JPH05256619A - Measuring method for coat quantity of cream solder - Google Patents

Measuring method for coat quantity of cream solder

Info

Publication number
JPH05256619A
JPH05256619A JP5255792A JP5255792A JPH05256619A JP H05256619 A JPH05256619 A JP H05256619A JP 5255792 A JP5255792 A JP 5255792A JP 5255792 A JP5255792 A JP 5255792A JP H05256619 A JPH05256619 A JP H05256619A
Authority
JP
Japan
Prior art keywords
cream solder
line sensor
substrate
volume
conveyor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5255792A
Other languages
Japanese (ja)
Inventor
Takashige Sakai
隆茂 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5255792A priority Critical patent/JPH05256619A/en
Publication of JPH05256619A publication Critical patent/JPH05256619A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide a method capable of simply measuring the coat quantity of the cream solder coated on a substrate with a line sensor. CONSTITUTION:A line sensor 5 is used in place of an area type CCD camera as an optical system. A substrate 1 coated with cream solder 2 is conveyed by a conveyor 3, light is radiated from slant above to generate a shade section 6 behind the cream solder 2, and the length of the shade section 6 is detected by the line sensor 5. The plane area of the cream solder 2 is obtained based on the image data having the intensity received by the line sensor 5, and the obtained plane area is multiplied by thickness to determine the volume of the cream solder 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はクリーム半田の塗布量の
測定方法に係り、詳しくは、基板に塗布されたクリーム
半田の体積を、ラインセンサにより簡単に求めるための
方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring the amount of cream solder applied, and more particularly to a method for easily determining the volume of cream solder applied to a substrate by a line sensor.

【0002】[0002]

【従来の技術】IC、LSI、コンデンサチップ、抵抗
チップ等の電子部品は、スクリーン印刷機により基板に
クリーム半田を塗布した後、このクリーム半田上に電極
を着地させ、更にクリーム半田を加熱処理して固化させ
ることにより搭載される。
2. Description of the Related Art For electronic parts such as ICs, LSIs, capacitor chips, and resistance chips, cream solder is applied to a substrate by a screen printing machine, electrodes are landed on the cream solder, and then the cream solder is heat-treated. It is mounted by solidifying it.

【0003】この場合、クリーム半田の塗布量が過多で
あると、半田ブリッジを生じて回路の短絡を生じやす
く、またクリーム半田の塗布量が過少であると、電極は
基板にしっかり接着でぎず、導通不良となる。そこでス
クリーン印刷機により基板にクリーム半田を塗布した
後、クリーム半田の塗布量の良否を判定する検査が行わ
れる。
In this case, if the amount of cream solder applied is too large, a solder bridge is likely to occur to cause a short circuit in the circuit, and if the amount of cream solder applied is too small, the electrodes cannot be firmly adhered to the substrate, There will be poor continuity. Therefore, after applying the cream solder to the substrate by the screen printing machine, an inspection is performed to determine whether the application amount of the cream solder is good or bad.

【0004】クリーム半田の塗布量の自動検査手段とし
て、エリア型CCDを備えたカメラによる方法が知られ
ている。この方法は、基板に向かって光を照射してカメ
ラで観察し、カメラに取り込まれた平面画像の輝度分布
からクリーム半田の平面積を求め、この平面積の大きさ
からクリーム半田の塗布量の良否をコンピュータにより
判定するようになっていた。
As a means for automatically inspecting the amount of cream solder applied, a method using a camera equipped with an area CCD is known. This method irradiates the substrate with light and observes it with a camera, obtains the plane area of the cream solder from the luminance distribution of the planar image captured by the camera, and determines the application amount of the cream solder from the size of this plane area. The quality was judged by a computer.

【0005】[0005]

【発明が解決しようとする課題】しかしながらエリア型
CCDカメラは、基板の輝度分布を平面情報として一括
して取り込み、コンピュータで画像処理することから、
画像処理にかなりの時間を要し、検査速度が遅いという
問題点があった。
However, since the area CCD camera collectively captures the luminance distribution of the substrate as plane information and performs image processing by a computer,
There is a problem that the image processing requires a considerable time and the inspection speed is slow.

