JPH01119744A - Inspecting apparatus of external appearance of semiconductor device - Google Patents

Abstract

PURPOSE:To enable the precise inspection of the shape, size, etc. of a lead of a semiconductor device, by giving luster to a sliding surface of a conveyance rail for the semiconductor device. CONSTITUTION:A semiconductor device 1 sliding on a conveyance rail 7 is detected by a sensor. An illumination 4 is flashed by a detection signal, and thereby a lead surface 1a of the semiconductor device 1 and a sliding surface 7a of the conveyance rail 7 are illuminated. A reflected light from the lead surface 1a and a reflected light from the sliding surface 7a of the conveyance rail 7 are picked up by a TV camera 5. Images thus obtained are sent as signals to an inspection processing device 6 and binary images are prepared. In the inspection processing device 6, the turning (inclination) of the semiconductor device within the conveyance rail 7 is calculated from a rail-reflected image, the prepared binary image, so as to correct the rotation of the semiconductor device 1. Thereafter a lead-reflected image is inspected to check up the shape and size of a lead. Classification into a good or bad article is conducted in accordance with the result of inspection. By this method, the shape, size, etc. of the lead of the semiconductor device can be inspected precisely.

Description

[Detailed Description of the Invention] [Field of Industrial Application] This invention is an external inspection method in which a semiconductor device is illuminated and an image is taken at the same time, and the shape of the lead and human flaws are inspected using the image. bσ is thinned out to trz.

[Conventional technology]

FIG. 8 shows the main parts of a conventional appearance inspection apparatus for semiconductor devices. In the figure, 1 is the "P conductor device to be inspected, 1a is the lead of the semiconductor device l, 2 is the inclined transport rail that guides the semiconductor device 1'E, and 2a is the "P/j body: lO device 1 device transport rail. 2 guided by γ1. The width of the groove of the transport rail 2 is larger than the brocade of the part where the wires are connected, 3 points 3b are sensors for detecting the semiconductor device 1, 4 is a light that illuminates the leads la of the semiconductor device 1 from above, and 5 is a light that illuminates the leads 1a of the semiconductor device 1. This is an inspection device t'j that inspects the shape, size, etc. of the lead la of the semiconductor device 1 using the TV camera 5 that takes pictures from the upper hole.

Next, the operation will be explained. The rice conductor device l sliding from the upstream side of the rail 2 to the conveyor is detected by the sensor 3a3b. Detection (I flashes light from the lead 1a of the semiconductor device 1, and at the same time, the reflected light from the lead 1a of the semiconductor device 1 is photographed as an image by the TV camera 5. The captured image is sent as a signal to the inspection processing device 6, where it is inspected for the shape and size of the γL1 lead. Depending on the inspection result (good product, defective product), the semiconductor device 1 is classified by a classification mechanism (not shown). to classify.

Here, ]3? The feed rail 2 has l! so as not to affect the shooting of the lead la. Does not reflect to t + light 5,
It is black or decorated.

[Problem to be solved] The appearance inspection device for inspecting the lead shape and size of semiconductor devices is configured as described above (1) and is small, so it cannot slide inside the conveyance rail. Is it the front width of the transport rail for semiconductor equipment?
Since the lead device is larger than the guided FW, it rotates within the carry-in rail while sliding, and the image taken in the inspection department may be tilted. There was a problem with poor test accuracy. 'J: Since the transport rail is coated with a black color that does not reflect light so as not to affect photography, the problem is that due to the semiconductor device sliding, it is not possible to check whether the sliding m1 is black or tL1 can be properly calibrated. was there.

This guard I (11 is the above-mentioned problem? It was made to solve the problem, and it can be used to check the head of the semiconductor device in the σ-groove of the transport rail, and to inspect the shape and size of the leads. In terms of accuracy, the present invention is to provide an appearance inspection device for inspecting the shape and size of leads of semiconductor devices, which eliminates the problem of the influence of black metal on the sliding surface of the transport rail on the inspection. Purpose and T.

[Means for solving problems]

The visual inspection apparatus for inspecting the shape, size, etc. of leads according to the present invention is installed in the inspection section of the present invention, and is installed in the groove of the transport rail of the semiconductor device, which has a groove larger than every 1h of the semiconductor device. #? One or more protruding sliding surfaces are formed parallel to the traveling direction of the semiconductor device on the inside of the opposing leads of the conductor device and on the inside of the semiconductor device [q], and the sliding surface is glossy. The length is 1m.

