JP7896358B2 - 圧電膜積層体およびその製造方法 - Google Patents

圧電膜積層体およびその製造方法

Info

Publication number
JP7896358B2
JP7896358B2 JP2022093842A JP2022093842A JP7896358B2 JP 7896358 B2 JP7896358 B2 JP 7896358B2 JP 2022093842 A JP2022093842 A JP 2022093842A JP 2022093842 A JP2022093842 A JP 2022093842A JP 7896358 B2 JP7896358 B2 JP 7896358B2
Authority
JP
Japan
Prior art keywords
film
substrate
scaln
substrate surface
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022093842A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023180486A (ja
JP2023180486A5 (cg-RX-API-DMAC7.html
Inventor
明彦 勅使河原
英雄 山田
竜一郎 阿部
健治 木嶋
哲也 榎本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Toyota Motor Corp
Mirise Technologies Corp
Original Assignee
Denso Corp
Toyota Motor Corp
Mirise Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp, Toyota Motor Corp, Mirise Technologies Corp filed Critical Denso Corp
Priority to JP2022093842A priority Critical patent/JP7896358B2/ja
Priority to CN202310646405.1A priority patent/CN117222301A/zh
Priority to US18/330,988 priority patent/US20230413675A1/en
Publication of JP2023180486A publication Critical patent/JP2023180486A/ja
Publication of JP2023180486A5 publication Critical patent/JP2023180486A5/ja
Priority to JP2026036585A priority patent/JP2026077959A/ja
Application granted granted Critical
Publication of JP7896358B2 publication Critical patent/JP7896358B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Physical Vapour Deposition (AREA)
JP2022093842A 2022-06-09 2022-06-09 圧電膜積層体およびその製造方法 Active JP7896358B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022093842A JP7896358B2 (ja) 2022-06-09 2022-06-09 圧電膜積層体およびその製造方法
CN202310646405.1A CN117222301A (zh) 2022-06-09 2023-06-02 压电膜层叠体及其制造方法
US18/330,988 US20230413675A1 (en) 2022-06-09 2023-06-07 Piezoelectric film laminated body and manufacturing method of the same
JP2026036585A JP2026077959A (ja) 2022-06-09 2026-03-06 圧電膜積層体およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022093842A JP7896358B2 (ja) 2022-06-09 2022-06-09 圧電膜積層体およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2026036585A Division JP2026077959A (ja) 2022-06-09 2026-03-06 圧電膜積層体およびその製造方法

Publications (3)

Publication Number Publication Date
JP2023180486A JP2023180486A (ja) 2023-12-21
JP2023180486A5 JP2023180486A5 (cg-RX-API-DMAC7.html) 2024-08-02
JP7896358B2 true JP7896358B2 (ja) 2026-07-29

Family

ID=89039569

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022093842A Active JP7896358B2 (ja) 2022-06-09 2022-06-09 圧電膜積層体およびその製造方法
JP2026036585A Pending JP2026077959A (ja) 2022-06-09 2026-03-06 圧電膜積層体およびその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2026036585A Pending JP2026077959A (ja) 2022-06-09 2026-03-06 圧電膜積層体およびその製造方法

Country Status (3)

