JPS6057171U - High frequency section housing structure - Google Patents

High frequency section housing structure

Info

Publication number
JPS6057171U
JPS6057171U JP14770883U JP14770883U JPS6057171U JP S6057171 U JPS6057171 U JP S6057171U JP 14770883 U JP14770883 U JP 14770883U JP 14770883 U JP14770883 U JP 14770883U JP S6057171 U JPS6057171 U JP S6057171U
Authority
JP
Japan
Prior art keywords
frequency section
high frequency
housing structure
section housing
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14770883U
Other languages
Japanese (ja)
Inventor
久光 高木
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP14770883U priority Critical patent/JPS6057171U/en
Publication of JPS6057171U publication Critical patent/JPS6057171U/en
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の高周波部筐体構造を説明するための図、
第２図及び第３図は本考案による高周波部筐体構造を説
明するための図であり、第２図は組立斜視図、第３図は
分解斜視図である。 図面において、１０・・・筐体の本体、１１・・・本体
上面を覆う蓋、１２・・・本体側面を覆う蓋、１３・・
・本体下面の一部を覆う蓋、１４．１５・・・キャリア
、１６・・・絶縁板、１１・・・セラミック基板、１８
・・・回路部品をそれぞれ示す。Figure 1 is a diagram for explaining the conventional high frequency section housing structure.
2 and 3 are diagrams for explaining the structure of the high frequency section housing according to the present invention, with FIG. 2 being an assembled perspective view and FIG. 3 being an exploded perspective view. In the drawings, 10... Main body of the housing, 11... Lid covering the top surface of the main body, 12... Lid covering the side surface of the main body, 13...
・Lid covering part of the bottom surface of the main body, 14.15...Carrier, 16...Insulating plate, 11...Ceramic substrate, 18
...Indicates each circuit component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キャリア上に設けたセラミック基板をアルミニウムダイ
カス′ト製筐体を使用して水平・垂直に実装するととも
に水平部は多段構造としたことを特徴とする高周波部筐
体構造。A high-frequency section housing structure characterized in that a ceramic substrate mounted on a carrier is mounted horizontally and vertically using an aluminum die-cast housing, and the horizontal portion has a multi-stage structure.
JP14770883U 1983-09-26 1983-09-26 High frequency section housing structure Pending JPS6057171U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14770883U JPS6057171U (en) 1983-09-26 1983-09-26 High frequency section housing structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14770883U JPS6057171U (en) 1983-09-26 1983-09-26 High frequency section housing structure

Publications (1)

Publication Number Publication Date
JPS6057171U true JPS6057171U (en) 1985-04-20

Family

ID=30328396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14770883U Pending JPS6057171U (en) 1983-09-26 1983-09-26 High frequency section housing structure

Country Status (1)

Country Link
JP (1) JPS6057171U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01198099A (en) * 1988-02-03 1989-08-09 Toshiba Corp Casing for electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01198099A (en) * 1988-02-03 1989-08-09 Toshiba Corp Casing for electronic equipment

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