JPH01105549A - Device for coating of resin - Google Patents
Device for coating of resinInfo
- Publication number
- JPH01105549A JPH01105549A JP26173087A JP26173087A JPH01105549A JP H01105549 A JPH01105549 A JP H01105549A JP 26173087 A JP26173087 A JP 26173087A JP 26173087 A JP26173087 A JP 26173087A JP H01105549 A JPH01105549 A JP H01105549A
- Authority
- JP
- Japan
- Prior art keywords
- absorber
- coating
- polymer resin
- absorbent body
- porous absorbent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 title claims abstract description 31
- 238000000576 coating method Methods 0.000 title claims abstract description 31
- 229920005989 resin Polymers 0.000 title claims abstract description 28
- 239000011347 resin Substances 0.000 title claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000002952 polymeric resin Substances 0.000 claims abstract description 21
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 21
- 230000002745 absorbent Effects 0.000 claims description 15
- 239000002250 absorbent Substances 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011253 protective coating Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- 239000006096 absorbing agent Substances 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、混成集積同号上の半導体チーツブのワイヤボ
イディング保護コーチ、インクに供する樹脂塗布装置に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a wire voiding protection coach for a semiconductor chip on a hybrid integrated circuit, and a resin coating device for applying ink.
（従来の技術）
従来、混成集積回路の保護コートは、第４図（ａ）、
（ｂ）に示すように、基板上の半導体チップマウントボ
ンディング部に樹脂材料をデイスペンサ、または印刷供
給方法で塗布し、乾燥硬化を行っていた。(Prior Art) Conventionally, a protective coat for a hybrid integrated circuit is shown in FIG. 4(a).
As shown in (b), a resin material was applied to the semiconductor chip mount bonding portion on the substrate using a dispenser or a printing supply method, and then dried and hardened.
同図において、（ａ）は断面図、（ｂ）は平面図で。In the figure, (a) is a cross-sectional view, and (b) is a plan view.
１１は硬１ｘ４ｉ！脂材料、１２は基板、１３は半導体
チップ、１−４はワイヤである。11 is hard 1x4i! 12 is a substrate, 13 is a semiconductor chip, and 1-4 is a wire.
゛ 従来この種の樹脂コーティングは、基板との線膨張
係数を一致させるために多孔質の樹脂材料を使用してい
るため、後工程の半田付け、洗浄、外装樹脂コーティン
グ等で、不純物や溶剤が保護コート内に侵入し、耐湿不
良を発生させる欠点があった。゛ Conventionally, this type of resin coating uses a porous resin material to match the coefficient of linear expansion with the substrate, so impurities and solvents are removed during post-process soldering, cleaning, and exterior resin coating. It has the disadvantage of penetrating into the protective coat and causing poor moisture resistance.
この耐湿改善のために、第５図に示すように、保護コー
ト部上に、さらに高分子樹脂皮膜１５をスクリーン印刷
、転写によって塗布していた。In order to improve this moisture resistance, a polymer resin film 15 was further applied on the protective coat portion by screen printing or transfer, as shown in FIG.
（発明が解決しようとする問題点）。(The problem that the invention seeks to solve).
前述のように、従来はスクリーン印刷、転写の方法を用
いて高分子樹脂皮膜のコーティングを行なっていたが、
保護コートが基板面より突出していたり、不定形であっ
たりするため、高分子樹脂皮膜の塗布の塗り残しや、厚
さの不均一が発生し、保護膜の被覆が完全にできず、ま
た作業時間が長い等の欠点があった。As mentioned above, conventionally, screen printing and transfer methods were used to coat polymer resin films, but
Because the protective coat protrudes from the substrate surface or has an irregular shape, the polymer resin film may be left uncoated or the thickness may be uneven, making it impossible to completely coat the protective film, and making work difficult. There were drawbacks such as a long time.
