TW202528554A - 鋁接合線或鋁接合帶 - Google Patents

鋁接合線或鋁接合帶

Info

Publication number
TW202528554A
TW202528554A TW113145852A TW113145852A TW202528554A TW 202528554 A TW202528554 A TW 202528554A TW 113145852 A TW113145852 A TW 113145852A TW 113145852 A TW113145852 A TW 113145852A TW 202528554 A TW202528554 A TW 202528554A
Authority
TW
Taiwan
Prior art keywords
aluminum
less
aluminum bonding
mass ppm
silicon
Prior art date
Application number
TW113145852A
Other languages
English (en)
Chinese (zh)
Inventor
宇野智裕
須藤裕弥
小田大造
江藤基稀
小澤憲弘
Original Assignee
日商日鐵化學材料股份有限公司
日商日鐵新材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2023/042366 external-priority patent/WO2024122380A1/ja
Application filed by 日商日鐵化學材料股份有限公司, 日商日鐵新材料股份有限公司 filed Critical 日商日鐵化學材料股份有限公司
Publication of TW202528554A publication Critical patent/TW202528554A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/02—Alloys based on aluminium with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
TW113145852A 2023-11-27 2024-11-27 鋁接合線或鋁接合帶 TW202528554A (zh)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
PCT/JP2023/042366 WO2024122380A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
PCT/JP2023/042373 WO2024122383A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
WOPCT/JP2023/042373 2023-11-27
WOPCT/JP2023/042366 2023-11-27
PCT/JP2023/042369 WO2024122381A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
PCT/JP2023/042371 WO2024122382A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
WOPCT/JP2023/042371 2023-11-27
WOPCT/JP2023/042369 2023-11-27
WOPCT/JP2023/042374 2023-11-27
PCT/JP2023/042374 WO2024122384A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
PCT/JP2024/020314 WO2025115258A1 (ja) 2022-12-05 2024-06-04 Ａｌ接続材
WOPCT/JP2024/020313 2024-06-04
WOPCT/JP2024/020314 2024-06-04
PCT/JP2024/020313 WO2025115257A1 (ja) 2022-12-05 2024-06-04 Ａｌ接続材

Publications (1)

Publication Number Publication Date
TW202528554A true TW202528554A (zh) 2025-07-16

Family

ID=95896957

Family Applications (5)

Application Number Title Priority Date Filing Date
TW113145852A TW202528554A (zh) 2023-11-27 2024-11-27 鋁接合線或鋁接合帶
TW113145851A TW202538068A (zh) 2023-11-27 2024-11-27 鋁接合線或鋁接合帶
TW113145855A TW202528555A (zh) 2023-11-27 2024-11-27 鋁接合線或鋁接合帶
TW113145854A TW202531556A (zh) 2023-11-27 2024-11-27 鋁接合線或鋁接合帶
TW113145850A TW202528553A (zh) 2023-11-27 2024-11-27 鋁接合線或鋁接合帶

Family Applications After (4)

Application Number Title Priority Date Filing Date
TW113145851A TW202538068A (zh) 2023-11-27 2024-11-27 鋁接合線或鋁接合帶
TW113145855A TW202528555A (zh) 2023-11-27 2024-11-27 鋁接合線或鋁接合帶
TW113145854A TW202531556A (zh) 2023-11-27 2024-11-27 鋁接合線或鋁接合帶
TW113145850A TW202528553A (zh) 2023-11-27 2024-11-27 鋁接合線或鋁接合帶

Country Status (3)

Country Link
JP (5) JP7733858B1 (https=)
TW (5) TW202528554A (https=)
WO (5) WO2025115916A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01255232A (ja) * 1988-04-05 1989-10-12 Kobe Steel Ltd 複合ボンディングワイヤ
DE102004043020B3 (de) * 2004-09-06 2006-04-27 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Bonddraht und Bondverbindung
JP2010140993A (ja) * 2008-12-10 2010-06-24 Fuji Electric Systems Co Ltd 半導体装置およびその製造方法
KR102801396B1 (ko) * 2019-03-13 2025-04-30 닛데쓰마이크로메탈가부시키가이샤 Al 본딩 와이어
CN110205511A (zh) * 2019-06-28 2019-09-06 江西理工大学 一种高强Al-Si合金焊丝及其制备方法
CN110656263A (zh) * 2019-11-06 2020-01-07 中国科学院金属研究所 含微量La元素的高性能Al-Si系焊丝合金及其制备方法
JP7784390B2 (ja) * 2021-02-05 2025-12-11 日鉄マイクロメタル株式会社 半導体装置用Ａｌボンディングワイヤ
EP4289986A4 (en) * 2021-02-05 2025-01-15 Nippon Micrometal Corporation AL-BOND WIRE FOR SEMICONDUCTOR COMPONENTS
WO2022168788A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 Ａｌ配線材

Also Published As

Publication number Publication date
JPWO2025115916A1 (https=) 2025-06-05
TW202528553A (zh) 2025-07-16
JP7733858B1 (ja) 2025-09-03
JP7733278B1 (ja) 2025-09-02
JPWO2025115915A1 (https=) 2025-06-05
JPWO2025115917A1 (https=) 2025-06-05
WO2025115916A1 (ja) 2025-06-05
WO2025115915A1 (ja) 2025-06-05
TW202528555A (zh) 2025-07-16
JP7733279B1 (ja) 2025-09-02
WO2025115913A1 (ja) 2025-06-05
JPWO2025115914A1 (https=) 2025-06-05
TW202531556A (zh) 2025-08-01
WO2025115917A1 (ja) 2025-06-05
TW202538068A (zh) 2025-10-01
WO2025115914A1 (ja) 2025-06-05
JP7742006B1 (ja) 2025-09-18
JP7742005B1 (ja) 2025-09-18
JPWO2025115913A1 (https=) 2025-06-05

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