JPH01125557U - - Google Patents
Info
- Publication number
- JPH01125557U JPH01125557U JP1988020188U JP2018888U JPH01125557U JP H01125557 U JPH01125557 U JP H01125557U JP 1988020188 U JP1988020188 U JP 1988020188U JP 2018888 U JP2018888 U JP 2018888U JP H01125557 U JPH01125557 U JP H01125557U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- tungsten
- copper
- ceramics
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910001080 W alloy Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000011573 trace mineral Substances 0.000 claims 1
- 235000013619 trace mineral Nutrition 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988020188U JPH01125557U (enrdf_load_stackoverflow) | 1988-02-18 | 1988-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988020188U JPH01125557U (enrdf_load_stackoverflow) | 1988-02-18 | 1988-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01125557U true JPH01125557U (enrdf_load_stackoverflow) | 1989-08-28 |
Family
ID=31523283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988020188U Pending JPH01125557U (enrdf_load_stackoverflow) | 1988-02-18 | 1988-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01125557U (enrdf_load_stackoverflow) |
-
1988
- 1988-02-18 JP JP1988020188U patent/JPH01125557U/ja active Pending
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