JP7820707B2 - ウエハ保持台 - Google Patents

ウエハ保持台

Info

Publication number
JP7820707B2
JP7820707B2 JP2023196135A JP2023196135A JP7820707B2 JP 7820707 B2 JP7820707 B2 JP 7820707B2 JP 2023196135 A JP2023196135 A JP 2023196135A JP 2023196135 A JP2023196135 A JP 2023196135A JP 7820707 B2 JP7820707 B2 JP 7820707B2
Authority
JP
Japan
Prior art keywords
flow path
plate
refrigerant
parallel
flow paths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023196135A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025082655A5 (https=
JP2025082655A (ja
Inventor
亮成 藤井
功一 木村
成伸 先田
桂児 北林
純一 中園
克裕 板倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2023196135A priority Critical patent/JP7820707B2/ja
Publication of JP2025082655A publication Critical patent/JP2025082655A/ja
Publication of JP2025082655A5 publication Critical patent/JP2025082655A5/ja
Application granted granted Critical
Publication of JP7820707B2 publication Critical patent/JP7820707B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023196135A 2023-11-17 2023-11-17 ウエハ保持台 Active JP7820707B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023196135A JP7820707B2 (ja) 2023-11-17 2023-11-17 ウエハ保持台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023196135A JP7820707B2 (ja) 2023-11-17 2023-11-17 ウエハ保持台

Publications (3)

Publication Number Publication Date
JP2025082655A JP2025082655A (ja) 2025-05-29
JP2025082655A5 JP2025082655A5 (https=) 2025-08-04
JP7820707B2 true JP7820707B2 (ja) 2026-02-26

Family

ID=95824829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023196135A Active JP7820707B2 (ja) 2023-11-17 2023-11-17 ウエハ保持台

Country Status (1)

Country Link
JP (1) JP7820707B2 (https=)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282403A (ja) 2002-03-22 2003-10-03 Sumitomo Electric Ind Ltd 半導体製造装置用保持体
JP2005085803A (ja) 2003-09-04 2005-03-31 Shinwa Controls Co Ltd サセプタ
JP2006032701A (ja) 2004-07-16 2006-02-02 Tokyo Seimitsu Co Ltd 温調ステージ
JP2006140455A (ja) 2004-10-07 2006-06-01 Applied Materials Inc 基板の温度を制御する方法及び装置
JP2009272535A (ja) 2008-05-09 2009-11-19 Hitachi High-Technologies Corp プラズマ処理装置及びプラズマ処理方法
JP2013051422A (ja) 2007-07-11 2013-03-14 Semes Co Ltd プレート、これを有する基板温度調節装置及びこれを有する基板処理装置。
WO2013179936A1 (ja) 2012-05-30 2013-12-05 京セラ株式会社 流路部材ならびにこれを用いた吸着装置および冷却装置
JP2020161597A (ja) 2019-03-26 2020-10-01 日本碍子株式会社 ウエハ載置装置
JP2022124270A (ja) 2021-02-15 2022-08-25 日本特殊陶業株式会社 保持部材
JP2022161740A (ja) 2021-04-09 2022-10-21 住友電気工業株式会社 ウエハ保持台
WO2023037698A1 (ja) 2021-09-09 2023-03-16 日本碍子株式会社 ウエハ載置台
JP2023092280A (ja) 2021-12-21 2023-07-03 住友電気工業株式会社 ウエハ保持台
WO2024252555A1 (ja) 2023-06-07 2024-12-12 日本碍子株式会社 ウエハ載置台

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282403A (ja) 2002-03-22 2003-10-03 Sumitomo Electric Ind Ltd 半導体製造装置用保持体
JP2005085803A (ja) 2003-09-04 2005-03-31 Shinwa Controls Co Ltd サセプタ
JP2006032701A (ja) 2004-07-16 2006-02-02 Tokyo Seimitsu Co Ltd 温調ステージ
JP2006140455A (ja) 2004-10-07 2006-06-01 Applied Materials Inc 基板の温度を制御する方法及び装置
JP2013051422A (ja) 2007-07-11 2013-03-14 Semes Co Ltd プレート、これを有する基板温度調節装置及びこれを有する基板処理装置。
JP2009272535A (ja) 2008-05-09 2009-11-19 Hitachi High-Technologies Corp プラズマ処理装置及びプラズマ処理方法
WO2013179936A1 (ja) 2012-05-30 2013-12-05 京セラ株式会社 流路部材ならびにこれを用いた吸着装置および冷却装置
JP2020161597A (ja) 2019-03-26 2020-10-01 日本碍子株式会社 ウエハ載置装置
JP2022124270A (ja) 2021-02-15 2022-08-25 日本特殊陶業株式会社 保持部材
JP2022161740A (ja) 2021-04-09 2022-10-21 住友電気工業株式会社 ウエハ保持台
WO2023037698A1 (ja) 2021-09-09 2023-03-16 日本碍子株式会社 ウエハ載置台
JP2023092280A (ja) 2021-12-21 2023-07-03 住友電気工業株式会社 ウエハ保持台
WO2024252555A1 (ja) 2023-06-07 2024-12-12 日本碍子株式会社 ウエハ載置台

Also Published As

Publication number Publication date
JP2025082655A (ja) 2025-05-29

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