JPWO2025115915A5 - - Google Patents
Info
- Publication number
- JPWO2025115915A5 JPWO2025115915A5 JP2025537181A JP2025537181A JPWO2025115915A5 JP WO2025115915 A5 JPWO2025115915 A5 JP WO2025115915A5 JP 2025537181 A JP2025537181 A JP 2025537181A JP 2025537181 A JP2025537181 A JP 2025537181A JP WO2025115915 A5 JPWO2025115915 A5 JP WO2025115915A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- less
- bonding wire
- ribbon according
- equivalent diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/042366 WO2024122380A1 (ja) | 2022-12-05 | 2023-11-27 | Ａｌ接続材 |
| JPPCT/JP2023/042373 | 2023-11-27 | ||
| JPPCT/JP2023/042369 | 2023-11-27 | ||
| PCT/JP2023/042373 WO2024122383A1 (ja) | 2022-12-05 | 2023-11-27 | Ａｌ接続材 |
| JPPCT/JP2023/042371 | 2023-11-27 | ||
| JPPCT/JP2023/042366 | 2023-11-27 | ||
| JPPCT/JP2023/042374 | 2023-11-27 | ||
| PCT/JP2023/042369 WO2024122381A1 (ja) | 2022-12-05 | 2023-11-27 | Ａｌ接続材 |
| PCT/JP2023/042371 WO2024122382A1 (ja) | 2022-12-05 | 2023-11-27 | Ａｌ接続材 |
| PCT/JP2023/042374 WO2024122384A1 (ja) | 2022-12-05 | 2023-11-27 | Ａｌ接続材 |
| JPPCT/JP2024/020314 | 2024-06-04 | ||
| JPPCT/JP2024/020313 | 2024-06-04 | ||
| PCT/JP2024/020314 WO2025115258A1 (ja) | 2022-12-05 | 2024-06-04 | Ａｌ接続材 |
| PCT/JP2024/020313 WO2025115257A1 (ja) | 2022-12-05 | 2024-06-04 | Ａｌ接続材 |
| PCT/JP2024/042020 WO2025115915A1 (ja) | 2023-11-27 | 2024-11-27 | Ａｌボンディングワイヤ又はＡｌボンディングリボン |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025115915A1 JPWO2025115915A1 (https=) | 2025-06-05 |
| JP7733278B1 JP7733278B1 (ja) | 2025-09-02 |
| JPWO2025115915A5 true JPWO2025115915A5 (https=) | 2025-10-24 |
Family
ID=95896957
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025537180A Active JP7733858B1 (ja) | 2023-11-27 | 2024-11-27 | Ａｌボンディングワイヤ又はＡｌボンディングリボン |
| JP2025537182A Active JP7733279B1 (ja) | 2023-11-27 | 2024-11-27 | Ａｌボンディングワイヤ又はＡｌボンディングリボン |
| JP2025537181A Active JP7733278B1 (ja) | 2023-11-27 | 2024-11-27 | Ａｌボンディングワイヤ又はＡｌボンディングリボン |
| JP2025537178A Active JP7742005B1 (ja) | 2023-11-27 | 2024-11-27 | Ａｌボンディングワイヤ又はＡｌボンディングリボン |
| JP2025537179A Active JP7742006B1 (ja) | 2023-11-27 | 2024-11-27 | Ａｌボンディングワイヤ又はＡｌボンディングリボン |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025537180A Active JP7733858B1 (ja) | 2023-11-27 | 2024-11-27 | Ａｌボンディングワイヤ又はＡｌボンディングリボン |
| JP2025537182A Active JP7733279B1 (ja) | 2023-11-27 | 2024-11-27 | Ａｌボンディングワイヤ又はＡｌボンディングリボン |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025537178A Active JP7742005B1 (ja) | 2023-11-27 | 2024-11-27 | Ａｌボンディングワイヤ又はＡｌボンディングリボン |
| JP2025537179A Active JP7742006B1 (ja) | 2023-11-27 | 2024-11-27 | Ａｌボンディングワイヤ又はＡｌボンディングリボン |
Country Status (3)
| Country | Link |
|---|---|
| JP (5) | JP7733858B1 (https=) |
| TW (5) | TW202528554A (https=) |
| WO (5) | WO2025115916A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01255232A (ja) * | 1988-04-05 | 1989-10-12 | Kobe Steel Ltd | 複合ボンディングワイヤ |
| DE102004043020B3 (de) * | 2004-09-06 | 2006-04-27 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Bonddraht und Bondverbindung |
| JP2010140993A (ja) * | 2008-12-10 | 2010-06-24 | Fuji Electric Systems Co Ltd | 半導体装置およびその製造方法 |
| KR102801396B1 (ko) * | 2019-03-13 | 2025-04-30 | 닛데쓰마이크로메탈가부시키가이샤 | Al 본딩 와이어 |
| CN110205511A (zh) * | 2019-06-28 | 2019-09-06 | 江西理工大学 | 一种高强Al-Si合金焊丝及其制备方法 |
| CN110656263A (zh) * | 2019-11-06 | 2020-01-07 | 中国科学院金属研究所 | 含微量La元素的高性能Al-Si系焊丝合金及其制备方法 |
| JP7784390B2 (ja) * | 2021-02-05 | 2025-12-11 | 日鉄マイクロメタル株式会社 | 半導体装置用Ａｌボンディングワイヤ |
| EP4289986A4 (en) * | 2021-02-05 | 2025-01-15 | Nippon Micrometal Corporation | AL-BOND WIRE FOR SEMICONDUCTOR COMPONENTS |
| WO2022168788A1 (ja) * | 2021-02-05 | 2022-08-11 | 日鉄マイクロメタル株式会社 | Ａｌ配線材 |
-
2024
- 2024-11-27 WO PCT/JP2024/042021 patent/WO2025115916A1/ja active Pending
- 2024-11-27 WO PCT/JP2024/042020 patent/WO2025115915A1/ja active Pending
- 2024-11-27 WO PCT/JP2024/042022 patent/WO2025115917A1/ja active Pending
- 2024-11-27 WO PCT/JP2024/042019 patent/WO2025115914A1/ja active Pending
- 2024-11-27 JP JP2025537180A patent/JP7733858B1/ja active Active
- 2024-11-27 TW TW113145852A patent/TW202528554A/zh unknown
- 2024-11-27 JP JP2025537182A patent/JP7733279B1/ja active Active
- 2024-11-27 JP JP2025537181A patent/JP7733278B1/ja active Active
- 2024-11-27 TW TW113145851A patent/TW202538068A/zh unknown
- 2024-11-27 TW TW113145855A patent/TW202528555A/zh unknown
- 2024-11-27 WO PCT/JP2024/042018 patent/WO2025115913A1/ja active Pending
- 2024-11-27 JP JP2025537178A patent/JP7742005B1/ja active Active
- 2024-11-27 TW TW113145854A patent/TW202531556A/zh unknown
- 2024-11-27 TW TW113145850A patent/TW202528553A/zh unknown
- 2024-11-27 JP JP2025537179A patent/JP7742006B1/ja active Active
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