JPH01104742U - - Google Patents

Info

Publication number
JPH01104742U
JPH01104742U JP1988000421U JP42188U JPH01104742U JP H01104742 U JPH01104742 U JP H01104742U JP 1988000421 U JP1988000421 U JP 1988000421U JP 42188 U JP42188 U JP 42188U JP H01104742 U JPH01104742 U JP H01104742U
Authority
JP
Japan
Prior art keywords
chip
lead terminal
resistor
semiconductor device
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988000421U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988000421U priority Critical patent/JPH01104742U/ja
Publication of JPH01104742U publication Critical patent/JPH01104742U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1988000421U 1988-01-06 1988-01-06 Pending JPH01104742U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988000421U JPH01104742U (enExample) 1988-01-06 1988-01-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988000421U JPH01104742U (enExample) 1988-01-06 1988-01-06

Publications (1)

Publication Number Publication Date
JPH01104742U true JPH01104742U (enExample) 1989-07-14

Family

ID=31199432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988000421U Pending JPH01104742U (enExample) 1988-01-06 1988-01-06

Country Status (1)

Country Link
JP (1) JPH01104742U (enExample)

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