【0006】またエリア型CCDカメラは、平面情報す
なわちクリーム半田の平面積は入手できるが、高さ情報
すなわちクリーム半田の厚さは入手できないため、クリ
ーム半田の体積(平面積×厚さ)を求めることはでき
ず、平面積に基づいて塗布量の良否を判定せねばならな
いことから、判定結果の信頼性が高くないという問題点
があった。
The area type CCD camera can obtain the plane information, that is, the plane area of the cream solder, but cannot obtain the height information, that is, the thickness of the cream solder. Therefore, the volume (plane area × thickness) of the cream solder is obtained. However, since the quality of the coating amount must be determined based on the plane area, there is a problem that the reliability of the determination result is not high.

【0007】そこで本発明は、クリーム半田の塗布量を
正確且つ迅速に求めることができる手段を提供すること
を目的とする。
[0007] Therefore, an object of the present invention is to provide means for accurately and promptly obtaining the application amount of cream solder.

【0008】[0008]

【課題を解決するための手段】このために本発明は、光
学系としてエリア型CCDカメラに替えて、ラインセン
サを使用する。そしてクリーム半田が塗布された基板を
コンベアにより搬送しながら、斜上方から光を照射して
クリーム半田の背後に影部を生じさせ、この影部の長さ
を、ラインセンサにより検出する。また基板の搬送にと
もなってラインセンサに取り込まれた輝度の画像データ
からクリーム半田の平面積を求め、求められた平面積と
厚さを乗算することにより、クリーム半田の体積を求め
る。
To this end, the present invention uses a line sensor instead of an area CCD camera as an optical system. Then, while the substrate coated with the cream solder is being conveyed by the conveyor, light is radiated obliquely from above to form a shadow portion behind the cream solder, and the length of the shadow portion is detected by the line sensor. Further, the plane area of the cream solder is obtained from the image data of the luminance taken into the line sensor as the substrate is transported, and the obtained plane area is multiplied by the thickness to obtain the volume of the cream solder.

【0009】[0009]

【作用】上記構成によれば、基板をコンベアにより搬送
しながら、ラインセンサによりクリーム半田の厚さと平
面積を求めて、この厚さと平面積の積からクリーム半田
の体積すなわち塗布量を求め、塗布量の良否を判定する
ことができる。
According to the above structure, while the substrate is being conveyed by the conveyor, the thickness and the plane area of the cream solder are obtained by the line sensor, and the volume of the cream solder, that is, the application amount is obtained from the product of the thickness and the plane area, and the application is performed. The quality of the quantity can be determined.

【0010】[0010]

【実施例】次に、図面を参照しながら本発明の実施例を
説明する。図1はクリーム半田の塗布量の測定装置の全
体斜視図である。1は基板であり、スクリーン印刷機に
よりクリーム半田2が塗布されている。クリーム半田2
の形状は通常、図示するように箱型である。3は基板1
を右方へ搬送するコンベアである。
Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is an overall perspective view of an apparatus for measuring the amount of cream solder applied. Reference numeral 1 is a substrate on which cream solder 2 is applied by a screen printing machine. Cream solder 2
The shape is usually box-shaped as shown. 3 is substrate 1
Is a conveyer that conveys to the right.

【0011】コンベア3の上方には、棒状の光源4(4
a,4b)と、ラインセンサ5(5a,5b)が、それ
ぞれの長手方向をコンベア3の搬送方向と直交する方向
に向けて配設されている。後に詳述するように、コンベ
ア3により基板1を搬送しながら、斜上方から基板1に
向かって光を照射し、クリーム半田2の背後に生じる影
部6(6a,6b)をラインセンサ5により検出して、
クリーム半田2の体積を測定する。7は互いの光源4
a,4bの光を遮光する衝立である。本実施例では、光
源4とラインセンサ5は、左右に2組設けられており、
左方の光源4aとラインセンサ5aにより、進行方向の
前側の影部6aを測定し、右方の光源4bとラインセン
サ5bにより、同後側の影部6bを測定する。
Above the conveyor 3, a rod-shaped light source 4 (4
a, 4b) and the line sensor 5 (5a, 5b) are arranged with their longitudinal directions oriented in a direction orthogonal to the conveying direction of the conveyor 3. As will be described in detail later, while the substrate 1 is being conveyed by the conveyor 3, light is radiated toward the substrate 1 from obliquely above, and the shadow portions 6 (6a, 6b) generated behind the cream solder 2 are detected by the line sensor 5. Detect and
The volume of the cream solder 2 is measured. 7 is a mutual light source 4
This is a screen for blocking the light of a and 4b. In this embodiment, two sets of the light source 4 and the line sensor 5 are provided on the left and right,
The light source 4a on the left side and the line sensor 5a measure the shadow portion 6a on the front side in the traveling direction, and the light source 4b on the right side and the line sensor 5b measure the shadow portion 6b on the rear side.

