JPWO2025197852A1 - - Google Patents
Info
- Publication number
- JPWO2025197852A1 JPWO2025197852A1 JP2025545830A JP2025545830A JPWO2025197852A1 JP WO2025197852 A1 JPWO2025197852 A1 JP WO2025197852A1 JP 2025545830 A JP2025545830 A JP 2025545830A JP 2025545830 A JP2025545830 A JP 2025545830A JP WO2025197852 A1 JPWO2025197852 A1 JP WO2025197852A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024045788 | 2024-03-22 | ||
| JP2024045788 | 2024-03-22 | ||
| PCT/JP2025/010237 WO2025197852A1 (ja) | 2024-03-22 | 2025-03-17 | 硬化性樹脂組成物、硬化物及び半導体封止材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025197852A1 true JPWO2025197852A1 (https=) | 2025-09-25 |
| JP7804839B1 JP7804839B1 (ja) | 2026-01-22 |
| JPWO2025197852A5 JPWO2025197852A5 (https=) | 2026-02-26 |
Family
ID=97139809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025545830A Active JP7804839B1 (ja) | 2024-03-22 | 2025-03-17 | 硬化性樹脂組成物、硬化物及び半導体封止材 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7804839B1 (https=) |
| TW (1) | TW202603004A (https=) |
| WO (1) | WO2025197852A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6108561B2 (ja) * | 2012-10-11 | 2017-04-05 | 国立大学法人横浜国立大学 | 熱硬化性樹脂、及び熱硬化性樹脂組成物 |
| JP2018104683A (ja) * | 2016-12-22 | 2018-07-05 | 京セラ株式会社 | 封止成形材料用組成物及び電子部品装置 |
| JP6515255B1 (ja) * | 2017-10-20 | 2019-05-15 | 日本化薬株式会社 | 硬化性樹脂組成物、ワニス、プリプレグ、硬化物、及び、積層板または銅張積層板 |
| CN111621152A (zh) * | 2019-02-28 | 2020-09-04 | 京瓷株式会社 | 元件密封用成型材料组合物及电子部件装置 |
-
2025
- 2025-03-17 WO PCT/JP2025/010237 patent/WO2025197852A1/ja active Pending
- 2025-03-17 JP JP2025545830A patent/JP7804839B1/ja active Active
- 2025-03-21 TW TW114110713A patent/TW202603004A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP7804839B1 (ja) | 2026-01-22 |
| TW202603004A (zh) | 2026-01-16 |
| WO2025197852A1 (ja) | 2025-09-25 |
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