JPH01128439A - Lead frame for cleaning resin sealing die - Google Patents
Lead frame for cleaning resin sealing dieInfo
- Publication number
- JPH01128439A JPH01128439A JP28639787A JP28639787A JPH01128439A JP H01128439 A JPH01128439 A JP H01128439A JP 28639787 A JP28639787 A JP 28639787A JP 28639787 A JP28639787 A JP 28639787A JP H01128439 A JPH01128439 A JP H01128439A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- mold
- die cleaning
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 57
- 239000011347 resin Substances 0.000 title claims abstract description 40
- 229920005989 resin Polymers 0.000 title claims abstract description 40
- 238000007789 sealing Methods 0.000 title description 3
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体樹脂封止金型の型掃除用リードフレーム
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame for cleaning a semiconductor resin mold.
一般に、半導体装置に樹脂封止全行うとき、半導体チッ
プを載置したリードフレームを上金型と下金型との間に
挿入して樹脂を注入しているが、これら金型に残った樹
脂を掃除するために、再度樹脂を注入して残りた樹脂の
掃除を行う型掃除用リードフレームが用いられている。Generally, when fully resin-sealing a semiconductor device, a lead frame with a semiconductor chip mounted on it is inserted between an upper mold and a lower mold and resin is injected, but the resin remaining in these molds is In order to clean the mold, a lead frame for mold cleaning is used, in which resin is injected again and the remaining resin is cleaned.
この半導体樹脂封止金型の型掃除リードフレーム（以下
型掃除リードフレームという）１０′は、第２図に示す
様に、金型のキャビティ部（３）の外形寸法Ｌ１と同じ
大きさの切抜き部２がリードフレーム１０′に切り抜か
れていた。As shown in FIG. 2, the mold cleaning lead frame (hereinafter referred to as mold cleaning lead frame) 10' of this semiconductor resin-sealed mold is a cutout having the same size as the external dimension L1 of the cavity part (3) of the mold. Section 2 was cut out into lead frame 10'.
第３図は下金型（１３）の平面図を示し、樹脂の注入せ
れるキャピテイ部３と、エアーペント４と、圧逃げ部５
と、ゲート６とをもった構成を示している。FIG. 3 shows a plan view of the lower mold (13), showing the cavity part 3 into which resin is injected, the air pent 4, and the pressure relief part 5.
A configuration having a gate 6 and a gate 6 is shown.
第４図は、この金型に掃除用リードフレームを用いた場
合の断面図である。これはキャビティ部１１を設けた上
金型１２と、下金型１３との間にリードフレーム１０挿
入してこの中に樹脂を注入し掃除を行っている。FIG. 4 is a sectional view when a cleaning lead frame is used in this mold. In this method, a lead frame 10 is inserted between an upper mold 12 provided with a cavity 11 and a lower mold 13, and a resin is injected into the lead frame for cleaning.
上述した従来の型掃除用リードフレームでは第３図のよ
うに、キャビティ部３の外形寸法で切抜き部を有してい
るので、空気を逃がすエアーペント４に型掃除用樹脂が
うすく浸入し、そのうすい樹脂が金型に残っていた。こ
のため次に型掃除用樹脂をキャビティ部内に充填させる
とき、うす〈残った樹脂７のためにキャビティ部３，１
１の中の空気が逃げきれず、正常な充填が出来ず、キャ
ビティ表面の汚れＫむらが生じていた。そのため、この
型掃除を行なうショット毎にエアーペントにつまったう
すい型掃除用樹脂を除去しなければならないという欠点
があった。As shown in FIG. 3, the conventional mold cleaning lead frame described above has a cutout in the outer dimensions of the cavity 3, so that the mold cleaning resin thinly infiltrates the air pent 4 through which air escapes. Resin remained in the mold. Therefore, when filling the mold cleaning resin into the cavity next time, it is necessary to fill the mold cleaning resin into the cavity parts 3 and 1.
The air inside No. 1 could not escape, and normal filling was not possible, resulting in uneven dirt and K on the surface of the cavity. Therefore, there is a drawback that the thin mold cleaning resin clogged in the air pen must be removed every time the mold is cleaned.
本発明の構成は、半導体装置の樹脂封止金型の型掃除を
行う型掃除用リードフレームに於いて、前記金型に型掃
除用樹脂を充填させるキャビティ部とこのキャビティ部
内の空気を逃がすエアーペントとを含む大きさの広い切
抜き部を設けたことにより、型掃除用樹脂がつまらない
様にした事を特徴とする。The present invention provides a mold cleaning lead frame for cleaning a resin-sealed mold of a semiconductor device, which includes a cavity portion for filling the mold with mold cleaning resin and an air pen for releasing air within the cavity portion. The mold cleaning resin is characterized by being provided with a wide cutout portion that includes the size of the mold so that the mold cleaning resin does not get stuck.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の平面図である。本実施例の
リードフレーム１０は、切抜き部ｌを、第３図のエアー
ペント４の領域まで広げて大きくしたものである。この
この型掃除リードフレーム１０は、第１図に示す様に、
キャビティ部３，１１０外形より大きくして圧逃げ部５
の近くまで切抜かれているので、型掃除用樹脂がエアー
ペント４を含むリードフレームの切抜かれた全域に広が
シ、エアーペント４に浸入したうすい樹脂をキャビティ
部３，１１と一体となって除去できる。FIG. 1 is a plan view of one embodiment of the present invention. In the lead frame 10 of this embodiment, the cutout l is enlarged to extend to the area of the air pent 4 in FIG. 3. This mold cleaning lead frame 10, as shown in FIG.
The pressure relief part 5 is made larger than the outer shape of the cavity part 3,110.