【0012】図2は左方の光源4aとラインセンサ5a
により、クリーム半田2の前側の影部6aを測定してい
る状態の側面図である。光源4aから照射された光はク
リーム半田2で遮られ、その前側に影部6aが生じるの
で、この影部6aの長さをラインセンサ5aで検出す
る。θは光の照射角度である。
FIG. 2 shows a left light source 4a and a line sensor 5a.
FIG. 6 is a side view showing a state where the shadow portion 6a on the front side of the cream solder 2 is being measured by. The light emitted from the light source 4a is blocked by the cream solder 2, and a shadow portion 6a is formed on the front side of the cream solder 2. Therefore, the length of the shadow portion 6a is detected by the line sensor 5a. θ is the irradiation angle of light.

【0013】図3は、クリーム半田2を含むエリアの輝
度の画像データAを示している。8はラインセンサ5a
の受光素子である。クリーム半田2は白っぽい金属質で
あり、光の反射率は高いので、ラインセンサ5aには強
い光が入射し、明るい輝度となる。また影部6aからは
光は殆ど入射せず、その輝度はきわめて低い。またクリ
ーム半田2の周囲の基板1は、中間輝度となる。図4及
び図5は、右方の光源4bとラインセンサ5bにより、
クリーム半田2の後側の影部6bを測定している状態
と、その画像データBを示している。この画像データ
A,Bは、基板1をコンベア3で搬送しながら、その反
射光をラインセンサ5a,5bで受光することにより得
られる。
FIG. 3 shows the image data A of the luminance of the area including the cream solder 2. 8 is a line sensor 5a
Is a light receiving element. Since the cream solder 2 is a whitish metallic material and has a high light reflectance, strong light is incident on the line sensor 5a, resulting in bright brightness. Moreover, almost no light is incident from the shadow portion 6a, and the brightness thereof is extremely low. The substrate 1 around the cream solder 2 has intermediate brightness. 4 and 5 show that the light source 4b on the right side and the line sensor 5b
The state where the shadow portion 6b on the rear side of the cream solder 2 is being measured and its image data B are shown. The image data A and B are obtained by receiving the reflected light by the line sensors 5a and 5b while the substrate 1 is being conveyed by the conveyor 3.

【0014】次にクリーム半田2の体積の求め方を説明
する。図3において、クリーム半田2の在るべき座標X
i,Yiと、クリーム半田2の輝度の下限値Paと上限
値Pbを設定する。また影部6を検出するしきい値とな
る基準値Pdを設定する。
Next, how to obtain the volume of the cream solder 2 will be described. In FIG. 3, the coordinate X where the cream solder 2 should be
i, Yi, and the lower limit value Pa and the upper limit value Pb of the brightness of the cream solder 2 are set. Further, a reference value Pd which is a threshold value for detecting the shadow portion 6 is set.

【0015】次に、輝度Pa以上、Pb以下の画素数S
iをカウントし、クリーム半田2の平面積を求める。ま
たクリーム半田2よりもX正方向に隣接するPd以下の
領域(すなわち影部6a)のX方向の画素数の平均値L
iを求める。
Next, the number S of pixels having a brightness of Pa or more and Pb or less
i is counted and the plane area of the cream solder 2 is obtained. In addition, the average value L of the number of pixels in the X direction of the area of Pd or less (that is, the shadow portion 6a) that is adjacent to the cream solder 2 in the X positive direction is L
Find i.

