JPH01121952U - - Google Patents
Info
- Publication number
- JPH01121952U JPH01121952U JP1721388U JP1721388U JPH01121952U JP H01121952 U JPH01121952 U JP H01121952U JP 1721388 U JP1721388 U JP 1721388U JP 1721388 U JP1721388 U JP 1721388U JP H01121952 U JPH01121952 U JP H01121952U
- Authority
- JP
- Japan
- Prior art keywords
- transparent
- semiconductor device
- chip
- synthetic resin
- sealing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000003566 sealing material Substances 0.000 claims 2
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 239000000057 synthetic resin Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案に係る半導体装置の実施例を示
す断面図、第２図は従来例を示す断面図、第３図
は第２図の従来例の改良試考例を示す断面図であ
る。 １……基板、２……ＩＣチツプ、４……カバー
系、４１……遮蔽枠、４１′……透光窓穴、４２
……透光フード、５……シール材料、Ｗ……透光
部。
す断面図、第２図は従来例を示す断面図、第３図
は第２図の従来例の改良試考例を示す断面図であ
る。 １……基板、２……ＩＣチツプ、４……カバー
系、４１……遮蔽枠、４１′……透光窓穴、４２
……透光フード、５……シール材料、Ｗ……透光
部。
Claims (1)
- ＩＣチツプへの透光を可能とする透光部を有す
る実装構造を備えた半導体装置において、合成樹
脂製の基板に載置したＩＣチツプ周りにＩＣチツ
プの上方を開放する透光窓穴を有する合成樹脂製
の遮蔽枠を設け、透光窓穴内全体に透明性、耐湿
性の高いシール材料を充填すると共に、シール材
料の上面に透光フードを埋込み支持したことを特
徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1721388U JPH01121952U (ja) | 1988-02-10 | 1988-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1721388U JPH01121952U (ja) | 1988-02-10 | 1988-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01121952U true JPH01121952U (ja) | 1989-08-18 |
Family
ID=31230794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1721388U Pending JPH01121952U (ja) | 1988-02-10 | 1988-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01121952U (ja) |
-
1988
- 1988-02-10 JP JP1721388U patent/JPH01121952U/ja active Pending