JPH01130551U - - Google Patents
Info
- Publication number
- JPH01130551U JPH01130551U JP2603688U JP2603688U JPH01130551U JP H01130551 U JPH01130551 U JP H01130551U JP 2603688 U JP2603688 U JP 2603688U JP 2603688 U JP2603688 U JP 2603688U JP H01130551 U JPH01130551 U JP H01130551U
- Authority
- JP
- Japan
- Prior art keywords
- board
- heat sink
- semiconductor element
- mounting piece
- right angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例を示す電子回路装
置の側面図、第２図は同じく正面図、第３図は同
じく分解状態の斜視図、第４図は従来の電子回路
装置の側面図、第５図は同じく分解状態の斜視図
である。
１……ＰＣ基板、２……半導体素子、３……放
熱板、１１……取付片、１２……係止片、１４…
…係合凹部、１５……取付孔。
Fig. 1 is a side view of an electronic circuit device showing an embodiment of this invention, Fig. 2 is a front view thereof, Fig. 3 is a perspective view of an exploded state, and Fig. 4 is a side view of a conventional electronic circuit device. , FIG. 5 is a perspective view of the same disassembled state. DESCRIPTION OF SYMBOLS 1... PC board, 2... Semiconductor element, 3... Heat sink, 11... Mounting piece, 12... Locking piece, 14...
...Engagement recess, 15...Mounting hole.
Claims (1)
体素子の上に放熱板を重ね合せてこれら半導体素
子および放熱板をＰＣ基板に一体的に取付けてな
るものにおいて、前記放熱板には、両端部にその
下方にほぼ直角に突出する取付片を、両側部にそ
の下方にほぼ直角に突出する係止片をそれぞれ一
体に設け、前記半導体素子の両側部には前記係止
片に対応する係合凹部を、前記ＰＣ基板には前記
取付片に対応する係合孔をそれぞれ形成し、前記
ＰＣ基板の上に配置した半導体素子の上に放熱板
を重ね合せ、この放熱板の係止片を半導体素子の
係合凹部に係合させるとともに、放熱板の取付片
をＰＣ基板の係合孔に挿入してその下面側に突出
させ、かつその突出端部を折曲して放熱板を半導
体素子とともにＰＣ基板に固定したことを特徴と
する電子回路装置。 A semiconductor element is arranged on a PC board, a heat sink is superimposed on the semiconductor element, and the semiconductor element and the heat sink are integrally attached to the PC board, and the heat sink has both ends. A mounting piece protruding downwardly at a substantially right angle is integrally provided on each side thereof, and locking pieces projecting downward at a substantially right angle on both sides thereof, and engaging pieces corresponding to the locking pieces are provided on both sides of the semiconductor element. A recess is formed in the PC board, and an engagement hole corresponding to the mounting piece is formed in the PC board, a heat sink is placed on top of the semiconductor element arranged on the PC board, and the locking piece of the heat sink is attached to the semiconductor element. At the same time as engaging the element's engagement recess, insert the mounting piece of the heat sink into the engagement hole of the PC board so that it protrudes from the lower surface side, and bend the protruding end to attach the heat sink together with the semiconductor element. An electronic circuit device characterized by being fixed to a PC board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2603688U JPH01130551U (en) | 1988-02-29 | 1988-02-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2603688U JPH01130551U (en) | 1988-02-29 | 1988-02-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01130551U true JPH01130551U (en) | 1989-09-05 |
Family
ID=31247294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2603688U Pending JPH01130551U (en) | 1988-02-29 | 1988-02-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01130551U (en) |
-
1988
- 1988-02-29 JP JP2603688U patent/JPH01130551U/ja active Pending