【0016】同様にして、図5に示す画像データBか
ら、Pa以上Pb以下の画素数Si’をカウントしてク
リーム半田2の平面積を求め、またX負方向に隣接する
Pd以下の領域(すなわち影部6b)のX方向の画素数
の平均値Li’を求める。すると、クリーム半田2の体
積Viは次式となる。
Similarly, from the image data B shown in FIG. 5, the number of pixels Si ′ of Pa or more and Pb or less is counted to obtain the plane area of the cream solder 2, and the area of Pd or less (adjacent to the X negative direction) That is, the average value Li ′ of the number of pixels in the shadow portion 6b) in the X direction is obtained. Then, the volume Vi of the cream solder 2 is given by the following equation.

【0017】 Vi=a(Si+Si’)(Li+Li’) この式は数1から求められる。Vi = a (Si + Si ′) (Li + Li ′) This equation is obtained from the equation 1.

【0018】[0018]

【数1】 [Equation 1]

【0019】この数1は、クリーム半田2の平面積Si
とSi’の平均値と、クリーム半田2の厚さLitan
θとLi’tanθの平均値を乗算して積を求めるもの
である。このようにして求められたクリーム半田2の体
積Viを予め設定された判定値と比較することにより、
クリーム半田2の塗布量の良否を判定する。なお、上記
のような演算や良否判定はコンピュータにより行われ
る。
This number 1 is the plane area Si of the cream solder 2.
And Si 'average value, and the thickness of cream solder 2 Litan
The product is obtained by multiplying the average value of θ and Li'tan θ. By comparing the volume Vi of the cream solder 2 thus obtained with a preset determination value,
The quality of the applied amount of cream solder 2 is determined. It should be noted that the above-described calculation and pass / fail judgment are performed by a computer.

【0020】本方法は、基板1をコンベア3により搬送
しながら、クリーム半田2の体積Viを求めるのに必要
な画像データA,Bをラインセンサ5により入手でき、
しかも簡単な演算により、体積Viを求めることができ
る。また1組の光源4とラインセンサ5の画像データに
より、体積を求めてもよいが、本実施例のように、2組
の光源4a,4bとラインセンサ5a,5bにより、2
つの画像データA,Bを入手し、数1に示すように、ク
リーム半田2の平面積の平均値1/2(Si+Si’)
や平均厚さ1/2(Li+Li’)tanθを求めれ
ば、より正確にクリーム半田2の体積Viを求めること
ができる。またこの方法によれば、図6に示すように、
クリーム半田2の上面が傾斜して台形の場合も、その体
積を正確に求めることができる。
In this method, the line sensor 5 can obtain the image data A and B necessary for obtaining the volume Vi of the cream solder 2 while the substrate 1 is being conveyed by the conveyor 3.
Moreover, the volume Vi can be obtained by a simple calculation. Further, the volume may be obtained from the image data of one set of the light source 4 and the line sensor 5.
Obtain two image data A and B, and as shown in the equation 1, the average value of the plane area of the cream solder 2 is 1/2 (Si + Si ′).
If the average thickness 1/2 (Li + Li ') tan θ is calculated, the volume Vi of the cream solder 2 can be calculated more accurately. According to this method, as shown in FIG.
Even if the upper surface of the cream solder 2 is inclined and has a trapezoidal shape, its volume can be accurately obtained.

