JP7733858B1 - Ａｌボンディングワイヤ又はＡｌボンディングリボン - Google Patents

Ａｌボンディングワイヤ又はＡｌボンディングリボン

Info

Publication number
JP7733858B1
JP7733858B1 JP2025537180A JP2025537180A JP7733858B1 JP 7733858 B1 JP7733858 B1 JP 7733858B1 JP 2025537180 A JP2025537180 A JP 2025537180A JP 2025537180 A JP2025537180 A JP 2025537180A JP 7733858 B1 JP7733858 B1 JP 7733858B1
Authority
JP
Japan
Prior art keywords
mass
bonding
ppm
less
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025537180A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025115916A1 (https=
JPWO2025115916A5 (https=
Inventor
智裕 宇野
大造 小田
基稀 江藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2023/042366 external-priority patent/WO2024122380A1/ja
Application filed by Nippon Micrometal Corp, Nippon Steel Chemical and Materials Co Ltd filed Critical Nippon Micrometal Corp
Publication of JPWO2025115916A1 publication Critical patent/JPWO2025115916A1/ja
Application granted granted Critical
Publication of JP7733858B1 publication Critical patent/JP7733858B1/ja
Publication of JPWO2025115916A5 publication Critical patent/JPWO2025115916A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/02—Alloys based on aluminium with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
JP2025537180A 2023-11-27 2024-11-27 Ａｌボンディングワイヤ又はＡｌボンディングリボン Active JP7733858B1 (ja)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
PCT/JP2023/042366 WO2024122380A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JPPCT/JP2023/042373 2023-11-27
JPPCT/JP2023/042369 2023-11-27
PCT/JP2023/042373 WO2024122383A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JPPCT/JP2023/042371 2023-11-27
JPPCT/JP2023/042366 2023-11-27
JPPCT/JP2023/042374 2023-11-27
PCT/JP2023/042369 WO2024122381A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
PCT/JP2023/042371 WO2024122382A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
PCT/JP2023/042374 WO2024122384A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
JPPCT/JP2024/020314 2024-06-04
JPPCT/JP2024/020313 2024-06-04
PCT/JP2024/020314 WO2025115258A1 (ja) 2022-12-05 2024-06-04 Ａｌ接続材
PCT/JP2024/020313 WO2025115257A1 (ja) 2022-12-05 2024-06-04 Ａｌ接続材
PCT/JP2024/042021 WO2025115916A1 (ja) 2023-11-27 2024-11-27 Ａｌボンディングワイヤ又はＡｌボンディングリボン

Publications (3)

Publication Number Publication Date
JPWO2025115916A1 JPWO2025115916A1 (https=) 2025-06-05
JP7733858B1 true JP7733858B1 (ja) 2025-09-03
JPWO2025115916A5 JPWO2025115916A5 (https=) 2025-10-24

Family

ID=95896957

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2025537180A Active JP7733858B1 (ja) 2023-11-27 2024-11-27 Ａｌボンディングワイヤ又はＡｌボンディングリボン
JP2025537182A Active JP7733279B1 (ja) 2023-11-27 2024-11-27 Ａｌボンディングワイヤ又はＡｌボンディングリボン
JP2025537181A Active JP7733278B1 (ja) 2023-11-27 2024-11-27 Ａｌボンディングワイヤ又はＡｌボンディングリボン
JP2025537178A Active JP7742005B1 (ja) 2023-11-27 2024-11-27 Ａｌボンディングワイヤ又はＡｌボンディングリボン
JP2025537179A Active JP7742006B1 (ja) 2023-11-27 2024-11-27 Ａｌボンディングワイヤ又はＡｌボンディングリボン

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2025537182A Active JP7733279B1 (ja) 2023-11-27 2024-11-27 Ａｌボンディングワイヤ又はＡｌボンディングリボン
JP2025537181A Active JP7733278B1 (ja) 2023-11-27 2024-11-27 Ａｌボンディングワイヤ又はＡｌボンディングリボン
JP2025537178A Active JP7742005B1 (ja) 2023-11-27 2024-11-27 Ａｌボンディングワイヤ又はＡｌボンディングリボン
JP2025537179A Active JP7742006B1 (ja) 2023-11-27 2024-11-27 Ａｌボンディングワイヤ又はＡｌボンディングリボン

Country Status (3)

Country Link
JP (5) JP7733858B1 (https=)
TW (5) TW202528554A (https=)
WO (5) WO2025115916A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01255232A (ja) * 1988-04-05 1989-10-12 Kobe Steel Ltd 複合ボンディングワイヤ
WO2020184655A1 (ja) * 2019-03-13 2020-09-17 日鉄マイクロメタル株式会社 Ａｌボンディングワイヤ
WO2022168788A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 Ａｌ配線材
WO2022168787A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 半導体装置用Ａｌボンディングワイヤ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004043020B3 (de) * 2004-09-06 2006-04-27 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Bonddraht und Bondverbindung
JP2010140993A (ja) * 2008-12-10 2010-06-24 Fuji Electric Systems Co Ltd 半導体装置およびその製造方法
CN110205511A (zh) * 2019-06-28 2019-09-06 江西理工大学 一种高强Al-Si合金焊丝及其制备方法
CN110656263A (zh) * 2019-11-06 2020-01-07 中国科学院金属研究所 含微量La元素的高性能Al-Si系焊丝合金及其制备方法
EP4289986A4 (en) * 2021-02-05 2025-01-15 Nippon Micrometal Corporation AL-BOND WIRE FOR SEMICONDUCTOR COMPONENTS

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01255232A (ja) * 1988-04-05 1989-10-12 Kobe Steel Ltd 複合ボンディングワイヤ
WO2020184655A1 (ja) * 2019-03-13 2020-09-17 日鉄マイクロメタル株式会社 Ａｌボンディングワイヤ
WO2022168788A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 Ａｌ配線材
WO2022168787A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 半導体装置用Ａｌボンディングワイヤ

Also Published As

Publication number Publication date
JPWO2025115916A1 (https=) 2025-06-05
TW202528553A (zh) 2025-07-16
JP7733278B1 (ja) 2025-09-02
JPWO2025115915A1 (https=) 2025-06-05
JPWO2025115917A1 (https=) 2025-06-05
WO2025115916A1 (ja) 2025-06-05
WO2025115915A1 (ja) 2025-06-05
TW202528554A (zh) 2025-07-16
TW202528555A (zh) 2025-07-16
JP7733279B1 (ja) 2025-09-02
WO2025115913A1 (ja) 2025-06-05
JPWO2025115914A1 (https=) 2025-06-05
TW202531556A (zh) 2025-08-01
WO2025115917A1 (ja) 2025-06-05
TW202538068A (zh) 2025-10-01
WO2025115914A1 (ja) 2025-06-05
JP7742006B1 (ja) 2025-09-18
JP7742005B1 (ja) 2025-09-18
JPWO2025115913A1 (https=) 2025-06-05

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