Since the mold cleaning resin is cut out close to the lead frame, the resin for mold cleaning spreads over the cutout area of the lead frame including the air pent 4, and the thin resin that has entered the air pent 4 can be removed together with the cavities 3 and 11. .
この型掃除用リードフレームを第４図のように上金型１
２と下金型１３とで挾んだ場合、従来の型掃除用リード
フレーム１０′は型掃除用樹脂がキャビティ部３，１１
の長さり、よシ長さり、の範囲まで流れ出し、エアーペ
ント４の範囲に薄く型掃除用樹脂が浸入していた。一方
、本実施例の型掃除用リードフレーム１０は、凰掃除用
樹脂がキャビティ部とエアーペント４との範囲を含めた
長さり、の範囲まで流れる様に切抜いているため、エア
ーペント４の範囲のりすいを掃除用樹脂が型掃除用リー
ドフレーム１０の厚み分厚くなって流れる。Place this lead frame for mold cleaning on the upper mold 1 as shown in Figure 4.
2 and the lower mold 13, the conventional mold cleaning lead frame 10' has a mold cleaning resin that is placed between the cavity parts 3 and 11.
The resin for mold cleaning had flowed out to the length of , and the resin for mold cleaning had penetrated into the area of the air pen 4 in a thin layer. On the other hand, the mold cleaning lead frame 10 of this embodiment is cut out so that the resin for mold cleaning flows to a length including the cavity part and the air pent 4. The cleaning resin flows as the thickness of the mold cleaning lead frame 10 becomes thicker.
従って型掃除用樹脂を除去するときにエアーペント４に
浸入した型掃除用樹脂もキャビティ部と一体となって除
去することが出来る。Therefore, when removing the mold cleaning resin, the mold cleaning resin that has entered the air pent 4 can also be removed together with the cavity portion.
以上説明したように本発明は、型掃除リードフレームの
切抜き部をエアーペントの領域まで広げたことにより、
型掃除用樹脂をキャビティ部に充填する毎にエアーペン
トの型掃除用樹脂のつまシを除去する必要がなくなシ、
型掃除用樹脂がキャビティ部内にまんべんなく充填され
、型掃除かむらなく出来るという効果がある。As explained above, the present invention extends the cutout portion of the mold cleaning lead frame to the area of the air pent.
There is no need to remove the mold cleaning resin tab of the air pen every time the mold cleaning resin is filled into the cavity.
The resin for mold cleaning is evenly filled into the cavity, and the mold can be cleaned evenly.
第１図は、本発明の一実゛漁例の型掃除用リードフレー
ムの平面図、第２図は従来の型掃除用リードフレームの
一例の平面図、第３図は樹脂封止金型の下金型の平面図
、第４図は型掃除用リードフレームを樹脂封止金型の上
金型と下金型で挾んだ状態の断面図である。
１．２・・・・・・型掃除用リードフレームきりぬき部
、３．１１・・・・・・キャビティ部、４・・・・・・
エアーペント、５・・・・・・圧逃げ部、６・・・・・
・ゲート、１０．１０’・・・・・・型掃除用リードフ
レーム、１２・・・・・・樹脂封止金型の代理人 弁理
士 内 原 曽 ノ貼 ４ 図Fig. 1 is a plan view of a mold cleaning lead frame as an example of the present invention, Fig. 2 is a plan view of an example of a conventional mold cleaning lead frame, and Fig. 3 is a plan view of an example of a conventional mold cleaning lead frame. FIG. 4 is a plan view of the lower mold, and a cross-sectional view of the mold cleaning lead frame sandwiched between the upper mold and the lower mold of the resin-sealed mold. 1.2... Lead frame cutout part for mold cleaning, 3.11... Cavity part, 4...
Air pen, 5... Pressure relief part, 6...
・Gate, 10.10'...Lead frame for mold cleaning, 12...Resin sealing mold representative Patent attorney So Uchihara 4 Figure
Claims (1)
ードフレームに於いて、前記金型に型掃除用樹脂を充填
させるキャビティ部とこのキャビティ部内の空気を逃が
すエアーペントとを含む大きさの広い切抜き部を設けた
ことにより、型掃除用樹脂がつまらない様にした事を特
徴とする樹脂封止金型の型掃除用リードフレーム。A mold cleaning lead frame for cleaning a resin-sealed mold for a semiconductor device has a size including a cavity portion for filling the mold with mold cleaning resin and an air pent for releasing air from the cavity portion. A mold cleaning lead frame for a resin-sealed mold, characterized by having a wide cutout so that the mold cleaning resin does not get stuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28639787A JPH01128439A (en) | 1987-11-11 | 1987-11-11 | Lead frame for cleaning resin sealing die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28639787A JPH01128439A (en) | 1987-11-11 | 1987-11-11 | Lead frame for cleaning resin sealing die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01128439A true JPH01128439A (en) | 1989-05-22 |
Family
ID=17703874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28639787A Pending JPH01128439A (en) | 1987-11-11 | 1987-11-11 | Lead frame for cleaning resin sealing die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01128439A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020028039A (en) * | 2000-10-06 | 2002-04-15 | 마이클 디. 오브라이언 | Dummy lead frame for cleaning molding die |
| JP2010010702A (en) * | 2000-08-04 | 2010-01-14 | Renesas Technology Corp | Method of manufacturing semiconductor device |
-
1987
- 1987-11-11 JP JP28639787A patent/JPH01128439A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010702A (en) * | 2000-08-04 | 2010-01-14 | Renesas Technology Corp | Method of manufacturing semiconductor device |
| KR20020028039A (en) * | 2000-10-06 | 2002-04-15 | 마이클 디. 오브라이언 | Dummy lead frame for cleaning molding die |
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