JPH01113426A - 二重結合を含む硬化性ポリフェニレンエーテルおよびその製造法 - Google Patents

二重結合を含む硬化性ポリフェニレンエーテルおよびその製造法

Info

Publication number
JPH01113426A
JPH01113426A JP26946087A JP26946087A JPH01113426A JP H01113426 A JPH01113426 A JP H01113426A JP 26946087 A JP26946087 A JP 26946087A JP 26946087 A JP26946087 A JP 26946087A JP H01113426 A JPH01113426 A JP H01113426A
Authority
JP
Japan
Prior art keywords
polyphenylene ether
formula
group
general formula
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26946087A
Other languages
English (en)
Japanese (ja)
Other versions
JPH058933B2 (enrdf_load_stackoverflow
Inventor
Teruo Katayose
照雄 片寄
Hiroharu Oda
弘治 小田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP26946087A priority Critical patent/JPH01113426A/ja
Priority to EP88201949A priority patent/EP0309025B1/en
Priority to DE3853801T priority patent/DE3853801T2/de
Priority to CA000576794A priority patent/CA1336526C/en
Priority to US07/242,234 priority patent/US4923932A/en
Publication of JPH01113426A publication Critical patent/JPH01113426A/ja
Publication of JPH058933B2 publication Critical patent/JPH058933B2/ja
Granted legal-status Critical Current

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  • Polyethers (AREA)
JP26946087A 1987-09-09 1987-10-27 二重結合を含む硬化性ポリフェニレンエーテルおよびその製造法 Granted JPH01113426A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP26946087A JPH01113426A (ja) 1987-10-27 1987-10-27 二重結合を含む硬化性ポリフェニレンエーテルおよびその製造法
EP88201949A EP0309025B1 (en) 1987-09-09 1988-09-08 A cured polyphenylene ether resin and a curable polyphenylene ether resin
DE3853801T DE3853801T2 (de) 1987-09-09 1988-09-08 Ein gehärtetes Polyphenylenetherharz und ein härtbares Polyphenylenetherharz.
CA000576794A CA1336526C (en) 1987-09-09 1988-09-08 Cured polyphenylene ether resin and a curable polyphenylene ether resin
US07/242,234 US4923932A (en) 1987-09-09 1988-09-09 Polyphenylene ether resin comprising chloroform extractable/nonextractable polyphenylene ether resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26946087A JPH01113426A (ja) 1987-10-27 1987-10-27 二重結合を含む硬化性ポリフェニレンエーテルおよびその製造法

Publications (2)

Publication Number Publication Date
JPH01113426A true JPH01113426A (ja) 1989-05-02
JPH058933B2 JPH058933B2 (enrdf_load_stackoverflow) 1993-02-03

Family

ID=17472744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26946087A Granted JPH01113426A (ja) 1987-09-09 1987-10-27 二重結合を含む硬化性ポリフェニレンエーテルおよびその製造法

Country Status (1)

Country Link
JP (1) JPH01113426A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02120357A (ja) * 1988-10-29 1990-05-08 Asahi Chem Ind Co Ltd 硬化ポリフェニレンエーテル樹脂
US5907382A (en) * 1994-12-20 1999-05-25 Kabushiki Kaisha Toshiba Transparent conductive substrate and display apparatus
US6613855B1 (en) 1997-04-09 2003-09-02 Sanyo Chemical Industries, Ltd. Polymerizable resin, and cured resins, insulators, components of electrical appliances, and electrical appliances made by using the same
JP2004067727A (ja) * 2002-08-01 2004-03-04 Mitsubishi Gas Chem Co Inc ビニル化合物およびその硬化物
JP2006312738A (ja) * 2002-01-14 2006-11-16 Air Products & Chemicals Inc ポリ（アリーレンエーテル）ポリマー及びこれを含む組成物
JP2018521210A (ja) * 2015-10-21 2018-08-02 ▲広▼▲東▼生益科技股▲ふん▼有限公司Ｓｈｅｎｇｙｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． ポリフェニレンエーテル樹脂組成物及びそれを適用した高周波回路基板
US20180220530A1 (en) * 2015-10-21 2018-08-02 Shengyi Technology Co., Ltd. Polyphenyl ether resin composition and use thereof in high-frequency circuit substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2014317930B2 (en) 2013-09-06 2018-11-08 Covidien Lp Microwave ablation catheter, handle, and system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3281393A (en) * 1962-12-28 1966-10-25 Borden Co Phenylene oxide polymers substituted with epoxidized alkenyl groups
US3422062A (en) * 1963-11-29 1969-01-14 North American Rockwell Copolymers of alkenyl phenol

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3281393A (en) * 1962-12-28 1966-10-25 Borden Co Phenylene oxide polymers substituted with epoxidized alkenyl groups
US3422062A (en) * 1963-11-29 1969-01-14 North American Rockwell Copolymers of alkenyl phenol

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02120357A (ja) * 1988-10-29 1990-05-08 Asahi Chem Ind Co Ltd 硬化ポリフェニレンエーテル樹脂
US5907382A (en) * 1994-12-20 1999-05-25 Kabushiki Kaisha Toshiba Transparent conductive substrate and display apparatus
US6613855B1 (en) 1997-04-09 2003-09-02 Sanyo Chemical Industries, Ltd. Polymerizable resin, and cured resins, insulators, components of electrical appliances, and electrical appliances made by using the same
JP2006312738A (ja) * 2002-01-14 2006-11-16 Air Products & Chemicals Inc ポリ（アリーレンエーテル）ポリマー及びこれを含む組成物
JP2004067727A (ja) * 2002-08-01 2004-03-04 Mitsubishi Gas Chem Co Inc ビニル化合物およびその硬化物
JP2018521210A (ja) * 2015-10-21 2018-08-02 ▲広▼▲東▼生益科技股▲ふん▼有限公司Ｓｈｅｎｇｙｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． ポリフェニレンエーテル樹脂組成物及びそれを適用した高周波回路基板
US20180220530A1 (en) * 2015-10-21 2018-08-02 Shengyi Technology Co., Ltd. Polyphenyl ether resin composition and use thereof in high-frequency circuit substrate
US10645806B2 (en) * 2015-10-21 2020-05-05 Shengyi Technology Co., Ltd. Polyphenyl ether resin composition and use thereof in high-frequency circuit substrate

Also Published As

Publication number Publication date
JPH058933B2 (enrdf_load_stackoverflow) 1993-02-03

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