JP7804839B1 - 硬化性樹脂組成物、硬化物及び半導体封止材 - Google Patents

硬化性樹脂組成物、硬化物及び半導体封止材

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Publication number
JP7804839B1
JP7804839B1 JP2025545830A JP2025545830A JP7804839B1 JP 7804839 B1 JP7804839 B1 JP 7804839B1 JP 2025545830 A JP2025545830 A JP 2025545830A JP 2025545830 A JP2025545830 A JP 2025545830A JP 7804839 B1 JP7804839 B1 JP 7804839B1
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Japan
Prior art keywords
resin
resin composition
curable resin
maleimide
mass
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JP2025545830A
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English (en)
Japanese (ja)
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JPWO2025197852A5 (https=
JPWO2025197852A1 (https=
Inventor
篤彦 長谷川
允諭 関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
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Publication date
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Publication of JPWO2025197852A1 publication Critical patent/JPWO2025197852A1/ja
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Publication of JPWO2025197852A5 publication Critical patent/JPWO2025197852A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
JP2025545830A 2024-03-22 2025-03-17 硬化性樹脂組成物、硬化物及び半導体封止材 Active JP7804839B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2024045788 2024-03-22
JP2024045788 2024-03-22
PCT/JP2025/010237 WO2025197852A1 (ja) 2024-03-22 2025-03-17 硬化性樹脂組成物、硬化物及び半導体封止材

Publications (3)

Publication Number Publication Date
JPWO2025197852A1 JPWO2025197852A1 (https=) 2025-09-25
JP7804839B1 true JP7804839B1 (ja) 2026-01-22
JPWO2025197852A5 JPWO2025197852A5 (https=) 2026-02-26

Family

ID=97139809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025545830A Active JP7804839B1 (ja) 2024-03-22 2025-03-17 硬化性樹脂組成物、硬化物及び半導体封止材

Country Status (3)

Country Link
JP (1) JP7804839B1 (https=)
TW (1) TW202603004A (https=)
WO (1) WO2025197852A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014057973A1 (ja) * 2012-10-11 2014-04-17 国立大学法人横浜国立大学 熱硬化性樹脂、及び熱硬化性樹脂組成物
JP2018104683A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 封止成形材料用組成物及び電子部品装置
WO2019078300A1 (ja) * 2017-10-20 2019-04-25 日本化薬株式会社 硬化性樹脂組成物、ワニス、プリプレグ、硬化物、及び、積層板または銅張積層板
JP2020145424A (ja) * 2019-02-28 2020-09-10 京セラ株式会社 炭化ケイ素、酸化ガリウム、窒化ガリウム及びダイヤモンド素子封止用成形材料組成物、並びに電子部品装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014057973A1 (ja) * 2012-10-11 2014-04-17 国立大学法人横浜国立大学 熱硬化性樹脂、及び熱硬化性樹脂組成物
JP2018104683A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 封止成形材料用組成物及び電子部品装置
WO2019078300A1 (ja) * 2017-10-20 2019-04-25 日本化薬株式会社 硬化性樹脂組成物、ワニス、プリプレグ、硬化物、及び、積層板または銅張積層板
JP2020145424A (ja) * 2019-02-28 2020-09-10 京セラ株式会社 炭化ケイ素、酸化ガリウム、窒化ガリウム及びダイヤモンド素子封止用成形材料組成物、並びに電子部品装置

Also Published As

Publication number Publication date
TW202603004A (zh) 2026-01-16
WO2025197852A1 (ja) 2025-09-25
JPWO2025197852A1 (https=) 2025-09-25

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