本発明の目的は、従来の欠点を解消し、作業時間を短く
し、樹脂皮膜材料を均一な厚さで塗布できるようにした
樹脂塗布装置を提供することである。 （問題点を解
決するための手段）基板の配線部と半導体チップの電極
とを、ワイヤボンディングで相互接続したのち、硬質の
樹脂材料で保護コートを施された混成集積回路の保護コ
ート部に、さらに高分子樹脂皮膜を重ねてコーティング
する樹脂塗布装置において、筒状ケースの下端開口に多
孔質吸収体を保持し、前記多孔質吸収体上方のケース中
空部に溶融高分子樹脂皮膜材料を保有し、前記多孔質吸
収体を前記保護コート部に押圧してコーティングを施す
ようにするものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a resin coating device that eliminates the conventional drawbacks, shortens the working time, and enables coating of a resin coating material with a uniform thickness. (Means for solving the problem) After interconnecting the wiring part of the board and the electrode of the semiconductor chip by wire bonding, the protective coat part of the hybrid integrated circuit is coated with a hard resin material. Furthermore, in a resin coating device that coats polymer resin films in layers, a porous absorbent body is held in the lower end opening of the cylindrical case, and a molten polymer resin film material is held in the hollow part of the case above the porous absorbent body. , the porous absorbent body is pressed against the protective coating portion to apply the coating.
（作 用）
上記手段により、１回で均一な高分子樹脂材料を均一に
塗布できるか、作業時間を短くすることができる。(Function) By the above means, it is possible to uniformly apply a uniform polymeric resin material in one go, or it is possible to shorten the working time.
（実施例）
本発明の一実施例を第１図ないし第３図に基づいて説明
する。第１図および第２図は本発明の樹脂塗布装置の概
略図である。同図において、１は、樹脂塗布装置の中空
′筒型のケース、２はその下端部に、その下端より突出
し且つ下端開口部を満す如く装着された例えばスポンジ
ゴム等の多孔質吸収体、３はケース１の蓋、４はケース
内に収容された溶融高分子樹脂皮膜材料、５，６は多孔
質吸収体の溶融高分子樹脂皮膜材料を塗布する面積を決
定する２辺の寸法、７，８は溶融高分子樹脂皮膜材料の
塗布量を調整するためのを寸法である。(Example) An example of the present invention will be described based on FIGS. 1 to 3. FIGS. 1 and 2 are schematic diagrams of the resin coating apparatus of the present invention. In the figure, 1 is a hollow cylindrical case of the resin coating device, 2 is a porous absorbent material such as sponge rubber, etc. attached to the lower end of the resin application device so as to protrude from the lower end and fill the lower end opening. 3 is the lid of the case 1; 4 is the molten polymer resin film material housed in the case; 5 and 6 are the dimensions of two sides that determine the area of the porous absorber to which the molten polymer resin film material is applied; 7 , 8 are dimensions for adjusting the coating amount of the molten polymer resin coating material.
第３図は本発明の樹脂塗布装置を用いて、保護コート上
への溶融高分子樹脂皮膜材料を塗布する状態の概略図で
ある。同図において、１はケース、２は多孔質吸収体（
スポンジ）、４は溶融高分子樹脂皮膜材料、９は硬質樹
脂材料であり、１０は基板である。FIG. 3 is a schematic diagram of a state in which a molten polymer resin coating material is applied onto a protective coat using the resin coating apparatus of the present invention. In the figure, 1 is a case, 2 is a porous absorber (
4 is a molten polymer resin coating material, 9 is a hard resin material, and 10 is a substrate.
第３図において、溶融高分子樹脂皮膜材料４は、多孔質
吸収体２に含浸され、多孔質吸収体２の下端表面から滲
み出し、硬質樹脂材料９の表面に一様に塗布される。そ
の際、硬質樹脂材料９は立体状であるから、その側面に
も均一に溶融高分子樹脂皮膜材料４が塗布されるために
は、硬質樹脂材料９の底部面積よりも多孔質吸収体２の
底部面積が広く、多孔質吸収体２の周縁部２ａで、硬質
樹脂材料９の側面を包むように、底部２辺の寸法５゜６
（第１図参照）が選択されなければならない。In FIG. 3, the molten polymer resin coating material 4 is impregnated into the porous absorbent body 2, oozes out from the lower end surface of the porous absorbent body 2, and is uniformly applied to the surface of the hard resin material 9. At this time, since the hard resin material 9 has a three-dimensional shape, in order to uniformly apply the molten polymer resin coating material 4 to the side surfaces thereof, the area of the porous absorbent body 2 must be larger than the bottom area of the hard resin material 9. The bottom area is wide, and the two sides of the bottom have a dimension of 5°6 so that the peripheral edge 2a of the porous absorbent body 2 wraps the sides of the hard resin material 9.
(see Figure 1) must be selected.
