JPH01113379U - - Google Patents

Info

Publication number
JPH01113379U
JPH01113379U JP1988008331U JP833188U JPH01113379U JP H01113379 U JPH01113379 U JP H01113379U JP 1988008331 U JP1988008331 U JP 1988008331U JP 833188 U JP833188 U JP 833188U JP H01113379 U JPH01113379 U JP H01113379U
Authority
JP
Japan
Prior art keywords
signal
flexible printed
circuit board
printed circuit
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988008331U
Other languages
English (en)
Other versions
JPH0528784Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988008331U priority Critical patent/JPH0528784Y2/ja
Priority to US07/293,411 priority patent/US5047895A/en
Publication of JPH01113379U publication Critical patent/JPH01113379U/ja
Application granted granted Critical
Publication of JPH0528784Y2 publication Critical patent/JPH0528784Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/052—Branched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案によるフレキシブルプリント基
板の一実施例を示す平面図、第２図は他の実施例
を示す平面図、第３図は従来のフレキシブルプリ
ント基板を示す平面図である。 １，１０，１５：片面フレキシブルプリント基
板（片面フレキ）、１１，１２，１３：導電パタ
ーン、１５ｄ，１５ｅ，１５ｆ，１５ｇ，１５ｈ
：導電パターン、Ａ，Ｂ，Ｃ，Ｄ，Ｅ：電極部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数の信号回路を有すると共に、該各信号回路
    の端部が他の部材と電気的接合を可能としたフレ
    キシブルプリント基板において、該複数の信号回
    路の内で、少なくとも１以上の信号回路の端部を
    少なくとも他の信号回路の端部を迂回させて電気
    的接合部に導くように構成したことを特徴とする
    フレキシブルプリント基板。
JP1988008331U 1988-01-26 1988-01-26 Expired - Lifetime JPH0528784Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988008331U JPH0528784Y2 (ja) 1988-01-26 1988-01-26
US07/293,411 US5047895A (en) 1988-01-26 1989-01-04 Flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988008331U JPH0528784Y2 (ja) 1988-01-26 1988-01-26

Publications (2)

Publication Number Publication Date
JPH01113379U true JPH01113379U (ja) 1989-07-31
JPH0528784Y2 JPH0528784Y2 (ja) 1993-07-23

Family

ID=11690208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988008331U Expired - Lifetime JPH0528784Y2 (ja) 1988-01-26 1988-01-26

Country Status (2)

Country Link
US (1) US5047895A (ja)
JP (1) JPH0528784Y2 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5141455A (en) * 1991-04-08 1992-08-25 Molex Incorporated Mounting of electronic components on substrates
JPH0685341B2 (ja) * 1991-09-27 1994-10-26 帝国通信工業株式会社 フレキシブル基板の端子構造
EP0613591B1 (en) * 1991-11-18 1999-01-20 Berg Electronics Manufacturing B.V. Zero insertion force connector system for a flexible circuit
US5467456A (en) * 1992-06-16 1995-11-14 Ncr Corporation High speed bus branches with compact physical spacing
US5371326A (en) * 1993-08-31 1994-12-06 Clearwaters-Dreager; Cindy Non-toxic fabric conductors and method for making same
JP3262151B2 (ja) * 1994-11-24 2002-03-04 富士写真光機株式会社 フレキシブルプリント基板
JP2606177B2 (ja) * 1995-04-26 1997-04-30 日本電気株式会社 印刷配線板
JPH10261849A (ja) * 1997-03-19 1998-09-29 Fujitsu Ltd フレキシブルプリント基板および接続プリント基板構造
DE19856839C2 (de) * 1998-12-09 2001-07-12 Siemens Ag Anordnung aus Motor-oder Getriebesteuergerät und flexibler Leiterplattenstrukt r
JP2002289961A (ja) * 2001-03-27 2002-10-04 Sumitomo Electric Ind Ltd 光リンクモジュール
US6930888B2 (en) * 2002-11-04 2005-08-16 Intel Corporation Mechanism to cross high-speed differential pairs
JP3976019B2 (ja) * 2004-02-10 2007-09-12 セイコーエプソン株式会社 実装構造体、電気光学装置、および電子機器
KR100744143B1 (ko) * 2006-07-27 2007-08-01 삼성전자주식회사 필름 배선 기판과 이를 이용한 반도체 칩 패키지 및 평판표시 장치
JP5351830B2 (ja) * 2010-05-21 2013-11-27 日東電工株式会社 配線回路基板およびその製造方法
US10847912B2 (en) * 2018-03-19 2020-11-24 Rohde & Schwarz Gmbh & Co. Kg Broadband socket connector, broadband plug connector, and system thereof
DE102019205617A1 (de) * 2019-04-17 2020-10-22 Brose Fahrzeugteile Se & Co. Kommanditgesellschaft, Bamberg Verfahren zur Herstellung eines Trägermoduls und Trägermodul

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56154175U (ja) * 1980-04-15 1981-11-18
JPS5717171U (ja) * 1980-07-02 1982-01-28
JPS6033765U (ja) * 1983-08-15 1985-03-07 株式会社東芝 中継端子装置
JPS61206288A (ja) * 1985-03-08 1986-09-12 松下電器産業株式会社 フレキシブルプリント配線基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3433888A (en) * 1967-01-24 1969-03-18 Electro Mechanisms Inc Dimensionally stable flexible laminate and printed circuits made therefrom
JPS5372936A (en) * 1976-12-10 1978-06-28 Mazda Motor Corp Operation time detector for engine high load carburetor throttle valves
GB2014368B (en) * 1978-02-11 1982-10-06 Nkf Groep Bv Flexible printed-circuit board
JPS6033765B2 (ja) * 1981-12-28 1985-08-05 東洋電化工業株式会社 炭酸カルシウムの製造方法
US4451714A (en) * 1983-02-09 1984-05-29 Eventoff Franklin Neal Spacerless keyboard switch circuit assembly
JPH0339892Y2 (ja) * 1986-04-07 1991-08-22

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56154175U (ja) * 1980-04-15 1981-11-18
JPS5717171U (ja) * 1980-07-02 1982-01-28
JPS6033765U (ja) * 1983-08-15 1985-03-07 株式会社東芝 中継端子装置
JPS61206288A (ja) * 1985-03-08 1986-09-12 松下電器産業株式会社 フレキシブルプリント配線基板

Also Published As

Publication number Publication date
JPH0528784Y2 (ja) 1993-07-23
US5047895A (en) 1991-09-10

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