[Effect]

In this invention, the glossy surface of the sliding surface of the transport rail is
Due to the conductor bag (semiconductor device package and T tilt), it was photographed by a TV camera as a reflected image of the lighting.
Since the position of the semiconductor device changes, the rotation (tilt) of the semiconductor device within the groove of the transport rail can be determined by calculating the reflected image of the glossy surface using an inspection processing device.

〔Example〕

An embodiment of the present invention will now be described with reference to the drawings.

In FIG. 1, reference numeral 7 indicates an inclined transport rail that guides the semiconductor device l, 7a indicates the groove width of the transport rail 7, which has a large width area for the items on which the semiconductor device l is guided by the transport rail 7, and 7b41 semiconductors. Even if the device 1 rotates within the groove width 7a, it protrudes inside the opposing T-IJ-do of the semiconductor device 1 and inside the package width of the semiconductor device, and extends parallel to the traveling direction of the semiconductor device 1. These are two gliding surfaces formed with γ, and are glossy so as to reflect the illumination 4.

On both sides of the two slides @7b, there are slides @7c and 7d, respectively. The transport rail 7, except for its sliding surface 7b, is painted black so as not to reflect on the illumination 4.

FIG. 2 shows that the TV camera 5 simultaneously photographs lK4K2O2 light in the inspection section, and the light is processed by the inspection processing device 6.
(This is an image 1a. 8 is a 2 (iil-image) of the reflected light from the bend capital of the lead 1a of the semiconductor device 1, and 9 is a binary image of the reflected light from the sliding surface (glossy surface) 71) .

Next, the operation will be explained. The semiconductor device 1 sliding on the transport rail 7 is detected by a sensor (not shown). The detection signal causes the illumination 4 to flash, and the lead surface 1a of the semiconductor device 1 and the sliding surface 7a of the transport rail 7 are illuminated. The reflected light from the lead surface 1a and the reflected light from the sliding surface 7a of the conveyor rail 7 are photographed by the TV camera 5 as images. A plane image (Fig. 8) is created.In the inspection processing device 6, the rotation (tilt) of the device within the transport rail 7 is calculated from the rail reflection image 9 of the created binary image. , the lead reflection image 8 is inspected, and the shape and size of the lead are inspected on the 2 that corrects the rotation of the semiconductor device 1. According to the inspection result (good product, defective product), a classification mechanism ( Chihiro Taisen I1 is classified according to the following.

In the above embodiment, the appearance inspection of a semiconductor device sliding on an inclined conveyance rail was described, but the present invention can also be applied to the appearance inspection of a semiconductor device carried by forced conveyance on a horizontal conveyance rail. .

Furthermore, in the above embodiment, a case was described in which a protruding sliding surface 2 (j) was formed in the groove of the transport rail parallel to the direction of movement of the semiconductor device, and the sliding surface was made into a glossy surface.
T: Is it a sliding surface with 8 or more protrusions? You can make money.

〔Effect of the invention〕

As described above, according to the present invention, since the sliding surface of the transport rail for semiconductor devices is a glossy surface, by calculating the image of the glossy surface with an inspection processing device, The rotation (tilt) can be determined, and the shape and size of the lead of the semiconductor device can be inspected after correcting the rotation of the semiconductor device, so the inspection accuracy is the same as above. Semiconductor devices must be coated with a black color that does not reflect light.
(') Due to light running, the sliding surface is worn out, and the surface is black.
This has the effect of eliminating the problem of not being able to perform tests.

[Brief explanation of the drawing]

Fig. 1 is a 1-meter schematic diagram of the main parts of a semiconductor device appearance inspection system using the G''L book. 1 is a schematic perspective view of the main parts of an external appearance inspection apparatus for a #body device. In the figure, 1&''L semiconductor device;
- code, 3a, 3b 61 sensor, 4 is lighting, 5 is TV camera, 6 is inspection processing device, 7&'L transport rail, 7a is groove width, 7b G'L sliding surface (glossy surface), 7c17a is groove, 8 is a binary image of the lead reflection, and 9 is a 24IIi image of the rail reflection.

Claims (1)

[Claims] An illumination device that illuminates the lead portion of a semiconductor device, a TV camera that photographs the reflected light of the illumination from the lead portion, and an image processing device that detects the shape and hole size of the lead from the image taken by the camera. In the external appearance inspection apparatus for semiconductor devices, the groove is located inside the opposing leads of the semiconductor device and wider than the package width of the semiconductor device, within the groove of the semiconductor device transport rail having a groove larger than the width of the semiconductor device. 1. An external appearance inspection device for a semiconductor device, characterized in that one or more protruding sliding surfaces are formed on the inside parallel to the traveling direction of the semiconductor device, and the sliding surface is a glossy surface.