JPH01104090U - - Google Patents
Info
- Publication number
- JPH01104090U JPH01104090U JP19837687U JP19837687U JPH01104090U JP H01104090 U JPH01104090 U JP H01104090U JP 19837687 U JP19837687 U JP 19837687U JP 19837687 U JP19837687 U JP 19837687U JP H01104090 U JPH01104090 U JP H01104090U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- case
- substrate member
- metal case
- housed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の構成図で、ａは断
面図、ｂは平面図、第２図は本考案の実施例を分
離した形で示す斜視図、第３図は従来例の構成図
で、ａは正面図、ｂは断面図、ｃは平面図である
。
図において、１は回路モジユール、２は半導体
部品、３は回路基板部品、５，５０は金属ケース
、６，５６は蓋、９は電気回路部品、１０は筐体
、１１は筐体側壁、１２は筐体底板、１５は後面
側放熱板、１６は前面側放熱板、１５Ａ，１６Ａ
は基板部材、１８は放熱片、５１はケース側壁、
５２はケース底板をそれぞれ示す。
Fig. 1 is a configuration diagram of an embodiment of the present invention, in which a is a sectional view, b is a plan view, Fig. 2 is a perspective view showing the embodiment of the present invention in separated form, and Fig. 3 is a diagram of a conventional example. In the configuration diagrams, a is a front view, b is a sectional view, and c is a plan view. In the figure, 1 is a circuit module, 2 is a semiconductor component, 3 is a circuit board component, 5, 50 is a metal case, 6, 56 is a lid, 9 is an electric circuit component, 10 is a housing, 11 is a housing side wall, 12 is the bottom plate of the case, 15 is the rear side heat sink, 16 is the front side heat sink, 15A, 16A
is a board member, 18 is a heat dissipation piece, 51 is a case side wall,
Reference numeral 52 indicates a case bottom plate.
Claims (1)
び回路基板部品よりなる回路モジユール１と、該
金属ケース外に実装する電気回路部品９とを、箱
形の金属筐体１０内に収容する通信機器モジユー
ルにおいて、 基板部材１６Ａの表面に多数の放熱片１８が並
列し、該基板部材１６Ａの裏面を、該金属ケース
５０のケース側壁５１の端面、及び該筐体１０の
開口側の端面に密着させ、該筐体１０の開口面を
覆うように装着する前面側放熱板１６と、 基板部材１５Ａの表面に多数の放熱片１８が並
列し、該基板部材１５Ａの裏面を、該筐体１０の
底板の裏面に密着するように装着する後面側放熱
板１５とを、備えたことを特徴とする通信機器モ
ジユールの放熱構造。[Scope of Claim for Utility Model Registration] A circuit module 1 consisting of a semiconductor component and a circuit board component sealed and housed in a metal case 50 and an electric circuit component 9 mounted outside the metal case are housed in a box-shaped metal case. In the communication equipment module housed in the communication equipment module 10, a large number of heat dissipating pieces 18 are arranged in parallel on the surface of the substrate member 16A, and the back surface of the substrate member 16A is connected to the end surface of the case side wall 51 of the metal case 50 and the case side wall 51 of the case 10. A front heat dissipation plate 16 is attached to the end face of the opening side so as to cover the open face of the housing 10, and a large number of heat dissipation pieces 18 are arranged in parallel on the surface of the substrate member 15A, and the back surface of the substrate member 15A is A heat dissipation structure for a communication equipment module, comprising: a rear heat dissipation plate 15 that is attached in close contact with the back surface of the bottom plate of the housing 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19837687U JPH0611580Y2 (en) | 1987-12-26 | 1987-12-26 | Heat dissipation structure of communication device module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19837687U JPH0611580Y2 (en) | 1987-12-26 | 1987-12-26 | Heat dissipation structure of communication device module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104090U true JPH01104090U (en) | 1989-07-13 |
| JPH0611580Y2 JPH0611580Y2 (en) | 1994-03-23 |
Family
ID=31488890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19837687U Expired - Lifetime JPH0611580Y2 (en) | 1987-12-26 | 1987-12-26 | Heat dissipation structure of communication device module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611580Y2 (en) |
-
1987
- 1987-12-26 JP JP19837687U patent/JPH0611580Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0611580Y2 (en) | 1994-03-23 |
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