JPWO2025115915A1 - - Google Patents

Info

Publication number
JPWO2025115915A1
JPWO2025115915A1 JP2025537181A JP2025537181A JPWO2025115915A1 JP WO2025115915 A1 JPWO2025115915 A1 JP WO2025115915A1 JP 2025537181 A JP2025537181 A JP 2025537181A JP 2025537181 A JP2025537181 A JP 2025537181A JP WO2025115915 A1 JPWO2025115915 A1 JP WO2025115915A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025537181A
Other languages
Japanese (ja)
Other versions
JP7733278B1 (ja
JPWO2025115915A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2023/042366 external-priority patent/WO2024122380A1/ja
Application filed filed Critical
Publication of JPWO2025115915A1 publication Critical patent/JPWO2025115915A1/ja
Application granted granted Critical
Publication of JP7733278B1 publication Critical patent/JP7733278B1/ja
Publication of JPWO2025115915A5 publication Critical patent/JPWO2025115915A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C21/00Alloys based on aluminium
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C21/00Alloys based on aluminium
    • C22C21/02Alloys based on aluminium with silicon as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/043Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
JP2025537181A 2023-11-27 2024-11-27 Alボンディングワイヤ又はAlボンディングリボン Active JP7733278B1 (ja)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
PCT/JP2023/042366 WO2024122380A1 (ja) 2022-12-05 2023-11-27 Al接続材
JPPCT/JP2023/042373 2023-11-27
JPPCT/JP2023/042369 2023-11-27
PCT/JP2023/042373 WO2024122383A1 (ja) 2022-12-05 2023-11-27 Al接続材
JPPCT/JP2023/042371 2023-11-27
JPPCT/JP2023/042366 2023-11-27
JPPCT/JP2023/042374 2023-11-27
PCT/JP2023/042369 WO2024122381A1 (ja) 2022-12-05 2023-11-27 Al接続材
PCT/JP2023/042371 WO2024122382A1 (ja) 2022-12-05 2023-11-27 Al接続材
PCT/JP2023/042374 WO2024122384A1 (ja) 2022-12-05 2023-11-27 Al接続材
JPPCT/JP2024/020314 2024-06-04
JPPCT/JP2024/020313 2024-06-04
PCT/JP2024/020314 WO2025115258A1 (ja) 2022-12-05 2024-06-04 Al接続材
PCT/JP2024/020313 WO2025115257A1 (ja) 2022-12-05 2024-06-04 Al接続材
PCT/JP2024/042020 WO2025115915A1 (ja) 2023-11-27 2024-11-27 Alボンディングワイヤ又はAlボンディングリボン

Publications (3)

Publication Number Publication Date
JPWO2025115915A1 true JPWO2025115915A1 (https=) 2025-06-05
JP7733278B1 JP7733278B1 (ja) 2025-09-02
JPWO2025115915A5 JPWO2025115915A5 (https=) 2025-10-24

Family

ID=95896957

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2025537180A Active JP7733858B1 (ja) 2023-11-27 2024-11-27 Alボンディングワイヤ又はAlボンディングリボン
JP2025537182A Active JP7733279B1 (ja) 2023-11-27 2024-11-27 Alボンディングワイヤ又はAlボンディングリボン
JP2025537181A Active JP7733278B1 (ja) 2023-11-27 2024-11-27 Alボンディングワイヤ又はAlボンディングリボン
JP2025537178A Active JP7742005B1 (ja) 2023-11-27 2024-11-27 Alボンディングワイヤ又はAlボンディングリボン
JP2025537179A Active JP7742006B1 (ja) 2023-11-27 2024-11-27 Alボンディングワイヤ又はAlボンディングリボン

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP2025537180A Active JP7733858B1 (ja) 2023-11-27 2024-11-27 Alボンディングワイヤ又はAlボンディングリボン
JP2025537182A Active JP7733279B1 (ja) 2023-11-27 2024-11-27 Alボンディングワイヤ又はAlボンディングリボン

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2025537178A Active JP7742005B1 (ja) 2023-11-27 2024-11-27 Alボンディングワイヤ又はAlボンディングリボン
JP2025537179A Active JP7742006B1 (ja) 2023-11-27 2024-11-27 Alボンディングワイヤ又はAlボンディングリボン

Country Status (3)

Country Link
JP (5) JP7733858B1 (https=)
TW (5) TW202528554A (https=)
WO (5) WO2025115916A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01255232A (ja) * 1988-04-05 1989-10-12 Kobe Steel Ltd 複合ボンディングワイヤ
DE102004043020B3 (de) * 2004-09-06 2006-04-27 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Bonddraht und Bondverbindung
JP2010140993A (ja) * 2008-12-10 2010-06-24 Fuji Electric Systems Co Ltd 半導体装置およびその製造方法
KR102801396B1 (ko) * 2019-03-13 2025-04-30 닛데쓰마이크로메탈가부시키가이샤 Al 본딩 와이어
CN110205511A (zh) * 2019-06-28 2019-09-06 江西理工大学 一种高强Al-Si合金焊丝及其制备方法
CN110656263A (zh) * 2019-11-06 2020-01-07 中国科学院金属研究所 含微量La元素的高性能Al-Si系焊丝合金及其制备方法
JP7784390B2 (ja) * 2021-02-05 2025-12-11 日鉄マイクロメタル株式会社 半導体装置用Alボンディングワイヤ
EP4289986A4 (en) * 2021-02-05 2025-01-15 Nippon Micrometal Corporation AL-BOND WIRE FOR SEMICONDUCTOR COMPONENTS
WO2022168788A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 Al配線材

Also Published As

Publication number Publication date
JPWO2025115916A1 (https=) 2025-06-05
TW202528553A (zh) 2025-07-16
JP7733858B1 (ja) 2025-09-03
JP7733278B1 (ja) 2025-09-02
JPWO2025115917A1 (https=) 2025-06-05
WO2025115916A1 (ja) 2025-06-05
WO2025115915A1 (ja) 2025-06-05
TW202528554A (zh) 2025-07-16
TW202528555A (zh) 2025-07-16
JP7733279B1 (ja) 2025-09-02
WO2025115913A1 (ja) 2025-06-05
JPWO2025115914A1 (https=) 2025-06-05
TW202531556A (zh) 2025-08-01
WO2025115917A1 (ja) 2025-06-05
TW202538068A (zh) 2025-10-01
WO2025115914A1 (ja) 2025-06-05
JP7742006B1 (ja) 2025-09-18
JP7742005B1 (ja) 2025-09-18
JPWO2025115913A1 (https=) 2025-06-05

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