Country Link
US (1) US20230413675A1 (cg-RX-API-DMAC7.html)
JP (2) JP7896358B2 (cg-RX-API-DMAC7.html)
CN (1) CN117222301A (cg-RX-API-DMAC7.html)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004505441A (ja) 2000-07-20 2004-02-19 インフィネオン　テクノロジーズ　アクチエンゲゼルシャフト 音響信号または熱信号と電圧変化とを互いに変換するための層配列を備えた半導体素子、および、その製造方法
JP2005179167A (ja) 2003-06-30 2005-07-07 Kenichiro Miyahara 薄膜形成用基板、薄膜基板及び発光素子
JP2009010926A (ja) 2007-05-31 2009-01-15 National Institute Of Advanced Industrial & Technology 圧電体薄膜、圧電体およびそれらの製造方法、ならびに当該圧電体薄膜を用いた圧電体共振子、アクチュエータ素子および物理センサー
JP2011015148A (ja) 2009-07-01 2011-01-20 National Institute Of Advanced Industrial Science & Technology 圧電体薄膜の製造方法および当該製造方法により製造される圧電体薄膜
JP2013014806A (ja) 2011-07-04 2013-01-24 Denso Corp 結晶軸傾斜膜の製造方法
JP2013191870A (ja) 2006-09-15 2013-09-26 Canon Inc 圧電素子及び液体吐出ヘッド
JP2017043518A (ja) 2015-08-27 2017-03-02 国立研究開発法人物質・材料研究機構 ＳｉＣ繊維を含むハイブリッド複合材料およびその製造方法
WO2017163722A1 (ja) 2016-03-25 2017-09-28 日本碍子株式会社 接合方法
JP2019161634A (ja) 2018-03-07 2019-09-19 住友金属鉱山株式会社 表面弾性波素子用複合基板とその製造方法
JP2020033629A (ja) 2018-08-31 2020-03-05 Tdk株式会社 強誘電性薄膜、強誘電性薄膜素子、圧電アクチュエータ、圧電センサ、ヘッドアセンブリ、ヘッドスタックアセンブリ、ハードディスクドライブ、プリンタヘッド、及びインクジェットプリンタ装置
JP2022075451A (ja) 2020-11-03 2022-05-18 株式会社デンソー 圧電素子、圧電装置、および圧電素子の製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004505441A (ja) 2000-07-20 2004-02-19 インフィネオン　テクノロジーズ　アクチエンゲゼルシャフト 音響信号または熱信号と電圧変化とを互いに変換するための層配列を備えた半導体素子、および、その製造方法
JP2005179167A (ja) 2003-06-30 2005-07-07 Kenichiro Miyahara 薄膜形成用基板、薄膜基板及び発光素子
JP2013191870A (ja) 2006-09-15 2013-09-26 Canon Inc 圧電素子及び液体吐出ヘッド
JP2009010926A (ja) 2007-05-31 2009-01-15 National Institute Of Advanced Industrial & Technology 圧電体薄膜、圧電体およびそれらの製造方法、ならびに当該圧電体薄膜を用いた圧電体共振子、アクチュエータ素子および物理センサー
JP2011015148A (ja) 2009-07-01 2011-01-20 National Institute Of Advanced Industrial Science & Technology 圧電体薄膜の製造方法および当該製造方法により製造される圧電体薄膜
JP2013014806A (ja) 2011-07-04 2013-01-24 Denso Corp 結晶軸傾斜膜の製造方法
JP2017043518A (ja) 2015-08-27 2017-03-02 国立研究開発法人物質・材料研究機構 ＳｉＣ繊維を含むハイブリッド複合材料およびその製造方法
WO2017163722A1 (ja) 2016-03-25 2017-09-28 日本碍子株式会社 接合方法
JP2019161634A (ja) 2018-03-07 2019-09-19 住友金属鉱山株式会社 表面弾性波素子用複合基板とその製造方法
JP2020033629A (ja) 2018-08-31 2020-03-05 Tdk株式会社 強誘電性薄膜、強誘電性薄膜素子、圧電アクチュエータ、圧電センサ、ヘッドアセンブリ、ヘッドスタックアセンブリ、ハードディスクドライブ、プリンタヘッド、及びインクジェットプリンタ装置
JP2022075451A (ja) 2020-11-03 2022-05-18 株式会社デンソー 圧電素子、圧電装置、および圧電素子の製造方法

Also Published As

Publication number Publication date
JP2023180486A (ja) 2023-12-21
JP2026077959A (ja) 2026-05-13
CN117222301A (zh) 2023-12-12
US20230413675A1 (en) 2023-12-21

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240725

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241028

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20250822

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250909

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251107

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260106

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260306

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260616

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260629

R150 Certificate of patent or registration of utility model

Ref document number: 7896358

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150