JPH01115246U - - Google Patents
Info
- Publication number
- JPH01115246U JPH01115246U JP1100388U JP1100388U JPH01115246U JP H01115246 U JPH01115246 U JP H01115246U JP 1100388 U JP1100388 U JP 1100388U JP 1100388 U JP1100388 U JP 1100388U JP H01115246 U JPH01115246 U JP H01115246U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- power transistor
- metal plate
- semiconductor pellet
- sealed power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案の一実施例による樹脂封止パ
ワートランジスタを示すもので、同図ａは上面透
視図、同図ｂは縦断面図である。第２図は、従来
の樹脂封止パワートランジスタを示すもので、同
図ａは上面透視図、同図ｂは縦断面図である。 １……金属板、２……半導体ペレツト、３……
金属細線、４……外部取出しリード、５……封止
樹脂部、６……貫通穴、７……六角ナツト形状凹
部。
ワートランジスタを示すもので、同図ａは上面透
視図、同図ｂは縦断面図である。第２図は、従来
の樹脂封止パワートランジスタを示すもので、同
図ａは上面透視図、同図ｂは縦断面図である。 １……金属板、２……半導体ペレツト、３……
金属細線、４……外部取出しリード、５……封止
樹脂部、６……貫通穴、７……六角ナツト形状凹
部。
Claims (1)
- 半導体ペレツトを固着した金属板と、半導体ペ
レツト電極部を金属細線にて外部リードと結線し
た接続部とを樹脂により被覆した樹脂封止パワー
トランジスタに於いて前記金属板および該樹脂に
は取付穴を有し、該取付穴の外周の前記樹脂に六
角ナツト形状の凹部有することを特徴とする樹脂
封止パワートランジスタ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1100388U JPH01115246U (ja) | 1988-01-28 | 1988-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1100388U JPH01115246U (ja) | 1988-01-28 | 1988-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115246U true JPH01115246U (ja) | 1989-08-03 |
Family
ID=31219172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1100388U Pending JPH01115246U (ja) | 1988-01-28 | 1988-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115246U (ja) |
-
1988
- 1988-01-28 JP JP1100388U patent/JPH01115246U/ja active Pending