JPS6359395U - - Google Patents
Info
- Publication number
- JPS6359395U JPS6359395U JP15260186U JP15260186U JPS6359395U JP S6359395 U JPS6359395 U JP S6359395U JP 15260186 U JP15260186 U JP 15260186U JP 15260186 U JP15260186 U JP 15260186U JP S6359395 U JPS6359395 U JP S6359395U
- Authority
- JP
- Japan
- Prior art keywords
- module
- panel
- case
- heat dissipation
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来構造の断面図である。
１，２１……モジユール、２，２２……内部電
気回路、３，２３……バツクボード、４，２４…
…前面パネル、５，２５……筐体、６，２６……
ベースプレート、７，２７……トツプカバー、８
，２８……側面パネル、９，２９……背面パネル
、１０，３０……前面開口、１１，３１……ガイ
ドプレート、１２……背面開口、１３……空隙、
３２……上部開口、３３……空間。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional structure. 1, 21... Module, 2, 22... Internal electric circuit, 3, 23... Back board, 4, 24...
...Front panel, 5, 25... Housing, 6, 26...
Base plate, 7, 27...Top cover, 8
, 28... Side panel, 9, 29... Back panel, 10, 30... Front opening, 11, 31... Guide plate, 12... Back opening, 13... Gap,
32...Top opening, 33...Space.
Claims (1)
する筐体構造において、前記筐体の背面パネルの
後側に空隙を確保し得るようにベースプレート又
は側面パネルのいずれかを後部に突出形成すると
ともに、この背面パネルには各モジユールに対応
する背面開口を開設し、各モジユールの前面パネ
ルの前面開口からモジユール上部に亘つて設けた
ガイドプレートをこの背面開口に連絡させた構成
としたことを特徴とする筐体の放熱構造。 (2) 筐体の背面パネルは、モジユール後部のバ
ツクボードに可及的に近接されるように配設して
なる実用新案登録請求の範囲第１項記載の筐体の
放熱構造。[Claims for Utility Model Registration] (1) In a case structure in which a plurality of modules are stacked and housed in a case, either the base plate or the side panel is designed so that a space can be secured behind the back panel of the case. At the same time, this rear panel is provided with a rear opening corresponding to each module, and a guide plate provided from the front opening of the front panel of each module to the upper part of the module is connected to this rear opening. The heat dissipation structure of the housing is characterized by having a configuration that is similar to the above. (2) The heat dissipation structure of the casing according to claim 1, wherein the back panel of the casing is arranged as close as possible to the back board at the rear of the module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15260186U JPS6359395U (en) | 1986-10-06 | 1986-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15260186U JPS6359395U (en) | 1986-10-06 | 1986-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6359395U true JPS6359395U (en) | 1988-04-20 |
Family
ID=31070732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15260186U Pending JPS6359395U (en) | 1986-10-06 | 1986-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6359395U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008120339A1 (en) * | 2007-03-29 | 2008-10-09 | Pioneer Corporation | Av device and amplifier |
-
1986
- 1986-10-06 JP JP15260186U patent/JPS6359395U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008120339A1 (en) * | 2007-03-29 | 2008-10-09 | Pioneer Corporation | Av device and amplifier |
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