【0021】本方法によれば、スクリーン印刷機による
クリーム半田2の塗布が不調で、その形状が異形になっ
た場合も、体積を正確に求めることができる。次にその
一例を説明する。図7に示すクリーム半田2は三角錐形
になっている。図8は図1に示す左方の光源4aとライ
ンセンサ5aによるこのクリーム半田2の画像データ
A,図9は右方の光源とラインセンサ5bによる画像デ
ータBを示している。画像データAには三角形の影部6
aが生じるが、画像データBには影部は生じない。図1
0は体積Viの3つの演算方法(イ)(ロ)(ハ)を示
している。まず(イ)分割なしを説明する。この場合、
Si=Si’であり、また影部6aの平均長Li=L/
2,Li=0である。したがって図中に示す計算式によ
り、体積Vi=0.25×SiLtanθが求められ
る。ここで、三角錐のクリーム半田2の理論上の体積V
は数2である。
According to this method, the volume can be accurately obtained even when the cream solder 2 applied by the screen printing machine is improper and its shape becomes irregular. Next, an example thereof will be described. The cream solder 2 shown in FIG. 7 has a triangular pyramid shape. FIG. 8 shows image data A of the cream solder 2 by the light source 4a on the left side and the line sensor 5a shown in FIG. 1, and FIG. 9 shows image data B by the light source on the right side and the line sensor 5b. Image data A has a triangular shadow 6
Although a occurs, the image data B does not have a shadow. Figure 1
0 indicates three calculation methods (a), (b), and (c) of the volume Vi. First, (a) no division will be described. in this case,
Si = Si ′, and the average length Li = L / of the shadow portion 6a
2, Li = 0. Therefore, the volume Vi = 0.25 × SiLtan θ can be obtained by the calculation formula shown in the figure. Here, the theoretical volume V of the triangular pyramid cream solder 2
Is the number 2.

【0022】[0022]

【数2】 [Equation 2]

【0023】したがって誤差は数3となる。Therefore, the error becomes the equation 3.

【0024】[0024]

【数3】 [Equation 3]

【0025】このように分割せずに体積Viを求める
と、誤差はかなり大きくなり、良否判定も狂いを生じる
こととなる。図10の(ロ)2分割はこの誤差を小さく
するための計算方法を示している。この場合、SiをS
1とS2に2分割し、それぞれの影部6aの平均長さL
1=3/4L,L2=1/4Lを求め、更にこれから体
積V1,V2を求め、その和を求める。図中に示すよう
に Vi=V1+V2=0.31×SiLtanθ である。したがって誤差V−Vi=0.02×SiLt
anθとなり、(イ)分割なしの場合よりもかなり小さ
くなる。(ハ)3分割にすれば図10に示すように誤差
は0.01×SiLtanθとなって更に小さくなる。
このようにY方向に領域を分割し、分割した領域毎に体
積を計算して合計すれば、誤差を小さくして、適正な良
否判断を行うことができる。
If the volume Vi is obtained without dividing in this way, the error will be considerably large and the quality judgment will be incorrect. The (2) division into two in FIG. 10 shows a calculation method for reducing this error. In this case, Si is S
1 and S2, and the average length L of each shadow part 6a
1 = 3 / 4L and L2 = 1 / 4L are obtained, and then the volumes V1 and V2 are obtained, and the sum thereof is obtained. As shown in the figure, Vi = V1 + V2 = 0.31 × SiLtan θ. Therefore, the error V−Vi = 0.02 × SiLt
It becomes anθ, which is considerably smaller than the case without (a) division. (C) If divided into three, the error becomes 0.01 × SiLtan θ, as shown in FIG. 10, and becomes smaller.
By dividing the region in the Y direction in this way and calculating and summing the volume for each divided region, the error can be reduced and appropriate pass / fail judgment can be performed.

【0026】[0026]

【発明の効果】以上説明したように本発明は、基板をコ
ンベアにより搬送しながら、クリーム半田の背後に生じ
た影部をラインセンサにより検出するようにしているの
で、クリーム半田の平面積と厚さを簡単な手法により検
出して塗布量を求め、その良否を適正に判定できる。
As described above, according to the present invention, while the substrate is being conveyed by the conveyor, the shadow area formed behind the cream solder is detected by the line sensor. It is possible to detect the quality by a simple method, obtain the coating amount, and properly judge the quality.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係るクリーム半田の塗布量の測定装置
の斜視図
FIG. 1 is a perspective view of an apparatus for measuring the amount of cream solder applied according to the present invention.

【図2】本発明に係る測定中の側面図FIG. 2 is a side view during measurement according to the present invention.

【図3】本発明に係る画像データ図FIG. 3 is an image data diagram according to the present invention.

【図4】本発明に係る測定中の側面図FIG. 4 is a side view during measurement according to the present invention.

【図5】本発明に係る画像データ図FIG. 5 is an image data diagram according to the present invention.

【図6】本発明に係る測定中の側面図FIG. 6 is a side view during measurement according to the present invention.