また１寸法８（第１図参照）が大きければ、多孔質吸収
体２のケース１の外側に出ている部分が多くなり、溶融
高分子樹脂皮膜材料４が硬質樹脂材料９に塗布される量
が増し皮膜の厚さが厚くなる。Furthermore, if the dimension 8 (see Fig. 1) is large, the portion of the porous absorbent body 2 that protrudes outside the case 1 increases, and the amount of the molten polymer resin coating material 4 applied to the hard resin material 9 increases. increases and the film thickness increases.
何れにしても、溶融高分子樹脂皮膜材料４は。In any case, the molten polymer resin coating material 4.
多孔質吸収体２の下端面から均一に滲み出るから。This is because it oozes out uniformly from the lower end surface of the porous absorbent body 2.
皮膜の厚さが均一となり、多孔質吸収体の下端面の面積
および寸法８を適宜選択することによって、１回の工程
で硬質樹脂材料９の全表面に所望の厚さで均一に樹脂皮
膜材料４を塗布することができ、従ってまた、作業効率
を向上させることができる。The thickness of the film becomes uniform, and by appropriately selecting the area and dimensions 8 of the lower end surface of the porous absorbent body, the resin film material can be uniformly coated with the desired thickness on the entire surface of the hard resin material 9 in one step. 4 can be applied, and thus work efficiency can also be improved.
（発明の効果）
本発明によれば、必要外の部分への塗布、付着を防ぎ、
塗布精度の向上が図られる。(Effects of the Invention) According to the present invention, it is possible to prevent application and adhesion to unnecessary parts,
Coating accuracy can be improved.
また、多孔質吸収体が保護コートの形状に合わせて変形
するため、高分子樹脂材料の塗り残しがなくなり均一塗
布が可能となる。さらに作業時間の短縮化が図られ、そ
の実用上の効果は大である。Furthermore, since the porous absorbent body deforms to match the shape of the protective coat, there is no uncoated portion of the polymeric resin material and uniform coating is possible. Furthermore, the working time can be shortened, which has a great practical effect.
第１図および第２図は本発明の一実施例における樹脂塗
布装置の概略図、第３図は同装置を用いた塗布状態の概
略図、第４図および第５図は従来の樹脂塗布状態を示す
概略図である。
１・・・ケース、２・・・多孔質吸収体、４・・・溶融
高分子樹脂皮膜材料、５，６，７゜８ ・・・多孔、質
吸収体の寸法値、９ ・・・硬質樹脂材料、１０・・・
基板。
第１図
第３図 。
９ｒ＆、買尉脂材村
１ｏ・・ 基板1 and 2 are schematic diagrams of a resin coating device according to an embodiment of the present invention, FIG. 3 is a schematic diagram of a coating state using the same device, and FIGS. 4 and 5 are a conventional resin coating state. FIG. 1... Case, 2... Porous absorber, 4... Molten polymer resin coating material, 5, 6, 7゜8... Dimensions of porous, solid absorber, 9... Hard Resin material, 10...
substrate. Figure 1 Figure 3. 9r &, Buyo Zaimura 1o... Board
Claims (1)
ディングで相互接続したのち、硬質の樹脂材料で保護コ
ートを施された混成集積回路の保護コート部にさらに高
分子樹脂皮膜を重ねてコーティングする樹脂塗布装置に
おいて、筒状ケースの下端開口に多孔質吸収体を保持し
、前記多孔質吸収体上方のケース中空部に溶融高分子樹
脂皮膜材料を保有し、前記多孔質・吸収体を前記保護コ
ート部に押圧してコーティングを施すようにしたことを
特徴とする樹脂塗布装置。After interconnecting the wiring part of the board and the electrodes of the semiconductor chip by wire bonding, the protective coat part of the hybrid integrated circuit is coated with a hard resin material, and then a polymer resin film is further coated on the protective coat part of the hybrid integrated circuit. In the coating device, a porous absorbent body is held in the lower end opening of a cylindrical case, a molten polymer resin coating material is held in the hollow part of the case above the porous absorbent body, and the porous absorbent body is coated with the protective coating. A resin coating device characterized by applying pressure to a portion to apply a coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26173087A JPH01105549A (en) | 1987-10-19 | 1987-10-19 | Device for coating of resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26173087A JPH01105549A (en) | 1987-10-19 | 1987-10-19 | Device for coating of resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01105549A true JPH01105549A (en) | 1989-04-24 |
Family
ID=17365912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26173087A Pending JPH01105549A (en) | 1987-10-19 | 1987-10-19 | Device for coating of resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01105549A (en) |
-
1987
- 1987-10-19 JP JP26173087A patent/JPH01105549A/en active Pending
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