JP7838636B2 - 感光性樹脂組成物、感光性エレメント、硬化物の製造方法、硬化物パターンの製造方法、及び、配線板の製造方法 - Google Patents

感光性樹脂組成物、感光性エレメント、硬化物の製造方法、硬化物パターンの製造方法、及び、配線板の製造方法

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Publication number
JP7838636B2
JP7838636B2 JP2024510808A JP2024510808A JP7838636B2 JP 7838636 B2 JP7838636 B2 JP 7838636B2 JP 2024510808 A JP2024510808 A JP 2024510808A JP 2024510808 A JP2024510808 A JP 2024510808A JP 7838636 B2 JP7838636 B2 JP 7838636B2
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JP
Japan
Prior art keywords
mass
less
resin composition
component
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024510808A
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English (en)
Japanese (ja)
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JPWO2023188008A1 (https=
Inventor
壮和 粂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2023188008A1 publication Critical patent/JPWO2023188008A1/ja
Priority to JP2025184480A priority Critical patent/JP2026027318A/ja
Application granted granted Critical
Publication of JP7838636B2 publication Critical patent/JP7838636B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2024510808A 2022-03-29 2022-03-29 感光性樹脂組成物、感光性エレメント、硬化物の製造方法、硬化物パターンの製造方法、及び、配線板の製造方法 Active JP7838636B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025184480A JP2026027318A (ja) 2022-03-29 2025-10-31 感光性樹脂組成物、感光性エレメント、硬化物の製造方法、硬化物パターンの製造方法、及び、配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/015570 WO2023188008A1 (ja) 2022-03-29 2022-03-29 感光性樹脂組成物、感光性エレメント、硬化物の製造方法、硬化物パターンの製造方法、及び、配線板の製造方法

Related Child Applications (1)

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JP2025184480A Division JP2026027318A (ja) 2022-03-29 2025-10-31 感光性樹脂組成物、感光性エレメント、硬化物の製造方法、硬化物パターンの製造方法、及び、配線板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023188008A1 JPWO2023188008A1 (https=) 2023-10-05
JP7838636B2 true JP7838636B2 (ja) 2026-04-01

Family

ID=88200035

Family Applications (2)

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JP2024510808A Active JP7838636B2 (ja) 2022-03-29 2022-03-29 感光性樹脂組成物、感光性エレメント、硬化物の製造方法、硬化物パターンの製造方法、及び、配線板の製造方法
JP2025184480A Pending JP2026027318A (ja) 2022-03-29 2025-10-31 感光性樹脂組成物、感光性エレメント、硬化物の製造方法、硬化物パターンの製造方法、及び、配線板の製造方法

Family Applications After (1)

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JP2025184480A Pending JP2026027318A (ja) 2022-03-29 2025-10-31 感光性樹脂組成物、感光性エレメント、硬化物の製造方法、硬化物パターンの製造方法、及び、配線板の製造方法

Country Status (4)

Country Link
JP (2) JP7838636B2 (https=)
KR (1) KR20240160090A (https=)
CN (1) CN118355324A (https=)
WO (1) WO2023188008A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007041497A (ja) 2005-06-28 2007-02-15 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物およびそれを用いた感光性樹脂積層体
JP2014164051A (ja) 2013-02-22 2014-09-08 Asahi Kasei E-Materials Corp 感光性樹脂組成物、感光性樹脂積層体、レジストパターンの製造方法、レジストパターン、及び配線板
JP2015148642A (ja) 2014-02-04 2015-08-20 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
JP2017083553A (ja) 2015-10-26 2017-05-18 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
JP2018013799A (ja) 2013-11-29 2018-01-25 旭化成株式会社 感光性樹脂エレメント

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007101863A (ja) * 2005-10-04 2007-04-19 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2019028398A (ja) 2017-08-03 2019-02-21 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターン付き基板の製造方法、及び、プリント配線板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007041497A (ja) 2005-06-28 2007-02-15 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物およびそれを用いた感光性樹脂積層体
JP2014164051A (ja) 2013-02-22 2014-09-08 Asahi Kasei E-Materials Corp 感光性樹脂組成物、感光性樹脂積層体、レジストパターンの製造方法、レジストパターン、及び配線板
JP2018013799A (ja) 2013-11-29 2018-01-25 旭化成株式会社 感光性樹脂エレメント
JP2015148642A (ja) 2014-02-04 2015-08-20 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
JP2017083553A (ja) 2015-10-26 2017-05-18 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法

Also Published As

Publication number Publication date
KR20240160090A (ko) 2024-11-08
JPWO2023188008A1 (https=) 2023-10-05
CN118355324A (zh) 2024-07-16
JP2026027318A (ja) 2026-02-18
WO2023188008A1 (ja) 2023-10-05

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