【図7】本発明に係るクリーム半田の斜視図FIG. 7 is a perspective view of cream solder according to the present invention.

【図8】本発明に係るクリーム半田の画像データ図FIG. 8 is an image data diagram of cream solder according to the present invention.

【図9】本発明に係るクリーム半田の画像データ図FIG. 9 is an image data diagram of cream solder according to the present invention.

【図10】本発明に係るクリーム半田の体積測定の説明
FIG. 10 is an explanatory diagram of volume measurement of cream solder according to the present invention.

【符号の説明】[Explanation of symbols]

1 基板 2 クリーム半田 3 コンベア 4 光源 5 ラインセンサ 1 substrate 2 cream solder 3 conveyor 4 light source 5 line sensor

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】クリーム半田が塗布された基板をコンベア
により搬送しながら、斜上方から光を照射してクリーム
半田の背後に影部を生じさせ、この影部の長さを、上記
コンベアの上方にあってその長手方向を搬送方向と直交
する方向に向けて配設されたラインセンサにより検出
し、検出された影部の長さに基づいて上記クリーム半田
の厚さを求めるとともに、上記コンベアによる搬送にと
もなって上記ラインセンサに取り込まれた輝度の画像デ
ータから上記クリーム半田の平面積を求め、求められた
平面積と厚さを乗算することにより、クリーム半田の体
積を求めることを特徴とするクリーム半田の塗布量の測
定方法。
1. A substrate coated with cream solder is conveyed by a conveyor while irradiating light obliquely from above to form a shadow portion behind the cream solder, and the length of this shadow portion is defined as the length above the conveyor. Detected by a line sensor disposed in the longitudinal direction of the line sensor in a direction orthogonal to the transport direction, the thickness of the cream solder is obtained based on the length of the detected shadow portion, and by the conveyor. It is characterized in that the plane area of the cream solder is obtained from the image data of the brightness taken in by the line sensor during transportation, and the volume of the cream solder is obtained by multiplying the obtained plane area and the thickness. How to measure the amount of cream solder applied.
JP5255792A 1992-03-11 1992-03-11 Measuring method for coat quantity of cream solder Pending JPH05256619A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5255792A JPH05256619A (en) 1992-03-11 1992-03-11 Measuring method for coat quantity of cream solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5255792A JPH05256619A (en) 1992-03-11 1992-03-11 Measuring method for coat quantity of cream solder

Publications (1)

Publication Number Publication Date
JPH05256619A true JPH05256619A (en) 1993-10-05

Family

ID=12918122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5255792A Pending JPH05256619A (en) 1992-03-11 1992-03-11 Measuring method for coat quantity of cream solder

Country Status (1)

Country Link
JP (1) JPH05256619A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1058649A (en) * 1996-08-22 1998-03-03 Sanyo Electric Co Ltd Recognizing method for solder paste and screen printer
JP2002168610A (en) * 2000-12-01 2002-06-14 Nagoya Electric Works Co Ltd Shape inspection method for solder, and its device
JP2009256000A (en) * 2008-04-11 2009-11-05 Brother Ind Ltd Thickness detection device
JP2013052315A (en) * 2011-08-31 2013-03-21 Taisei Corp Large lump to be conveyed detecting system
JP2013157568A (en) * 2012-01-31 2013-08-15 Sony Corp Inspection device, inspection method, and substrate manufacturing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1058649A (en) * 1996-08-22 1998-03-03 Sanyo Electric Co Ltd Recognizing method for solder paste and screen printer
JP2002168610A (en) * 2000-12-01 2002-06-14 Nagoya Electric Works Co Ltd Shape inspection method for solder, and its device
JP4685233B2 (en) * 2000-12-01 2011-05-18 名古屋電機工業株式会社 Solder shape inspection method and apparatus
JP2009256000A (en) * 2008-04-11 2009-11-05 Brother Ind Ltd Thickness detection device
JP2013052315A (en) * 2011-08-31 2013-03-21 Taisei Corp Large lump to be conveyed detecting system
JP2013157568A (en) * 2012-01-31 2013-08-15 Sony Corp Inspection device, inspection method, and substrate manufacturing method

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