JP7758216B2 - 伸縮性デバイス - Google Patents

伸縮性デバイス

Info

Publication number
JP7758216B2
JP7758216B2 JP2024549982A JP2024549982A JP7758216B2 JP 7758216 B2 JP7758216 B2 JP 7758216B2 JP 2024549982 A JP2024549982 A JP 2024549982A JP 2024549982 A JP2024549982 A JP 2024549982A JP 7758216 B2 JP7758216 B2 JP 7758216B2
Authority
JP
Japan
Prior art keywords
wiring
substrate
protective layer
stretchable device
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024549982A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024070591A5 (enExample
JPWO2024070591A1 (enExample
Inventor
祐依 中村
俊文 飛鳥井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2024070591A1 publication Critical patent/JPWO2024070591A1/ja
Publication of JPWO2024070591A5 publication Critical patent/JPWO2024070591A5/ja
Application granted granted Critical
Publication of JP7758216B2 publication Critical patent/JP7758216B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2024549982A 2022-09-28 2023-09-08 伸縮性デバイス Active JP7758216B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022155135 2022-09-28
JP2022155135 2022-09-28
PCT/JP2023/032845 WO2024070591A1 (ja) 2022-09-28 2023-09-08 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2024070591A1 JPWO2024070591A1 (enExample) 2024-04-04
JPWO2024070591A5 JPWO2024070591A5 (enExample) 2025-04-17
JP7758216B2 true JP7758216B2 (ja) 2025-10-22

Family

ID=90477429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549982A Active JP7758216B2 (ja) 2022-09-28 2023-09-08 伸縮性デバイス

Country Status (3)

Country Link
US (1) US20250203765A1 (enExample)
JP (1) JP7758216B2 (enExample)
WO (1) WO2024070591A1 (enExample)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008059571A1 (en) 2006-11-15 2008-05-22 Panasonic Corporation Circuit board connection structure and circuit board
JP2013135172A (ja) 2011-12-27 2013-07-08 Sumitomo Electric Printed Circuit Inc プリント配線板及びプリント配線板の接続構造
WO2013105402A1 (ja) 2012-01-13 2013-07-18 東海ゴム工業株式会社 配線体接続構造体
JP2017195230A (ja) 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法
JP2018010967A (ja) 2016-07-13 2018-01-18 日本メクトロン株式会社 フレキシブルプリント配線板及びその製造方法
WO2019093069A1 (ja) 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4955970B2 (ja) * 2005-09-20 2012-06-20 住友電気工業株式会社 フレキシブルプリント配線板およびその製造方法
JP2010129803A (ja) * 2008-11-28 2010-06-10 Nitto Denko Corp 配線回路基板およびその製造方法
US10026721B2 (en) * 2015-06-30 2018-07-17 Apple Inc. Electronic devices with soft input-output components

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008059571A1 (en) 2006-11-15 2008-05-22 Panasonic Corporation Circuit board connection structure and circuit board
JP2013135172A (ja) 2011-12-27 2013-07-08 Sumitomo Electric Printed Circuit Inc プリント配線板及びプリント配線板の接続構造
WO2013105402A1 (ja) 2012-01-13 2013-07-18 東海ゴム工業株式会社 配線体接続構造体
JP2017195230A (ja) 2016-04-18 2017-10-26 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法
JP2018010967A (ja) 2016-07-13 2018-01-18 日本メクトロン株式会社 フレキシブルプリント配線板及びその製造方法
WO2019093069A1 (ja) 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品

Also Published As

Publication number Publication date
JPWO2024070591A1 (enExample) 2024-04-04
WO2024070591A1 (ja) 2024-04-04
US20250203765A1 (en) 2025-06-19

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