JPH01119983A - 半導体集積回路 - Google Patents

半導体集積回路

Info

Publication number
JPH01119983A
JPH01119983A JP62276264A JP27626487A JPH01119983A JP H01119983 A JPH01119983 A JP H01119983A JP 62276264 A JP62276264 A JP 62276264A JP 27626487 A JP27626487 A JP 27626487A JP H01119983 A JPH01119983 A JP H01119983A
Authority
JP
Japan
Prior art keywords
circuit
input
signal
capacitor
level
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62276264A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563879B2 (enrdf_load_stackoverflow
Inventor
Yoshimi Shiba
斯波　芳美
Tadahiro Kuroda
忠広 黒田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Device Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectronics Corp filed Critical Toshiba Corp
Priority to JP62276264A priority Critical patent/JPH01119983A/ja
Publication of JPH01119983A publication Critical patent/JPH01119983A/ja
Publication of JPH0563879B2 publication Critical patent/JPH0563879B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • B29C45/4225—Take-off members or carriers for the moulded articles, e.g. grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/7207—Heating or cooling of the moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/7207—Heating or cooling of the moulded articles
    • B29C2045/7214—Preform carriers for cooling preforms

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Static Random-Access Memory (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
  • Robotics (AREA)
JP62276264A 1987-10-31 1987-10-31 半導体集積回路 Granted JPH01119983A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62276264A JPH01119983A (ja) 1987-10-31 1987-10-31 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62276264A JPH01119983A (ja) 1987-10-31 1987-10-31 半導体集積回路

Publications (2)

Publication Number Publication Date
JPH01119983A true JPH01119983A (ja) 1989-05-12
JPH0563879B2 JPH0563879B2 (enrdf_load_stackoverflow) 1993-09-13

Family

ID=17567013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62276264A Granted JPH01119983A (ja) 1987-10-31 1987-10-31 半導体集積回路

Country Status (1)

Country Link
JP (1) JPH01119983A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008534884A (ja) * 2005-03-29 2008-08-28 ノーグレン・インコーポレーテッド 拡張可能な気体又は液体分配システム
JP2017073186A (ja) * 2015-10-08 2017-04-13 エスアイアイ・セミコンダクタ株式会社 不揮発性記憶装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008534884A (ja) * 2005-03-29 2008-08-28 ノーグレン・インコーポレーテッド 拡張可能な気体又は液体分配システム
JP2017073186A (ja) * 2015-10-08 2017-04-13 エスアイアイ・セミコンダクタ株式会社 不揮発性記憶装置

Also Published As

Publication number Publication date
JPH0563879B2 (enrdf_load_stackoverflow) 1993-09-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees