circuit, 11 is a metal case, 12 is a signal connection lead terminal, 13 is a metal cylinder, 14 is a ground connection lead terminal, 15
16 is a printed wiring board, 16 is a through hole, 17 is a ground layer, 18 is an insulator, 19 is a shielding printed board, and 20 and 21 are holes.
Claims (1)
ケース１１に絶縁物を介して取付けられた信号接
続用リード端子１２を有する混成集積回路１０の
プリント配線板１５への実装構造において、 上記混成集積回路の金属ケース１１とプリント
配線板１５との間にすきまを設け、該すきまに露
出した信号接続用リード端子１２の周囲をグラン
ドで囲んだことを 特徴とする混成集積回路の実装構造。[Claims for Utility Model Registration] A hybrid integrated circuit 10 having a metal case 11 housing a circuit element and a signal connection lead terminal 12 attached to the metal case 11 via an insulator, to a printed wiring board 15. In the mounting structure, a gap is provided between the metal case 11 and the printed wiring board 15 of the hybrid integrated circuit, and the signal connection lead terminal 12 exposed in the gap is surrounded by a ground. Circuit implementation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2595488U JPH01130599U (en) | 1988-03-01 | 1988-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2595488U JPH01130599U (en) | 1988-03-01 | 1988-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01130599U true JPH01130599U (en) | 1989-09-05 |
Family
ID=31247137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2595488U Pending JPH01130599U (en) | 1988-03-01 | 1988-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01130599U (en) |
-
1988
- 1988-03-01 JP JP2595488U patent/JPH01130599U/ja active Pending
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