TW202603004A - 硬化性樹脂組成物、硬化物及半導體密封材 - Google Patents

硬化性樹脂組成物、硬化物及半導體密封材

Info

Publication number
TW202603004A
TW202603004A TW114110713A TW114110713A TW202603004A TW 202603004 A TW202603004 A TW 202603004A TW 114110713 A TW114110713 A TW 114110713A TW 114110713 A TW114110713 A TW 114110713A TW 202603004 A TW202603004 A TW 202603004A
Authority
TW
Taiwan
Prior art keywords
resin
resin composition
curing
maleimide
aforementioned
Prior art date
Application number
TW114110713A
Other languages
English (en)
Chinese (zh)
Inventor
長谷川篤彦
関允諭
Original Assignee
日商日本化藥股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本化藥股份有限公司 filed Critical 日商日本化藥股份有限公司
Publication of TW202603004A publication Critical patent/TW202603004A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
TW114110713A 2024-03-22 2025-03-21 硬化性樹脂組成物、硬化物及半導體密封材 TW202603004A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024-045788 2024-03-22
JP2024045788 2024-03-22

Publications (1)

Publication Number Publication Date
TW202603004A true TW202603004A (zh) 2026-01-16

Family

ID=97139809

Family Applications (1)

Application Number Title Priority Date Filing Date
TW114110713A TW202603004A (zh) 2024-03-22 2025-03-21 硬化性樹脂組成物、硬化物及半導體密封材

Country Status (3)

Country Link
JP (1) JP7804839B1 (https=)
TW (1) TW202603004A (https=)
WO (1) WO2025197852A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6108561B2 (ja) * 2012-10-11 2017-04-05 国立大学法人横浜国立大学 熱硬化性樹脂、及び熱硬化性樹脂組成物
JP2018104683A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 封止成形材料用組成物及び電子部品装置
JP6515255B1 (ja) * 2017-10-20 2019-05-15 日本化薬株式会社 硬化性樹脂組成物、ワニス、プリプレグ、硬化物、及び、積層板または銅張積層板
CN111621152A (zh) * 2019-02-28 2020-09-04 京瓷株式会社 元件密封用成型材料组合物及电子部件装置

Also Published As

Publication number Publication date
JP7804839B1 (ja) 2026-01-22
WO2025197852A1 (ja) 2025-09-25
JPWO2025197852A1 (https=) 2025-09-25

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