JP7825340B2 - 積層硬化性樹脂構造体、ドライフィルム、硬化物および電子部品 - Google Patents

積層硬化性樹脂構造体、ドライフィルム、硬化物および電子部品

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Publication number
JP7825340B2
JP7825340B2 JP2022061168A JP2022061168A JP7825340B2 JP 7825340 B2 JP7825340 B2 JP 7825340B2 JP 2022061168 A JP2022061168 A JP 2022061168A JP 2022061168 A JP2022061168 A JP 2022061168A JP 7825340 B2 JP7825340 B2 JP 7825340B2
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Prior art keywords
layer
alkali
resin
soluble resin
acrylate
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JP2022061168A
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Japanese (ja)
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JP2022159249A5 (enExample
JP2022159249A (ja
Inventor
千穂 植田
大介 柴田
将太郎 種
沙和子 嶋田
文崇 加藤
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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Publication of JP2022159249A publication Critical patent/JP2022159249A/ja
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  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2022061168A 2021-03-31 2022-03-31 積層硬化性樹脂構造体、ドライフィルム、硬化物および電子部品 Active JP7825340B2 (ja)

Applications Claiming Priority (2)

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JP2021062228 2021-03-31
JP2021062228 2021-03-31

Publications (3)

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JP2022159249A JP2022159249A (ja) 2022-10-17
JP2022159249A5 JP2022159249A5 (enExample) 2025-03-10
JP7825340B2 true JP7825340B2 (ja) 2026-03-06

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JP2022061168A Active JP7825340B2 (ja) 2021-03-31 2022-03-31 積層硬化性樹脂構造体、ドライフィルム、硬化物および電子部品

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JP (1) JP7825340B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026094068A (ja) * 2024-11-28 2026-06-09 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008026397A1 (en) 2006-08-31 2008-03-06 Jsr Corporation Radiation-sensitive insulation resin composition, cured article, and electronic device
WO2014045625A1 (ja) 2012-09-20 2014-03-27 積水化学工業株式会社 絶縁樹脂フィルム、予備硬化物、積層体及び多層基板
WO2015190210A1 (ja) 2014-06-12 2015-12-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
WO2020202691A1 (ja) 2019-03-29 2020-10-08 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、および、電子部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008026397A1 (en) 2006-08-31 2008-03-06 Jsr Corporation Radiation-sensitive insulation resin composition, cured article, and electronic device
WO2014045625A1 (ja) 2012-09-20 2014-03-27 積水化学工業株式会社 絶縁樹脂フィルム、予備硬化物、積層体及び多層基板
WO2015190210A1 (ja) 2014-06-12 2015-12-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
WO2020202691A1 (ja) 2019-03-29 2020-10-08 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、および、電子部品

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